Novel heat sink and production method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 苏州热驰光电科技有限公司
- Publication Date
- 2010-10-06
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a novel heat dissipation device, in particular to a heat dissipation device with a high thermal conductivity coating and a manufacturing method thereof. Background technique
[0002] Now widely used in LED street lamps in streets, bridges, squares and other places, the temperature of the internal light-emitting chip is very high when it emits light. When the light-emitting chip is used below 55°C, the life span can reach 200,000 to 300,000 hours; When used above ℃, because the heat of the cold light source cannot reach the radiator, the temperature of the light-emitting chip is too high, which will lead to a sharp decline in the life of the street lamp. The currently applied heat pipe technology does not have the function of multi-conduction heat conduction because of the directionality of heat conduction, and the heat can only be conducted from bottom to top.
[0003] At present, the heat sink substrates used in general heat ...