Coin-making copper alloy blank cake electrolyte plasma polishing solution and polishing process

A copper alloy and electrolyte technology, which is applied in the field of ion polishing liquid and polishing technology, can solve the problems of low brightness, unsuitable copper alloy for coinage, roughness of copper alloy blank cake that cannot meet the requirements for coinage, etc., and achieve short polishing time , The surface of the flat cake is bright, and the effect of meeting the surface quality requirements

Pending Publication Date: 2019-12-31
SHENYANG MINT CO LTD
View PDF7 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method can utilize the method for plasma polishing to polish the copper alloy, and after the plasma polishing that utilizes this polishing solution to carry out is shown in its embodiment, the copper alloy product surface roughness Ra<10 μ m that obtains, but in actual application test, because make Due to the special composition of coin copper alloy, this polishing solution is not suitable for electrolytic plasma polishing of coinage copper alloy, and the roughness of the copper alloy blank cake after polishing cannot meet the coinage requirements, and the brightness is not high. The surface of the copper alloy coinage blank cake Roughness requirement Ra<1μm
[0006] Publication number CN102953062A Chinese patent "an environment-friendly plasma polishing liquid and its preparation process and polishing process", its content involves the use of plasma polishing technology to polish metal workpieces, but this patent is mainly applicable to stainless steel, zinc alloy and The polishing of oxygen copper is not suitable for minting copper alloys

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Coin-making copper alloy blank cake electrolyte plasma polishing solution and polishing process
  • Coin-making copper alloy blank cake electrolyte plasma polishing solution and polishing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The material of the flat cake polished in the present embodiment is that the grade is CuAl 6 Ni 2 Mint Aluminum Bronze.

[0034] The electrolyte plasma polishing solution prepared in this embodiment has the following components and concentrations: 1% ammonium phosphate, 1% potassium aluminum sulfate, 0.2% citric acid, 0.4% sodium citrate, 0.1% brightener, and the rest is water, polishing The pH range of the liquid is 6~7.

[0035] Concrete polishing process is as follows in the present embodiment:

[0036] 1) Add the polishing solution into the polishing tank in the electrolyte plasma polishing machine and heat it to 65°C.

[0037] 2) Clamp the copper alloy blank cake to be polished on the special polishing hanger.

[0038] 3) Hang the hanger full of copper alloy blank cakes on the bracket in the electrolyte plasma polishing machine, lower the bracket so that the blank cake on the hanger is immersed in the polishing liquid, and keep it at a position 40mm below the l...

Embodiment 2

[0043] The material of the polished flat cake in this embodiment is coinage tin brass with the grade of HSn72-1-1.

[0044] The electrolyte plasma polishing solution prepared in this embodiment has the following components and concentrations: 2% ammonium phosphate, 3.5% potassium aluminum sulfate, 0.8% citric acid, 0.7% sodium citrate, 0.8% brightener, and the rest is water, polishing The pH range of the solution is 7.

[0045] Concrete polishing process is as follows in the present embodiment:

[0046] 1) Add the polishing solution into the polishing tank in the electrolyte plasma polishing machine and heat it to 85°C.

[0047] 2) Clamp the copper alloy blank cake to be polished on the special polishing hanger.

[0048] 3) Hang the hanger full of copper alloy blank cakes on the bracket in the electrolyte plasma polishing machine, lower the bracket so that the blank cake on the hanger is immersed in the polishing liquid, and keep it at a position 50mm below the liquid surfac...

Embodiment 3

[0053] The material of the polished cake in this embodiment is coinage zinc-nickel-nickel copper with a brand name of BZn15-17.

[0054] The electrolyte plasma polishing solution prepared in the present embodiment has the following components and concentrations: 3% ammonium phosphate, 5% aluminum potassium sulfate, 1.5% citric acid, 1% sodium citrate, 1.5% brightener, and the rest are water. The pH range of the liquid is 7~8.

[0055] Concrete polishing process is as follows in the present embodiment:

[0056] 1) Add the polishing solution into the polishing tank in the electrolyte plasma polishing machine and heat it to 105°C.

[0057] 2) Clamp the copper alloy blank cake to be polished on the special polishing hanger.

[0058] 3) Hang the hanger full of copper alloy blank cakes on the bracket in the electrolyte plasma polishing machine, lower the bracket so that the blank cake on the hanger is immersed in the polishing liquid, and keep it at a position 50mm below the liquid ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
surface roughnessaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to view more

Abstract

The invention relates to a coin-making copper alloy blank cake electrolyte plasma polishing solution. The polishing solution is prepared from, by weight percent, 1%-3% of ammonium phosphate, 1%-5% ofaluminum potassium sulfate, 0.2%-1.5% of citric acid, 0.4%-1% of sodium citrate, 0.1%-1.5% of brightening agents, and the balance water, wherein the pH range of the polishing solution is 6-8, the polishing solution component is neutral salt, the polishing solution is environment-friendly and pollution-free, and can be recycled. The polishing process comprises the following steps of, 1) adding thepolishing solution into a polishing tank in a polishing machine, and heating to 65-105 DEG C; 2) clamping a copper alloy blank cake device to be polished on a polishing special hanging tool; (3) hanging the hanging tool on a bracket in the polishing machine, lowering the bracket to enable the blank cake on the hanging tool to be immersed in the polishing solution, and keeping the blank cake at theposition 50 mm below the liquid level; 4) turning on the power supply of the machine, wherein the voltage is 250-400 V, the current density is 55-95 A / dm<2>, and the polishing time is 60-110 s; and 5) taking out the hanging tool after polishing treatment, putting the blank cake into a cleaning tank, performing washing with deionized water for 5-15s, then performing washing with alcohol, and thenperforming drying. The polishing process is simple to operate, short in polishing time, and high in efficiency.

Description

technical field [0001] The invention relates to the technical field of polishing the base cake of copper alloy commemorative coins and chapters, in particular to an electrolytic plasma polishing solution and a polishing process of the coinage copper alloy base cake. Background technique [0002] In the manufacturing process of commemorative coins and medals, the coinage copper alloy strip is first punched into a flat cake, and then the flat cake is annealed, polished and cleaned, and then embossed into a finished product. With the continuous improvement of the people's quality requirements for commemorative coins and badges, the surface quality of copper alloy commemorative coins and badges has also been continuously improved. Especially copper alloy refined coins have extremely high requirements on the roughness and gloss of the mirror surface area of ​​the product. This requires that in the manufacturing process of copper alloy commemorative coins and chapters, the anneal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): C23F3/06
CPCC23F3/06
Inventor 于宏王菲张晓男朱慕平胡云明穆忠文
Owner SHENYANG MINT CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap