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Leadless soft tin solder

A tin solder and soldering technology, applied in the direction of welding/cutting media/materials, welding media, welding equipment, etc., can solve the problems of not meeting the use requirements, poor oxidation resistance, poor brightness, etc., and achieve grain refinement , good weldability, and optimize the effect of expansion rate

Inactive Publication Date: 2007-08-08
太仓市南仓金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing lead-free solders are only widely used in SnCu, SnAgCu, and SnNiCu, which can no longer meet the requirements of use, and some have high melting points, coarse crystals, poor brightness, and poor oxidation resistance, which are far from meeting the requirements.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Embodiment sees table 4

[0028] Each raw material weight proportion of table 4 embodiment

[0029] Example

[0030] The preparation method of the lead-free soft soldering material of above-mentioned embodiment is that Sn is melted into master alloy respectively with Cu, Ni, Ge, In, Sb, Bi, Ti earlier, wherein SnCu alloy Cu content is 10%, SnNi alloy Ni content of 5%, SnGe alloy Ge content of 2.5%, SnIn alloy In content of 10%, SnSb alloy Sb content of 50%, SnBi alloy Bi content of 10%, SnP alloy P content of 5%, and then the remaining tin After melting, the master alloy and Ga are sequentially added quantitatively at a temperature of 380-450°C, and smelted into a product.

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PUM

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Abstract

A lead free soft tin features in the composition of Cu 0.1-5.0%,Ni 0.01-2.0%,Ge 0.01-1.0%,In 0.01-1.5 %,Sb O005-2.0% and the rest being Sn with 0.05-1.0%Bi and or 0.001-1.0 %Ti to strengthen the anti oxidation to add 0.01-0.1%P and Ga, with good soldering effect, glaze on the surface, anti fatigue, anti oxidation, low soldering degree, good humidity, and fine crystallization.

Description

technical field [0001] The invention relates to a lead-free soft solder, which can be used for hot-dip soldering, wave soldering, hot-air soldering, manual soldering, and can also be used for manufacturing solder wire with cored flux and solid tin wire, solder rod, tin Solder products such as paste and tin plate belong to welding materials. Background technique [0002] For a century, tin-lead solder has been the main soldering material in the electronics industry. Because it has better soldering performance and lower melting point, it is familiar to use. However, lead is a toxic and harmful element that pollutes the air environment and is harmful to human health. Therefore, the creation of soldering materials in the foreign electronics industry must remove the lead element and implement lead-free tin solder to replace it. The electronics industry is developing rapidly in the modern era, and people's awareness of environmental protection is paying more attention to it. High-...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 季丁华熊玉兰季晓丽
Owner 太仓市南仓金属材料有限公司
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