A superconducting
integrated circuit is fabricated by depositing a
ground plane to at least partially overlie a substrate, depositing an insulating layer to at least partially overlie the
ground plane, depositing a superconducting layer to at least partially overlie the insulating layer, and forming a superconducting feature in the superconducting layer. An
inductance of the superconducting feature is tunable by adjusting a bias current in the
ground plane. The ground plane is electrically communicatively coupleable to an electrical ground. Depositing a ground plane includes depositing a first
superconducting material to at least partially overlie the substrate and depositing a second
superconducting material to at least partially overlie the first
superconducting material. A second
critical current density of the second superconducting material is higher than a first
critical current density of the first superconducting material.