38results about How to "Short polishing time" patented technology

The invention relates to an electrolytic polishing process. The electrolytic polishing process of the invention comprises the following steps of: removing oil from a workpiece; washing with water; soaking in acid; performing electrolytic polishing; performing countercurrent rinsing for three times; soaking in alkali; washing with water; passivating; wiping or drying; and packaging.

The invention discloses non-phosphorus electrolytic polishing liquid and a technology for polishing workpiece surfaces with the same. The non-phosphorus electrolytic polishing liquid comprises 30%-60% of sulfuric acid, 15%-35% of organic acid, 1%-5% of brightener, 2%-10% of viscosity modifier, 1%-5% of corrosion inhibitor and 20%-30% of water. The non-phosphorus electrolytic polishing liquid does not contain components not allowed by environmental standards, waste water is convenient to process in the cleaning process, and toxic effects on human body and livestock are avoided. The invention further provides the best polishing process condition for polishing stainless steel workpieces with the non-phosphorus electrolytic polishing liquid. The electrolytic polishing effect is completely identical with the polishing effect of original phosphoric acid electrolytic polishing liquid. The polishing time is short, and machining cost is low.

The invention provides a polishing method for a mirror effect of amorphous alloy. The polishing method comprises the following steps that S1, grinding liquid containing single crystal diamond particles with a particle diameter of 10-20um is adopted, and first grinding is carried on a first grinding machine; S2, grinding liquid containing single crystal diamond particles with a particle diameter of2-6um is adopted, and second grinding is carried on a second grinding machine; S3, polishing liquid containing silicon dioxide particles with a particle diameter of 70-100um is adopted, and an amorphous alloy product is polished on a polishing machine; and S4, after the amorphous alloy product is ultrasonically cleaned with alkaline cleaning solution, the product is dried. According to the polishing method for the mirror effect of the amorphous alloy, grinding and polishing of the surface of the amorphous alloy product can be carried out through three processes of coarse grinding, fine grinding and polishing, and a better machining surface can be obtained under the mechanical friction action of abrasive with particles with uniformity and good dispersibility; and the machining process is simple and stable, the grinding and polishing time is short, the removal rate is high, the cost is low, and the qualification rate is high.

The invention relates to a semiconductor substrate material polishing method and belongs to the technical field of semiconductor material polishing. The semiconductor substrate material polishing method comprises the following steps: carrying out laser polishing on a semiconductor substrate material subjected to linear cutting; carrying out ultrasonic cleaning on the semiconductor substrate material subjected to laser polishing, so that the laser polishing treatment can be completed; and treating the semiconductor substrate material obtained in the previous step by the adoption of chemical mechanical polishing. The semiconductor substrate material polishing method provided by the invention has the beneficial effects that through the laser polishing process, the surface damage can be efficiently removed as well as a structure and a component which are beneficial to chemical mechanical polishing and removal can be formed; meanwhile, the laser polishing process is contactless and no new mechanical damage is generated, so that the ultra-precision polished surface can be obtained within only 0.1-5 hours in the next step of chemical mechanical polishing; all the processing steps in the semiconductor substrate material polishing method can be completed through commercial equipment; the implementation is easy; and the application prospects are good.

The invention discloses a metallographic preparation method of a tungsten-zirconium alloy. The metallographic preparation method is characterized by comprising the following steps of: 1) sampling, intercepting a small block sample, and enabling a cutting surface to be an inspection surface, 2) grinding, grinding the inspection surface with abrasive paper to remove surface scratches, and after grinding is finished, putting the sample into alcohol for ultrasonic cleaning, and then taking out and blow-drying the sample, (3) rough polishing, specifically, conducting rough polishing through a diamond spray polishing agent, and enabling the rotating speed to range from 300 r/min to 500 r/min, and after rough polishing is finished, putting the sample into alcohol, ultrasonically cleaning, takingout and blow-drying, (4) conducting fine polishin, specifically, conducting fine polishing through a chromium sesquioxide polishing agent, and enabling the rotating speed to range from 100 r/min to 150 r/min, and after the fine polishing is finished, putting the sample into alcohol, ultrasonically cleaning, taking out and blow-drying, and (5) final polishing, specifically, conducting final polishing through silicon latex suspension liquid, enabling the rotating speed to be 100-150 r/min, after final polishing is completed, putting the sample into alcohol to be subjected to ultrasonic cleaningand then taken out to be blow-dried to be observed. The metallographic preparation method has the advantages that the sample preparation time is shortened, and the microscopic structure is clear and visible.

