Test bench, control method thereof, test device and storage medium

Abstract

The invention discloses a test bench, a control method thereof, a test device and a storage medium. The test bench comprises a base, a cover body and a temperature control assembly, wherein the base is provided with a test assembly and an elastic needle, and the cover body is connected with the base and can rotate relative to the base to form a covering state or a separating state; a pressing block is arranged on the side, facing the base, of the cover body and used for pressing a to-be-tested piece placed on the base when the base and the cover body are in the covering state so that the to-be-tested piece can make contact with the test assembly; the temperature control assembly is arranged between the cover body and the pressing block and used for detecting and controlling the temperature of the to-be-detected piece through conducting heat by the pressing block,and is in contact with the elastic needle so as to be connected with an external circuit board through the elastic needle when the base and the cover body are in the covering state. Through the above mode, the temperature of a chip can be adjusted and collected when the chip is tested, so that the temperature condition of the chip test is accurately controlled.

Description

technical field

[0001] The present application relates to the field of electrical testing, in particular to a testing socket, a control method thereof, a testing device and a storage medium. Background technique

[0002] Electronic devices such as chips and semiconductors that have been packaged need to be electrically tested with test sockets before leaving the factory to ensure product quality, and the work of electronic devices is often accompanied by heat generation. Therefore, in order to adapt to the actual working conditions of electronic devices, electronic devices The test needs to create temperature conditions for it.

[0003] The high and low temperature control of the existing test equipment mainly has the following methods: (1) heat radiation method: this method bakes or cools the device to be tested through the heat radiation mode of the high and low temperature box; (2) air convection method: in a closed High and low temperature airflow is formed in the test ...

Examples

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0022] The terms "first" and "second" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features shown. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to c...

technical field

[0001] The present application relates to the field of electrical testing, in particular to a testing socket, a control method thereof, a testing device and a storage medium. Background technique

[0002] Electronic devices such as chips and semiconductors that have been packaged need to be electrically tested with test sockets before leaving the factory to ensure product quality, and the work of electronic devices is often accompanied by heat generation. Therefore, in order to adapt to the actual working conditions of electronic devices, electronic devices The test needs to create temperature conditions for it.

[0003] The high and low temperature control of the existing test equipment mainly has the following methods: (1) heat radiation method: this method bakes or cools the device to be tested through the heat radiation mode of the high and low temperature box; (2) air convection method: in a closed High and low temperature airflow is formed in the test ...

Examples

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0022] The terms "first" and "second" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features shown. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to c...

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