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40results about How to "Low switching voltage" patented technology

Thin Layer Photonic Integrated Circuit Based Optical Signal Manipulators

Integrated optical intensity or phase modulators capable of very low modulation voltage, broad modulation bandwidth, low optical power loss for device insertion, and very small device size are of interest. Such modulators can be of electro-optic or electro-absorption type made of an appropriate electro-optic or electro-absorption material in particular or referred to as an active material in general. An efficient optical waveguide structure for achieving high overlapping between the optical beam mode and the active electro-active region leads to reduced modulation voltage. In an embodiment, ultra-low modulation voltage, high-frequency response, and very compact device size are enabled by a semiconductor modulator device structure, together with an active semiconductor material that is an electro-optic or electro-absorption material, that are appropriately doped with carriers to substantially lower the modulator voltage and still maintain the high frequency response. In another embodiment, an efficient optical coupling structure further enables low optical loss. Various embodiments combined enable the modulator to reach lower voltage, higher frequency, low optical loss, and more compact size than previously possible in the prior arts.
Owner:HO SENG TIONG

Method of forming a substrate-triggered SCR device in CMOS technology

Abstract of Disclosure A P_STSCR structure includes a P-type substrate, an N-well in the P-type substrate, a first N+ diffusion region located in the P-type substrate connected to the cathode, a second P+ diffusion region located in the N-well connected to the anode, and a third P+ diffusion region as a trigger node located in the P-type substrate and between the first N+ diffusion region and the second P+ diffusion region. A lateral SCR device including the second P+ diffusion region, the N-well, the P-type substrate and the first N+ diffusion region is thereby formed. When a current flows from the trigger node into the P-type substrate, the lateral SCR device is triggered on into its latch state to discharge ESD current. Since the present invention utilizes a substrate-triggered current Itrig flowing into or flowing out from the P-type substrate or the N-well through the inserted trigger node, a much lower switching voltage in the SCR device is obtained.With such a lower switching voltage in the SCR device, the total layout area of the ESD protection circuit can be reduced, and the turn-on speed of SCR device is further improved to quickly discharge ESD current.ESD current flowing through surface channels, and heat dissipation issues, are avoided, while presenting no increase to the overall complexity and difficulty of CMOS IC manufacturing.
Owner:KER MING DOU +2

High-efficiency inverter topology

The invention discloses a high-efficiency inverter topology which inverts direct current into alternating current in a lower cost and high efficiency manner, simultaneously does not cause a common mode interference problem, and can be conveniently applied to inverter systems without isolation transformers. The principle of the topology is that high-frequency chopping switches are respectively arranged on a positive end and a negative end of a direct current input side and switched on/off simultaneously, and the duty ratios of the switches are regulated so as to vary the amplitudes of the output voltage; flat wave inductors are respectively connected at the rear stages of the switches, and a subsequent flow circuit is arranged at one sides, which are connected with the chopping switches, of the two flat wave inductors, so that the subsequent current of the flat wave inductors are ensured when the chopping switches are switched off; H inverting bridges are arranged at the rear stages of the inductors and invert at the output frequency which is required by an inverter, and accordingly, inverting is realized. By utilizing the topology, the switching voltages of switching tubes are reduced, and accordingly, the switching loss of a system is decreased; and moreover, the topology does not cause the common mode interference problem and can be used for the inverter systems without the isolation transformers.
Owner:FONRICH NEW ENERGY TECH LTD

Synchronous follow current inverter topology without common-mode interference

A synchronous follow current inverter topology without common-mode interference realizes the high-efficiency inversion of electric energy from direct current to alternating current with lower cost, and meanwhile, the topology is free of the problem of common-mode interference, and the synchronous follow current inverter topology can be conveniently applicable to an inversion system without isolation transformers. The topology adopts the following principle: high-frequency chopping switches are arranged at the positive end and the negative end of the direct current input side and are switched on and off simultaneously, and the duty cycle of switching of the high-frequency chopping switches is modulated to realize the amplitude change of the output voltage; the rear stage of each high-frequency chopping switch is connected with a flat wave inductor, one side of each flat wave inductor is connected with the chopping switch and is also provided with a follow current circuit with a follow current switch, and the follow current of each flat wave inductor is ensured when the chopping switch is switched off; the rear stage of each inductor is provided with an H reversing bridge, and the H reversing bridges carry out reversing according to the frequency of the expected output of an inverter, so that the inversion is realized. With the topology, the switching voltage of a switching tube is reduced, the switching loss of the system is reduced, meanwhile, the topology is free of the problem of common-mode interference, and is applicable to an inversion system without transformers.
Owner:FONRICH NEW ENERGY TECH LTD

