440 results about "Pass gate" patented technology

When reading a memory cell on a NAND string, the word lines for the memory cells not being read will receive a voltage so that those memory cells operate as pass gates. Over time, if there are a lot of read operations without any program operations, the cells not being read may suffer from Read Disturb because the voltage applied to the word lines may cause electrons to accumulate in the floating gates of the non-selected cells. The accumulation of charge in the floating gates raises the threshold voltage. To avoid the limitations of Read Disturb, only one word line of a block (or other grouping) is used to program and read data. In a system using NAND flash memory, the word line being read is not typically subjected to read disturb. Thus, a NAND flash memory that restricts programming and reading to one word line of a block is not likely to exhibit read disturb in that block.

In accordance with an embodiment of the present invention, a static random access memory (SRAM) cell comprises a first pull-down transistor, a first pull-up transistor, a first pass-gate transistor, a second pull-down transistor, a second pull-up transistor, a second pass-gate transistor, a first linear intra-cell connection, and a second linear intra-cell connection. Active areas of the transistors are disposed in a substrate, and longitudinal axes of the active areas of the transistors are all parallel. The first linear intra-cell connection electrically couples the active area of the first pull-down transistor, the active area of the first pull-up transistor, and the active area of the first pass-gate transistor to a gate electrode of the second pull-down transistor and a gate electrode of the second pull-up transistor. The second linear intra-cell connection electrically couples the active area of the second pull-down transistor, the active area of the second pull-up transistor, and the active area of the second pass-gate transistor to a gate electrode of the first pull-down transistor and a gate electrode of the first pull-up transistor.

An integrated circuit including a DRAM is disclosed, wherein the DRAM includes a memory array including a plurality of pass gate transistors and a plurality of memory elements. The pass gate transistors include a gate material selected to provide a substantially near mid-gap work function or greater. The DRAM also includes a peripheral area including a plurality of logic transistors. In a preferred embodiment the pass gate transistors are silicon-on-insulator transistors.

A six transistor static random access memory (SRAM) cell with thin-film pull-up transistors and method of making the same includes providing two bulk silicon pull-down transistors of a first conductivity type, two active gated pull-up thin-film transistors (TFTs) of a second conductivity type, two pass gates, a common word line, and two bit line contacts. The bulk silicon pull-down transistors, two active gated pull-up TFTs, and two pass gates are connected at four shared contacts. In addition, the two bulk silicon pull-down transistors and the two active gated pull-up TFTs are formed with two polysilicon layers, a first of the polysilicon layers (poly1) is salicided and includes poly1 gate electrodes for the two bulk silicon pull-down transistors. A second of the polysilicon layers (poly2) includes desired poly2 stringers disposed along side edges of the poly1 gate electrodes, the desired poly2 stringers forming respective channel regions of the pull-up TFTs.

A high-frequency switch circuit having an MOS pass gate or transfer transistor. The switch circuit of the invention includes a first impedance element coupled to the gate of the transfer transistor and, preferably, an alternative second impedance element coupled to the bulk of the transfer transistor. One or both of the impedance elements substantially negates the low-parasitic shunt capacitance associated with the transfer transistor that controls signal attenuation under high frequency operation. The impedance element is coupled in series with that parasitic capacitance to increase substantially the impedance of that pathway, thereby increasing substantially the passable bandwidth. The impedance element may simply be a resistor. The switch circuit is suitable for use in an array of applications, including signal propagation in computing systems, routers, and flat panel screen displays.

A method of forming an SRAM cell device includes the following steps. Form pass gate FET transistors and form a pair of vertical pull-down FET transistors with a first common body and a first common source in a silicon layer patterned into parallel islands formed on a planar insulator. Etch down through upper diffusions between cross-coupled inverter FET transistors to form pull-down isolation spaces bisecting the upper strata of pull-up and pull-down drain regions of the pair of vertical pull-down FET transistors, with the isolation spaces reaching down to the common body strata. Form a pair of vertical pull-up FET transistors with a second common body and a second common drain. Then, connect the FET transistors to form an SRAM cell.

An SRAM device includes a memory cell. The memory cell includes a first cross-coupled inverter and a second cross-coupled inverter, which is electrically connected to the first cross-coupled inverter. Each inverter includes a pull down device and a pull up device. The pull up device is electrically connected to the pull down device. A channel width ratio of the pull up device to the pull down device is preferably within a range of about 1.5 to about 0.8. A channel area ratio of the pull up device to the pull down device is preferably within a range of about 3 to about 1. A pass gate device is electrically connected to the pull down device. A channel width ratio of the pull up device to the pass gate device is preferably within a range of about 3.0 to about 1.2.