Process for assembling substrates with low-temperature heat treatments

a heat treatment and substrate technology, applied in the direction of lamination, decorative surface effects, decorative arts, etc., can solve the problems of formation of bonding defects, inability to use solutions, appearance of defects at the bonding interfa
US20090162991A1Inactive Publication Date: 2009-06-25COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Publication Date
2009-06-25
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a process for producing a bond between a first and a second substrate (2, 4), comprising:a) a step of preparing surfaces (6, 8) to be assembled,b) an assembly of these two surfaces, by direct molecular bonding,c) a heat treatment step involving at least maintaining the temperature within the range of 50° C. to 100° C. for at least one hour.
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Description

TECHNICAL FIELD AND PRIOR ART

[0001] The invention relates to techniques for assembling substrates.

[0002] In general, a bond between two substrates or surfaces can be obtained after a preparation of the surfaces giving them a hydrophilic or hydrophobic character.

[0003] The use of heat treatments to reinforce the direct bonding can cause, for a certain number of bonded structures, the appearance of defects at the bonding interface. These defects are due to the degassing of by-products of the molecular bonding reaction: for example, water, hydrogen or hydrocarbon molecules.

[0004] For a certain number of bonded structures, it is known that these defects can be resorbed by heat treatments performed at very high temperatures. These temperatures are, for example, between 900° C. and 1300° C. and are based on the preparation of surfaces before bonding. Unfortunately, for other bonded structures, this solution cannot be used.

[0005] The limitation of the surface oxide thickness or the presence of ...

Claims

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