Novel heat sink and production method thereof

A heat dissipation device, a new type of technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of LED light attenuation, high cost, heat conduction and heat dissipation performance decline, etc., to achieve good market promotion value, The effect of high thermal conductivity

Inactive Publication Date: 2010-10-06
苏州热驰光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Gold and silver have better thermal conductivity, but the disadvantage is that the price is too high
The heat dissipation effect of pure copper is second, but in addition to the high cost, the copper sheet is heavy and not resistant to corrosion. Once the copper is oxidized, its thermal conductivity and heat dissipation performance will be greatly reduced, resulting in high temperature and increasing the LED failure. Possibility, resulting in increased LED light decay and shortened life

Method used

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  • Novel heat sink and production method thereof
  • Novel heat sink and production method thereof
  • Novel heat sink and production method thereof

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Embodiment Construction

[0022] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings.

[0023] refer to figure 1 The new heat dissipation device of the preferred embodiment of the present invention includes: a heat conduction element 7 abutted against the heat source 6 and a heat dissipation fin 8 affixed to the heat conduction element 7, and the heat dissipation fin 8 can be replaced by other common heat dissipation devices. Such as thermal glue, heat pipe and the like.

[0024] The heat conducting element 7 is composed of a metal substrate 1 and a high thermal conductivity coating deposited on the metal substrate, and the metal substrate is copper, or aluminum alloy, or stainless steel.

[0025] refer to figure 2 , the high thermal conductivity coating comprises two layers of diamond-like coatings, the first layer of diamond-like coatin...

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Abstract

The invention provides a novel heat sink prepared with high thermal-conductivity DLC coating. By means of magnetron sputtering and ion beam techniques, a plurality of layers of DLC coating containing chromium are deposited on a metal base material, and thereby the high thermal conductivity is realized. The heat sink comprises a heat-conducting part and fins, wherein the heat-conducting part abuts against a heat source, the fins are connected with the heat-conducting part, and the heat-conducting part consists of the metal base material and the high thermal-conductivity coating deposited on the metal base material. The invention has the following main advantages that: the diamond-like coating (DLC) has high thermal conductivity, the novel heat sink prepared with the DLC coating has excellent heat conductivity and heat dispersion, and the heat-conducting direction is not limited.

Description

technical field [0001] The invention relates to a novel heat dissipation device, in particular to a heat dissipation device with a high thermal conductivity coating and a manufacturing method thereof. Background technique [0002] Now widely used in LED street lamps in streets, bridges, squares and other places, the temperature of the internal light-emitting chip is very high when it emits light. When the light-emitting chip is used below 55°C, the life span can reach 200,000 to 300,000 hours; When used above ℃, because the heat of the cold light source cannot reach the radiator, the temperature of the light-emitting chip is too high, which will lead to a sharp decline in the life of the street lamp. The currently applied heat pipe technology does not have the function of multi-conduction heat conduction because of the directionality of heat conduction, and the heat can only be conducted from bottom to top. [0003] At present, the heat sink substrates used in general heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L21/48H01L33/64
Inventor 钱涛
Owner 苏州热驰光电科技有限公司
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