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Surface compound strengthening process for aluminum alloy material

A technology of aluminum alloy material and surface composite, applied in metal material coating process, superimposed layer plating, coating and other directions, can solve the problems of low hardness, poor bonding strength, poor wear resistance, etc., to achieve wear resistance Good, high hardness and wear resistance, high bonding strength effect

Active Publication Date: 2011-07-06
NAXAU NEW MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve aluminum and aluminum alloy chemical plating Ni, Ni-P, Ni-W-P or electroplating Ni, Cr bonding strength is good, but hardness is low, wear resistance is relatively poor, and aluminum alloy material vacuum coating CrN, TiN, TiAlN, TiCN or DLC coatings have high hardness and good wear resistance, but the bonding strength with the substrate is poor. We provide a composite aluminum alloy surface that combines electroless plating or electroplating with vacuum coating technology. Strengthening treatment technology can improve the bonding strength between the vacuum coating and the aluminum alloy substrate, and at the same time make the surface of the aluminum alloy substrate have higher hardness and wear resistance

Method used

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  • Surface compound strengthening process for aluminum alloy material
  • Surface compound strengthening process for aluminum alloy material

Examples

Experimental program
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Effect test

Embodiment 1

[0023] In the first step, the thickness of aluminum and aluminum alloy surface plating is 2μm Ni coating:

[0024] The process flow of electroplating Ni layer: mechanical polishing→gasoline or carbon tetrachloride degreasing→installation→chemical degreasing (alkaline etching process)→descale or emit light in 1:1 nitric acid and 5% hydrofluoric acid solution ( Acid etching process)→Washing→Activation→Washing→Nickel plating→Washing→Drying.

[0025] (1) Alkali etching process: Na 2 CO 3 30g / L, Na 3 PO 4 30g / L, additive 2-4 g / L, OP-10 emulsifier 0.5-1 mL / L, temperature 75-85℃, time 30-60s;

[0026] (2) Acid etching process: HNO 3 3 parts, 1 part HF, a small amount of water, temperature room temperature, time 20-40s;

[0027] (3) Nickel electroplating solution formula and process parameters (the name should be one-to-one correspondence with the above process flow, and the terms should be consistent): nickel sulfate (NiSO 4 ·7H 2 O) 250g / L, nickel chloride (NiCl 2 ·6H 2 ...

Embodiment 2

[0032] Step 1: Electroless plating on the surface of aluminum and aluminum alloy with a thickness of 10 μm Ni plating.

[0033] In the second step, the Ni-plated aluminum alloy mold is cleaned by an ultrasonic cleaning line to remove the chemical plating residue, and then placed in a constant temperature drying oven at a constant temperature of 75°C for 2 hours.

[0034] The third step: Hollow cathode ion plating deposition CrN coating process and parameters:

[0035] Fix the dried aluminum alloy mold on the bracket, put it into the hollow cathode coating machine, put the Cr coating material in the crucible of the coating machine, adjust the rotation speed of the workpiece support to 6-10 rpm, and pump to the background vacuum of 2.5-3.0×10- 3 Pa, turn on the heater at the same time, raise the temperature to 200-300°C; open the Ar gas flow valve, adjust the vacuum chamber to about 0.5-1 Pa, apply a negative bias voltage of 300-800 V to the substrate, and perform glow sputteri...

Embodiment 3

[0037] The first step: the thickness of electroless plating on the surface of aluminum and aluminum alloy is 4 μm Ni-P coating.

[0038] In the second step, the aluminum alloy mold treated with Ni-P is cleaned by an ultrasonic cleaning line to remove the chemical plating residue, and then put into a constant temperature drying oven and baked at a constant temperature of 80°C for 1.5 hours.

[0039] The third step: two layers of TiN coatings were deposited by magnetron sputtering ion plating, the deposition temperature was 200° C., and the thickness of the two layers of TiN coatings was 4 μm.

[0040] The technical solutions of electroplating and electroless plating of the present invention are all known technologies, so no detailed description will be given. Multi-arc ion plating, hollow cathode ion plating, and magnetron sputtering ion plating also adopt the existing low deposition temperature (180-250°C) vacuum coating technology, and other technical solutions of the present...

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Abstract

The invention discloses a surface compound strengthening process for an aluminum alloy material, aiming to solve the problems that chemical plating of Ni, Ni-P and Ni-W-P or electroplating of Ni and Cr for aluminum and aluminum alloy has good bonding strength but low rigidity and poorer wear resistance, and vacuum coatings of CrN, TiN, TiAlN, TiCN or DLC for an aluminum alloy material have high rigidity and good wear resistance but poorer bonding strength with a substrate. The surface compound strengthening process disclosed by the invention comprises the following steps: firstly, plating a 2-10mu m thick gradient transition layer on the surface of an aluminum alloy substrate, then baking for 1-2 hours at constant temperature of 75-85 DEG C in a dry environment, and finally depositing oneor multiple coatings of CrN, TiN, TiAlN, TiCN or DLC on the aluminum alloy substrate by a vacuum coating technology. The surface compound strengthening process can improve the bonding strength between the vacuum coating and the aluminum alloy substrate, and simultaneously the surface of the aluminum alloy substrate has higher rigidity and wear resistance.

Description

technical field [0001] The invention relates to the technical field of surface strengthening of aluminum alloy materials, in particular to a composite surface strengthening process of aluminum alloy materials combining electroplating or electroless plating with vacuum plating. Background technique [0002] In recent decades, with the continuous improvement of aluminum smelting and technology and breakthroughs in the basic problems of aluminum materials, the aluminum alloy industry has flourished, and aluminum alloy materials have been widely used, and aluminum alloy material molds have become more and more widely used. Is one of them. At the present stage, the share of aluminum alloy molds in the United States has accounted for more than 20% of the total molds, while it is still less than 0.2% in China, which is still in the stage of development. The processing performance of aluminum alloy is excellent, and the cutting speed is 40% higher than that of die steel, thus great...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C28/00
Inventor 不公告发明人
Owner NAXAU NEW MATERIALS CORP
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