35results about How to "Compact and economical" patented technology

The present invention describes the use of two semiconductor layers, a thin film (TF) layer and a bulk Si wafer layer, to make high density and high speed merged logic and memory IC chips. The memory cells use three-dimensional (3D) SRAM structures. Two kinds of 3D logic cells are disclosed. 3D form of the differential cascode voltage switch (DCVS) architecture, and a 3D form of the DCVS with pass gate (DCVSPG) logic architecture. A high density "system on chip" architecture is described. The high density is achieved by locating large PMOS transistors in the TF Si layer, and the fast NMOS transistors in a bulk Si wafer layer. A single process sequence to simultaneously make the logic and memory circuits on the IC chip is also described.

A currency evaluation device for receiving a stack of U.S. currency bills and rapidly evaluating all the bills in the stack comprises an input receptacle adapted to receive a stack of U.S. currency bills of a plurality of denominations to be evaluated. According to one embodiment, a transport mechanism transports the bills, one at a time, from the input receptacle along a transport path at a rate of at least about 800 bills per minute. A denomination discriminating unit which includes a detector positioned along the transport path evaluates the bills. The device comprises a single denominated bill output receptacle positioned to receive bills whose denomination have been determined by the discriminating unit including bills of a plurality of denominations. A separate stacker bin is provided and a diverter positioned along the transport path routes bills whose denomination cannot be determined to the separate stacker bin.

A horizontal articulated robot has a plurality of horizontal arms coupled by joint shafts, and a working shaft disposed at the extreme end of an extreme end arm among the horizontal arms has mounting portions of an end effector formed to both the upper and lower ends thereof. With this arrangement, there can be provided a horizontal articulated robot that can cope with various work transport forms and various types of works by one type of a robot by selectively using the upper and lower sides of a working shaft.

A cartridge having at least one layer containing sodium zirconium phosphate and at least one layer containing a combination of acid zirconium phosphate and alkaline hydrous zirconium oxide is described. Methods of using the cartridge for water purification are also described.

A mailbox is mounted to two perpendicular faces of a post by a mounting assembly main bracket with two perpendicular flanges. The main bracket has a horizontal top wall from which two diverging sidewalls extend downwardly. The top wall has two sets of perpendicular slots, which receive two parallel right angle top brackets to receive the mailbox in a position either partially overlying the top of the post, projecting from the post, or offset from the post in a transverse orientation. Another embodiment has a main bracket with an integral top bracket, and only one adjustable top bracket. For sale, the top brackets mount to the main bracket by a label sheet wrapping the top wall and holding a fastener container.

A compact, economical, and easy-to-use small parts machine tool that can machine small parts from bar stock as well as castings, forgings, slugs, and near net shape raw materials, is comprised a base with a spindle for moving a workpiece, a first carriage connected to the base that moves along a Z axial direction, a second carriage connected to the first carriage that moves along a Y axial direction, a third carriage connected to the second carriage that moves along an X axial direction, and a tool holder system that holds a plurality of machining tools.

The present invention provides improved optical switches in which only a spatial beam shifting of a small free space offset is required to direct optical pathways between plural fiber ports. This is achieved by spacing two fibers closely and collimating their beams with one imaging lens for compactness. Advantageously, the inventive switches incorporate beam correcting devices to render the beam propagations parallel, allowing light beams to be efficiently coupled into two fibers that share a single lens with substantially improved stability.

The invention relates to a conductor line (6) for supplying at least one electric load which can be moved on the conductor line in the longitudinal direction (L) of the conductor line, comprising at least one conductor strand (15) which runs in the longitudinal direction (L) and which comprises an electrically conductive profiled conductor section (16) for contacting a sliding contact (27) of a current collector (3) of the load and at least one elongated slotted waveguide (18), which runs in the longitudinal direction (L), with a longitudinal slot (19) for receiving an antenna (20) which can be moved together with the load. The invention also relates to a current collector (3) which is designed in a corresponding manner and to a conductor line system. The aim of the invention is to allow a compact and material-saving design as well as a good fault-tolerant transmission. This is achieved by a conductor line (6) in which the longitudinal slot (19) is tilted by an angle (Alfa) which does not equal 90 degrees about the longitudinal direction (L) with respect to a movement plane (E) on which the current collector (3) can be moved in the longitudinal direction (L), by a current collector (3) in which the antenna (20) or a part (21) thereof is completely or partly tilted by an angle (Alfa) which does not equal 90 degrees about the longitudinal direction (L) with respect to a movement plane (E) on which the current collector (3) can be moved in the longitudinal direction (L), and by a conductor line system comprising such a conductor line (6) and such a current collector (3).

