Aluminum silicon carbide composite material with laser welding layer and preparing method of aluminum silicon carbide composite material

Abstract

The invention discloses an aluminum silicon carbide composite material with a laser welding layer and a preparing method of the aluminum silicon carbide composite material. The composite material is composed of the laser welding layer and an aluminum silicon carbide layer, the laser welding layer is composed of pure aluminum or aluminum alloy comprising silicon and aluminum, the volume fraction of the silicon in the aluminum alloy is a, the volume fraction of the aluminum in the aluminum alloy is b, the a is greater than 0 and less than or equal to 30%, and the b is greater than or equal to 30% and less than 100%. The aluminum silicon carbide layer is composed of silicon carbide and pure aluminum or aluminum alloy, and the volume fraction of the silicon carbide ranges from 30% to 70%. The preparing method comprises the steps that silicon carbide pelleting powder is prepared firstly, then silicon carbide preformed parts are prepared, and the aluminum silicon carbide composite material with the laser welding layer is prepared in the vacuum pressure impregnation method finally. The aluminum silicon carbide composite material is good in weldability and gas tightness, high in heat conductivity, low in coefficient of thermal expansion, simple in preparing method, efficient and low in cost.

Description

technical field [0001] The invention relates to an electronic packaging material used in the electronic information industry, in particular to an aluminum silicon carbide composite material with a laser welding layer that can be welded by laser and a preparation method thereof. Background technique [0002] With the development of the electronic information industry, the integration of chips continues to increase, which makes the operating temperature of the circuit continue to rise. Correspondingly, the requirements for packaging materials are becoming more and more stringent. Not only the packaging materials are required to have higher thermal conductivity, but also the Matching low thermal expansion coefficient, and in order to meet the needs of lightweight, it is also required that the density of the packaging material is as low as possible and the modulus of elasticity is as high as possible. Traditional packaging materials such as metal aluminum, copper, Kovar, tungste...

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Problems solved by technology

The shell can be laser welded to the Kovar cover plate, but the airtightness of the weld is difficult to meet the requirements, and the production process cost is also high

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