Packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity

Abstract

A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.

Description

BACKGROUND OF INVENTION[0001]1. Field of the Invention[0002]The present invention is related to a packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity, and particularly to a packaging device which comprises an array chip furnished with a plurality of semiconductor light-emitting elements arranged in an array, and is designed with specific wire bonding structure for providing good heat dissipation.[0003]2. Description of the Prior Art[0004]In recent years, optical communication technology has progressively become the choice framework for network infrastructure, and is becoming the main trend of data transmissions in the foreseeable future. To increase optical transmission efficiency, various semiconductor lasers such as VCSELs (Vertical Cavity Surface Emitting Lasers), HCSELs (Horizontal Cavity Surface Emitting Lasers) and RCLEDs (Resonant Cavity Light Emitting Diodes) have become the focal point of research and development effo...

AI Technical Summary

Benefits of technology

[0007]The primary objective of the present invention is to provide a packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity for resolving issues in the areas of wire bonding and heat dissipation.

[0008]In order to achieve the aforementioned objective, the present invention discloses a packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity. The packaging device comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two. The present invention adopts a metal substrate comprised of copper, aluminum or gold, and uses a conductive adhesive with good heat conductivity, such as solder paste, to adhere an array chip. Compared to conventional technology where nickel-iron alloy substrates and colloidal silver adhesion are employed, the present invention achieves superior heat conduction and dissipation effects. In addition, with the design structure of the wire bond pad and electrode areas of the present invention, more metal wiring is allowed to transmit power signals, therefore providing advantages such as better heat dissipation, shunted currents, reduced resistance, easy and flexible layout design, and reduced heat production, especially suitable for high power operated semiconductor light emitting elements packaging device.

Problems solved by technology

However, a massive amount of heat is produced as a result of increased output power by including multiple matrix-arranged laser elements on a single semiconductor laser chip.

Due to poor heat dissipating capabilities of the nickel-iron alloy substrate and colloidal silver used by conventional semiconductor laser packaging device, overheating is likely to happen, preventing the power operation from upgrading to a watt-level.

However, in such conventional packaging devices, some metal wires are forced to traverse over the semiconductor laser chip, blocking light emitted by some laser elements.

In addition, connecting all the gold wires to a single electrode stem will cause problems such as high resistance, high heat production and poor heat dissipation, therefore requiring improvements.

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