Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

3results about How to "Reduce compressive stress" patented technology

Eccentric bolt

The utility model discloses an eccentric bolt, and relates to the field of eccentric bolts, the eccentric bolt comprises a bolt head, the bolt head is provided with threads, one end of the bolt head is fixedly provided with a head plate, the bolt head is provided with a circular groove, and the tail end of the bolt head is in threaded connection with a nut. On the basis of an existing bolt head, the circular groove is cut, so that the bolt head can be placed in the circular groove for installation and positioning, the nut is screwed at the tail end, overall installation and positioning can be completed, convenience and flexibility during installation can be achieved, and the installation efficiency is improved. Under the matching action of the first reinforcing teeth and the like on the first gasket, the contact area can be increased, the pressure stress of the pressure-bearing surface can be reduced, the surface of a connected piece is protected, meanwhile, the excellent durability is achieved, and under the strong vibration environment, the service life of the connected piece is prolonged. The anti-loose gasket can effectively keep the clamping force of the connecting piece, and bolt looseness caused by vibration is prevented.
Owner:YIYI PRECISION HARDWARE (SHANGHAI CO LTD

Semiconductor device

PendingCN122094485Areduce compressive stressReduced risk of ruptureDevice materialEngineering physics
Some embodiments of the present disclosure provide a semiconductor device including a contact electrically connected to a Group III-V semiconductor body layer. The metal layer stack of the contact comprises a plurality of metal layers and a metal nitride cap layer located at the topmost layer of the metal layer stack, the plurality of metal layers comprise a metal bottom layer located at the bottommost layer and having a metal element, and the metal nitride cap layer has a nitride of the metal element. And the thickness of the metal bottom layer is greater than that of the metal nitride cover layer, so that the contact element can relieve the stress of the main body layer and reduce the risk of material fracture in the semiconductor device.
Owner:HON HAI PRECISION INDUSTRY CO LTD

A defibrillator

PendingCN122141123Areduce compressive stressImprove reliabilityHeart defibrillatorsHigh energyHemt circuits
The application relates to a defibrillator, comprising: an energy storage module comprising at least two energy storage devices; an energy storage selection module for selecting the energy storage devices of a charge-discharge circuit of the defibrillator according to an energy level; and a control module configured to: in a first energy level, control the energy storage selection module to connect a first preset at least one energy storage device to the charge-discharge circuit, the total energy storage capacity of the first preset energy storage device being a first energy storage capacity; and in a second energy level, control the energy storage selection module to connect a second preset at least one energy storage device to the charge-discharge circuit, the total energy storage capacity of the second preset energy storage device being a second energy storage capacity, the second energy storage capacity being greater than the first energy storage capacity; wherein the first energy level is in a first energy range, and the second energy level is in a second energy range. The defibrillator with a single energy storage structure in the related art cannot simultaneously meet the requirements of precise defibrillation in a low-energy scene and effective defibrillation in a high-energy scene, thereby affecting the defibrillation effect and reducing the defibrillation success rate.
Owner:久心医疗科技(苏州)有限公司