Sintered polycrystalline diamond material with extremely fine microstructures

a polycrystalline diamond and microstructure technology, applied in the field of sintered diamond cutting and forming tools, can solve the problems of high cost, anisotropic, limited in size, and inability to provide extremely smooth cut, drawn or otherwise formed workpiece surfaces, and achieve the effects of reducing the cost of pcd tools, and improving the quality of finished products

Inactive Publication Date: 2007-03-15
DIAMOND INNOVATIONS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0019] In an exemplary embodiment, a polycrystalline (PCD) body has diamond crystals that have an arithmetic mean, as-sintered diamond grain size less than 1 μm. In another embodiment, the PCD body comprises grain sizes greater than about 0.1 μm and less than about 1.0 μm. In still another embodiment the as-sintered grain size of a PCD body is substantially uniform. In a further embodiment, the PCD body is monolithic; there are no added bonding phases, such as carbides, nitrides, or borides, in the PCD body. An embodiment of a PCD body may have an oxygen content less than about 0.05 weight percent. In still another embodiment of a PCD body, the nitrogen content is less than about 0.01 weight-percent. A PCD body embodied herein may have diamond crystals wherein at least 63% of the crystals have a grain size that is less than 1.0 μm. Another embodiment is a PCD body which has a mean as-sintered grain size between about 0.1 μm and 1.0 μm, with a body thickness greater than about 0.5 mm.

Problems solved by technology

However, PCD as currently produced, does not provide extremely smooth cut, drawn or otherwise formed workpiece surfaces.
Single crystal diamond, while expensive, anisotropic, and limited in size, remains the preferred tool material for single point turning of optical materials or drawing of highly finished, fine wire.
Mechanical failure, from limited strength and impact resistance, of PCD tools is also common
Finer, uniform, as-sintered diamond grain sizes, for example, of about 0.1 μm to about 1.0 μm (referred to as “submicron”) have proven challenging to produce commercially using the PCD manufacturing process described above.
Submicron diamond particles are difficult to produce, and have proven difficult to handle during blending and mixing due to their high surface area's ability to attract and retain contaminants that affect the sintering process and product properties.
Submicron diamond particles have low packing densities that cause problems during loading of shielding enclosures and HP / HT processing.
The very fine pores between the submicron diamond grains in the initial diamond particle mass are difficult to uniformly penetrate with catalyst metal, leading to incomplete bonding and sintering between diamond particles.
It is almost always observed that the high surface area of submicron diamond powders causes the diamond solution-reprecipitation process to occur non-uniformly.
This leads to non-uniform detrimental diamond grain growth and other complications that make the production of larger parts unfeasible when final diamond grain sizes less than 1 micron are attempted.
These non-uniform materials were not hard enough to be useful as cutting tools.
The wear resistance, strength, and thermal stability of this product will be substantially inferior to true PCD.
Because no catalyst metal is present, the application does not describe a true PCD product; the product will have significant defects, and will be difficult to produce due to inherent problems of handling fine powders.
The prior art falls short of achieving a submicron particle size.

Method used

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  • Sintered polycrystalline diamond material with extremely fine microstructures
  • Sintered polycrystalline diamond material with extremely fine microstructures
  • Sintered polycrystalline diamond material with extremely fine microstructures

Examples

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example 1

[0042] Referring again to FIGS. 2A and 2B, this example demonstrates the ability to make PCD composites in which the sintered diamond is integrally bonded to a cemented metal carbide substrate. A diamond-cobalt powder blend with approximately 7% cobalt by weight, distributed as shown in FIG. 1 with approximately 0.8 μm volumetric mean raw material diamond size 210, was disposed between a tantalum (Ta) shielding enclosure 230 and a cemented tungsten carbide (WC)+13 weight-percent cobalt disk. This assembly was subjected to HP / HT processing at about 55 Kbar at temperature of about 1400° C. for about 20 minutes to form the sintered submicron PCD tool blank 260. The PCD tool blank 250 was finished to produce a diamond layer 260 1.5 mm thick, and the overall thickness of the blank 250 was 3.2 mm. The average as-sintered diamond grain size, assessed by direct line intercept measurement of the microstructure with a field emission scanning electron microscope, was 0.87 μm. Several variation...

example 2

[0048] Referring to FIG. 8, this example illustrates the ability to make carbide supported wire die blanks 800. These are materials in which the diamond portion 810 is sintered into a carbide annulus 820 using a separate metal source as the catalyst rather than sintering using the cobalt binder phase from the carbide substrate. In this example, diamond powder 810 with a volumetric mean particle size of 0.5 μm further containing 7% by weight of the fine, dispersed cobalt similar to Example 1 was used. The diamond and cobalt powder blend 810 were loaded into the center of a carbide cylinder 820 encased in a tantalum (Ta) enclosure 830. A cobalt (Co) disc 840 (shown in exploded view) was placed on top of the powder followed by a Ta shielding enclosure 850 (also in exploded view), Several of these assemblies were loaded into a HP / HT reaction cell and subjected to pressures of about 55 Kbar at temperatures between about 1300° C. and about 1500° C. for about 15 minutes to form the sintere...

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Abstract

A sintered polycrystalline diamond material (PCD) of extremely fine grain size is manufactured by sintering a diamond powder with pre-blended catalyst metal under high pressure/high temperature (HP/HT) processing. The PCD material has an average sintered diamond grain structure of less than 1.0 μm.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS [0001] This patent application claims priority to co-pending U.S. provisional patent application No. 60 / 717,227, filed Sep. 15, 2005 entitled “Sintered, Polycrystalline Diamond Compact with Extremely Fine Microstructures”, the disclosure of which is incorporated herein by reference in its entirety.STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH [0002] Not applicable. NAMES OF PARTIES TO A JOINT RESEARCH AGREEMENT [0003] Not applicable. SEQUENCE LISTING [0004] Not applicable. BACKGROUND [0005] 1. Technical Field [0006] The disclosed embodiments generally relate to the field of sintered diamond cutting and forming tools and more particularly to such diamond tools having extremely fine microstructures imparting improved tool properties, machinability, and an ability to impart improved surface finish to workpiece materials. [0007] 2. Description of the Related Art [0008] Polycrystalline diamond (PCD) is used extensively in industrial applications...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): E21B10/36
CPCB01J3/062B01J2203/062C22C26/00B01J2203/0655B01J2203/0685B22F7/062B22F2005/002B22F2998/00C04B35/52C04B2235/427C04B2235/722C04B2235/723C04B2235/782C04B2235/785C04B2235/95B22F3/15E21B10/46C04B2235/5445
Inventor WEBB, STEVENRAGHAVAN, RAM
Owner DIAMOND INNOVATIONS INC
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