The invention relates to a reusable aluminum profile polishing solution and a method for polishing an aluminum alloy workpiece by using the reusable aluminum profile polishing solution. The polishing solution consists of the following raw materials in percentage by mass: 30-45% of concentrated sulfuric acid, 35-45% of concentrated phosphoric acid, 0.5-1.5% of a corrosion inhibitor, 1-3% of tartaric acid and the balance of water. The corrosion inhibitor is composed of carboxymethyl cellulose and sulfosalicylic acid. The adopted polishing method comprises the steps that the aluminum alloy workpiece is subjected to oil removal, washed with water and then placed in the polishing solution to be polished, the aluminum alloy workpiece is washed with water, washed with absolute ethyl alcohol and then blow-dried, and the polished aluminum alloy workpiece is obtained. The polishing treatment temperature ranges from 70 DEG C to 85 DEG C, and the polishing time ranges from 120 s to 160 s. After the polishing solution is used for polishing the aluminum alloy workpiece, the surface roughness and glossiness of the aluminum alloy workpiece are good. The weight loss rate of the aluminum alloy workpiece is low, and the size of the aluminum alloy workpiece is hardly affected. The used polishing solution is subjected to chemical precipitation to remove aluminum ions, and the polishing solution without aluminum ions can be reused.

The invention belongs to the technical field of grinding for the thinning process of liquid crystal glass substrates, and discloses a grinding treatment method for a thinned liquid crystal glass substrate. By the adoption of the grinding treatment method for the thinned liquid crystal glass substrate, the defects of existing grinding techniques for thinning are overcome. The grinding treatment method for the thinned liquid crystal glass substrate comprises the following steps of preparation of grinding fluid, cleaning of a grinding machine, and grinding through the grinding machine. The grinding treatment method for the thinned liquid crystal glass substrate has the beneficial effects that mechanical scratches on the surface of the liquid crystal glass substrate can be obviously reduced effectively and conveniently, the surface grain yield of the ground liquid crystal glass substrate is increased, the probability of regrinding after grinding is lowered, and the production efficiency is improved.

The invention discloses a superprecision machining device based on a photon crystal material and a method for monitoring imaging and relates to the mechanical manufacturing industry technical field, in particular to the technical field of the superprecision machining device based on the photon crystal material. The lower end of a polishing sheet supporting frame power system is connected with a supporting clamp; the lower end of the supporting clamp is connected with the polishing sheet; the lower end of the polishing sheet is correspondingly provided with a substrate; a polished and fallen grinding medium is filled between the polishing sheet and the substrate; detecting light emitted by a detecting light source is reflected on a spectrum scanning platform by a phase dichroscope and transported to a scanning lens arranged on the upper end of the spectrum scanning platform; and the detecting light runs through the scanning lens and reaches a substrate supporting frame. The superprecision machining device and the method realize the aims of having good polishing effect, monitoring the spectral characteristic of the polishing sheet in a polishing region at any moment and acquiring the local deformation and the stress parameters of the polishing sheet in time.

The invention discloses an alkaline non-polluting aluminum alloy electrochemical polishing solution, including an alkaline substance, a brightener and a stabilizer. The brightener is preferably TA or TB; and the stabilizer is preferably SA or SB. The surface subjected to electrochemical by the polishing solution has high flatness, and the polishing solution has the advantages of low energy consumption, short polishing time, less aluminum consumption and long life cycle. The polishing method can significantly reduce production costs, improve the working environment, improve the quality of the polished surface, and has broad application prospect.

The invention relates to a processing method of a brass product before electroplating nickel. The processing method comprises the steps: taking 15-20 kg of the brass product, adding into a grinding machine, adding 4-6 L of a grinding fluid and 15-25 L of water into the grinding machine, under a condition of room temperature, grinding for 30-60 min at the speed of 50-60 rpm, washing with water, pickling, activating, and completing. The novel machinery and chemical combination method is adopted to preprocess the brass product, and the appearance and the quality of electroplated nickel of the brass product are improved.

The invention belongs to the technical field of metal surface treatment, and relates to an electrochemical polishing device for teaching. At present, various electrochemical polishing devices are mostly complex in structure and high in safety protection requirement and need to be operated by professionals. The electrochemical polishing device for teaching overcomes the defects, and comprises a direct-current chemical polishing power supply, a constant-temperature water bath kettle, an electrolyte polishing groove and a polishing part hanging frame. The electrochemical direct-current power supply can be used for converting 220V single-phase alternating current into electrochemical polishing direct current to be output. The output voltage is adjusted according to the area of a polished material. The electrolyte polishing groove is placed in the constant-temperature water bath kettle. The polishing part hanging frame is installed in the short axis direction of the cross section of the polishing groove. The electrochemical polishing device for teaching is used for a thin-sheet-shaped single part with the area smaller than 45 mm * 45 mm, simple in structure, convenient to use, low in manufacturing cost, high in safety and short in polishing time. The surface roughness of a polished part is low.

The invention discloses an artificial tooth polishing method. The artificial tooth polishing method includes the steps of S1, grinding, namely grinding tongue tip metal smoothly by a grinding stone, and polishing the smooth tongue tip metal to enable tongue tip edge to be free of burrs or edge notches by a rubber wheel and a rubber strip; S2, polishing, namely subjecting a ground artificial tooth to soaking polishing in a solution. Due to the fact that the artificial tooth is subjected to primary grinding and chemical soaking polishing, the artificial tooth polishing method is short in polishing time but good in polishing effect. The artificial tooth polishing method combining a mechanical method with a chemical method has the advantages of simplicity in operation, convenience in treatment and low cost, thereby being applicable to industrialized mass production.