Coated substrates and methods for their preparation

A substrate and coating technology, applied in coatings, semiconductor/solid-state device manufacturing, transportation and packaging, etc., can solve problems such as reducing the effectiveness of coatings

Inactive Publication Date: 2008-11-26
DOW CORNING CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermally induced stress can cause cracking in the barrier coating, reducing the effectiveness of the coating

Method used

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  • Coated substrates and methods for their preparation
  • Coated substrates and methods for their preparation
  • Coated substrates and methods for their preparation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

Embodiment 2

[0114] In a flask combine concentrated hydrochloric acid (37%, 600 g), 1020 g of toluene, and 3.0 g of sodium octanesulfonate monohydrate. A solution consisting of 90.75 g (0.67 mol) of trichlorosilane, 100.15 g (0.67 mol) of methyltrichlorosilane and 6.14 g (0.038 mol) of trichlorovinylsilane was added dropwise to the in the mixture. The mixture was stirred at room temperature for 4 hours, after which time the aqueous layer was removed. The resulting organic layer was washed with 100 ml of 45% sulfonic acid (2 times) and with 250 ml of deionized water (10 times). The solution was dried over magnesium sulfate and passed through a sintered glass filter. Toluene was removed under reduced pressure at 30 °C using a rotary evaporator. The residue was placed under vacuum (1 Pa) at room temperature overnight to give a silicone resin having the following formula (as determined by 29SiNMR and 13CNMR) and a weight average molecular weight of 11,600:

Embodiment 3

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Abstract

Coated substrates comprising an inorganic barrier coating and an interfacial coating, wherein the interfacial coating comprises a cured product of a silicone resin having silicon-bonded radiation-sensitive groups; and methods of preparing the coated substrates.

Description

Coated substrates and methods of making the same Cross References to Related Applications [0001] None technical field [0002] The present invention relates to coated substrates and more particularly to coated substrates comprising an inorganic barrier coating and an interfacial coating, wherein the interfacial coating comprises a silicone resin having radiation-sensitive groups bonded to silicon cured product. The invention also relates to methods of preparing said coated substrates. Background technique [0003] Barrier coatings play an important role in a wide range of applications including electronic packaging, food packaging, and surface treatments by protecting sensitive materials from air, moisture, and environmental contaminants. In particular, barrier coatings are often applied to polymeric substrates to reduce the rate of transmission of various gases and liquids through these permeable materials. As a result, such coatings increase the reliability and useful ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/312H01L51/52C08J7/04C08J7/048
CPCH01L51/5237H01L21/02348H01L21/02216H01L21/3122H01L21/318Y10T428/31663H01L21/02282H01L21/3124C08J7/045H01L21/02126C08J7/0423C08J7/048H10K50/8445
Inventor J·D·阿尔鲍M·阿莫考R·C·卡米莱蒂D·乔伊W·韦德纳L·赞伯夫
Owner DOW CORNING CORP
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