The invention provides a
wafer scribing and splitting method and
wafer scribing and splitting equipment, and belongs to the technical field of
wafer scribing equipment. Comprising a plurality of chips arranged in an array and a plurality of
cutting channels on a wafer body, and the plurality of
cutting channels are located between the adjacent chips; a
grinding patch is attached to the front face of the wafer body, a plurality of first
cutting grooves are formed in the back face of the wafer body through
machining, and the first cutting grooves extend in the direction of the front face of the wafer body; a plurality of second cutting grooves are further formed in the end faces, close to the front face of the wafer body, of the first cutting grooves through
machining, and the second cutting grooves extend in the front face direction of the wafer body; the plurality of cutting channels between the adjacent chips form a plurality of thinned connecting parts; removing the
grinding patch on the front surface of the wafer body, attaching an
adhesive film layer on the back surface of the wafer body, enabling the front surface of the wafer body to face upwards, and cutting off a plurality of connecting parts among the second cutting grooves by using a
chopper; and obtaining an independent
chip. Through multiple times of cutting forming, the phenomenon that a single notch is prone to edge breakage is improved.