Disclosed herein are a prestressed composite girder with steel plates, a continuous prestressed composite girder structure with steel plates and methods of fabricating and connecting the same. The prestressed composite girder includes shear reinforcing bars and main reinforcing bars, sheaths, sole plates, and steel plates. The shear reinforcing bars and main reinforcing bars are arranged across the prestressed composite girder. The sheaths are adapted to contain steel wires arranged across the prestressed composite girder. The sole plates are placed at ends of the prestressed composite girder and provided with shear connecting members. The steel plates are placed in upper and lower flanges of the prestressed composite girder and provided with shear connecting members.

A semiconductor structure, for improving rectifier efficiency in passive backscatter transponders or backscatter remote sensors for use in high-frequency electromagnetic fields, is provided. The semiconductor structure has a dielectric layer on whose upper side is arranged a first electrically conductive layer, and a second electrically conductive layer that is spaced apart from the first electrically conductive layer and is arranged essentially below the first electrically conductive layer and is at least partially embedded in the dielectric layer. The dielectric layer has its lower side arranged on a semiconductor substrate of a first conductivity type within which is formed a more highly doped first zone of the first conductivity type which surrounds an even more highly doped second zone of the first conductivity type connected to a reference voltage. Whereby, the first zone can be arranged essentially completely under the first and second electrically conductive layers. In this way, interfering effects of parasitic circuit components can be reduced.

The invention relates to a conductor line (6) for supplying at least one electric load which can be moved on the conductor line in the longitudinal direction (L) of the conductor line, comprising at least one conductor strand (15; 30; 38; 45) which runs in the longitudinal direction (L) and which comprises an electrically conductive profiled conductor section (16; 31; 39; 46) for contacting a sliding contact (22; 23; 33; 43; 56) of the load and at least one signal transmission device (19; 35; 40; 47) which runs in the longitudinal direction (L). The invention also relates to a current collector (3) for the load with at least one sliding contact (22; 23; 33; 43; 56) for contacting the profiled conductor section (16; 31; 39; 46) of the conductor strand (15; 30; 38; 45) of the conductor line (6) and with at least one antenna (21; 37; 44; 49) for transmitting data to a conductor line (6) signal transmission device (19; 35; 40; 47), which moves in the longitudinal direction (L). The invention also relates to a conductor line system. The aim of the invention is to allow a compact and material-saving design as well as a good fault-tolerant transmission. This is achieved by a conductor line (6) in which the signal transmission device (19; 35; 40; 47) and the profiled conductor section (16; 31; 39; 46) are designed as one component, by a current collector (3) in which the sliding contact (22; 23; 33; 43; 56) and the antenna (21; 37; 24; 49) are designed as one component, and by a conductor line system comprising such a conductor line (6) and such a current collector (3).

A three-dimensional CMOS circuit having at least a first N-conductivity field-effect transistor and a second P-conductivity field-effect transistor respectively formed on first and second crystalline substrates. The first field-effect transistor is oriented, in the first substrate, with a first secondary crystallographic orientation. The second field-effect transistor is oriented, in the second substrate, with a second secondary crystallographic orientation. The orientations of the first and second transistors form a different angle from the angle formed, in one of the substrates, by the first and second secondary crystallographic directions. The first and second substrates are assembled vertically.

A microwave transmitting device for a level measuring device (1) having an electronic device, a microwave emitter and a waveguide (3). The inside of the waveguide is filled with a casting compound. A microwave transmitting device that is particularly compact and cost-effective is implemented by the microwave emitter and the electronic device being enclosed by a casting formed of a casting / potting compound.