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Electroplating pen device, intelligent electrochemical coating and 3D printing device and using methods thereof

A 3D printing and electrochemical technology, applied in the field of electrochemical deposition, can solve the problems of irreparable, waste of resources, inconvenient operation, etc., and achieve the effect of preventing disconnection

Active Publication Date: 2019-02-15
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, to repair the partial wear of the deposited workpiece in the industry, it is necessary to immerse the deposited workpiece in the electrolyte, and then operate on the worn area. This operation has the following technical problems. On the one hand, it is not easy to operate when the deposited workpiece is large. It is convenient and wastes resources, on the other hand, it cannot repair the worn parts accurately

Method used

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  • Electroplating pen device, intelligent electrochemical coating and 3D printing device and using methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Configure 200g / L of FeSO4 7H2O solution to do electroplating solution 2, pack into the electroplating pen device, the electroplating pen device is sealed with sealing cover 5;

[0033] Get a piece of copper sheet 10cm long, 5cm wide, and 0.2mm thick as the substrate 82 to be deposited, first polish its surface, then clean its surface with 1mol / L dilute hydrochloric acid and 1mol / L sodium hydroxide solution, and then use Clean the residual liquid on the surface with alcohol, and finally dry it with nitrogen;

[0034] Use the DC power supply box 85, connect the positive electrode to the anode material copper 3, and connect the negative electrode to the copper sheet 82. The selected voltage is 4V, and the electroplating pen device is manually controlled to carry out free electrodeposition on the surface of the copper sheet 82. During this period, the liquid level of the lower leakage port 12 is kept in contact with the copper sheet 82. The copper sheets 82 are in contact; ...

Embodiment 2

[0037] Configure 200g / L of FeSO4 7H2O solution to do electroplating solution 2, pack into the electroplating pen device, the electroplating pen device is sealed with sealing cover 5;

[0038] Get a piece of copper sheet 10cm long, 5cm wide, and 0.2mm thick as the substrate 82 to be deposited, first polish its surface, then clean its surface with 1mol / L dilute hydrochloric acid and 1mol / L sodium hydroxide solution, and then use Clean the residual liquid on the surface with alcohol, and finally dry it with nitrogen;

[0039] Fix the electroplating pen device on the fixing part 81b;

[0040]Use the DC power supply box 85, connect the positive pole to the anode material copper 3, the negative pole to the copper sheet 82, select the voltage to be 4V, and control the heating of the two-way mobile platform 83 and the platform lifter 84 to move through the computer program to make the electroplating pen device drain. The liquid surface of the liquid mouth is in contact with the coppe...

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Abstract

The invention discloses an electroplating pen device, an intelligent electrochemical plating and 3D printing device and using methods of the electroplating pen device and intelligent electrochemical plating and 3D printing device. The electroplating pen device, the intelligent electrochemical plating and 3D printing device and the using methods of the electroplating pen device and intelligent electrochemical plating and 3D printing device mainly aim to solve the problem that a deposited workpiece needs to be limited in an electrolyte according to the current electrodeposition metal coating preparation technology. A new electrodeposition device is adopted to ensure that a to-be-plated workpiece does not need to be placed into the electrolyte to perform metal coating preparation in a specific area or even a point on the surface of the workpiece, and intelligent electrodeposition can be realized by controlling a to-be-plated workpiece platform through a computer. Meanwhile, when electrodepositing of the same material is carried out on the surface of the to-be-plated workpiece, electrochemical 3D printing (additive manufacturing) can be further realized through repeated deposition in the same area or the same pattern.

Description

technical field [0001] The invention belongs to the field of electrochemical deposition, and mainly relates to an electroplating pen device for preparing a metal coating by electrochemical deposition, an intelligent electrochemical coating and 3D printing device and a use method thereof. Background technique [0002] With the development of society and science and technology and the increasingly stringent requirements for the operating environment of mechanical equipment in various fields, mechanical moving parts are facing serious problems such as wear and corrosion, so coatings with special functions are required to provide protection. The electrodeposition technology was invented in 1800 and has been applied to all aspects of daily production and life. However, due to the limitation of its electrochemical principle, this technology has always been limited in terms of environmental protection and convenience. With the introduction of German Industry 4.0, the Ministry of I...

Claims

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Application Information

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IPC IPC(8): C25D5/34C25D5/04C25D19/00C25D21/02C25D17/12B33Y30/00
CPCB33Y30/00C25D5/04C25D5/34C25D17/00C25D17/004C25D17/12C25D21/02
Inventor 姚正军张帆陶学伟杨晨黄成军程倩
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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