Thin layer photonic integrated circuit based optical signal manipulators

Integrated optical intensity or phase modulators capable of very low modulation voltage, broad modulation bandwidth, low optical power loss for device insertion, and very small device size are of interest. Such modulators can be of electro-optic or electro-absorption type made of an appropriate electro-optic or electro-absorption material in particular or referred to as an active material in general. An efficient optical waveguide structure for achieving high overlapping between the optical beam mode and the active electro-active region leads to reduced modulation voltage. In an embodiment, ultra-low modulation voltage, high-frequency response, and very compact device size are enabled by a semiconductor modulator device structure, together with an active semiconductor material that is an electro-optic or electro-absorption material, that are appropriately doped with carriers to substantially lower the modulator voltage and still maintain the high frequency response. In another embodiment, an efficient optical coupling structure further enables low optical loss. Various embodiments combined enable the modulator to reach lower voltage, higher frequency, low optical loss, and more compact size than previously possible in the prior arts.
Owner:HO SENG TIONG

Multielement metal oxide thin film based resistive random access memory and preparation method therefor

The invention discloses a multielement metal oxide thin film based resistive random access memory and a preparation method therefor, and belongs to the technical field of a memory. A bottom electrode layer, a resistive random layer and a top electrode layer are arranged on a substrate in sequence; the bottom electrode material is 2at% Al doped ZnO; the resistive random layer is CuGaZnO; and the top electrode material is Cu. The preparation method comprises the following steps of adopting a radio frequency magnetron sputtering method to prepare the bottom electrode on the substrate; placing a metal mask on the bottom electrode layer; then preparing the CuGaZnO thin film on the metal mask to form the resistive random layer; and finally adopting a vacuum coating technology to prepare the Cu top electrode on the CuGaZnO thin film so as to form the bottom electrode-resistive random layer-top electrode structure. The resistive random access memory has the characteristics of high switch ratio, relatively low switching voltage, stable retention, and anti-fatigue; the problem of high cost of the material of the resistive random layer in the preparation process is effectively solved; and the preparation process is high in portability, and the implementation of a full-transparent device can be facilitated.
Owner:UNIV OF ELECTRONIC SCI & TECH OF CHINA

Soluble isomerized anthracene-containing polyimide with information storage function

ActiveCN105860072AWith information storage functionWith electric bistable characteristicsSolid-state devicesSemiconductor/solid-state device manufacturingAnthraceneSolubility
The invention provides soluble isomerized anthracene-containing polyimide with an information storage function, and belongs to the field of organic information storage materials. Isomerized anthracene-containing diamine with the electron supply property is firstly synthesized, and then isomerized anthracene-containing diamine and dicarboxylic anhydride with the electron acceptor property are subjected to polycondensation to prepare isomerized anthracene-containing polyimide with the excellent information storage function, wherein the structure of isomerized anthracene-containing polyimide is shown as a formula (I) (please see the formula in the description). Isomerized polyimide has the advantages of being low in switching voltage, high in response speed and stable in storage property, and the information storage behavior of the material can be regulated and controlled by changing the site where an anthracene group is connected into a polyimide main chain; in addition, polyimide has the good solubility in a polar solvent to be beneficial for material processing and preparing of an information storage device. Meanwhile, a preparation technology of polyimide is simple, high in efficiency and beneficial for batch preparation and has the very high practical value and the wide application prospect.
Owner:HANGZHOU INST OF ADVANCED MATERIAL BEIJING UNIV OF CHEM TECH

A resistive variable memory based on multi-element metal oxide film and its preparation method

The invention discloses a resistive variable memory based on a multi-element metal oxide thin film and a preparation method thereof, belonging to the field of memory technology. The present invention is a structure in which a bottom electrode layer, a resistive layer and a top electrode layer are sequentially integrated on the substrate, the material of the bottom electrode is ZnO doped with 2at% Al, the material of the resistive layer is CuGaZnO, and the top electrode The material is Cu. The preparation method of the present invention comprises the following steps: first adopting the radio frequency magnetron sputtering method to prepare a bottom electrode on the substrate, placing a metal mask on the bottom electrode layer, and then preparing a CuGaZnO thin film on it to form a resistive variable layer; finally A vacuum coating technique is adopted to prepare a Cu top electrode on the CuGaZnO thin film, thereby forming a structure of bottom electrode-resistive layer-top electrode. The resistive variable memory of the present invention has high switching ratio, low switching voltage, stable retention characteristics and anti-fatigue characteristics; effectively solves the problem of high cost of resistive variable layer materials in the preparation process; the preparation process has strong portability, and has It is beneficial to realize fully transparent devices.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA

Conductive polymer based bionic memristor and preparation method thereof

The invention discloses a conductive polymer-based bionic memristor and a preparation method thereof, a polymer memristor structure composed of an ion-rich semiconductor layer and an ion collection conductive layer is constructed by introducing an organic-inorganic hybrid interface of PEDOT: PSS / AlOx or a PEDOT: PSS / Pentacene organic-organic interface, the switching power consumption and stability of the organic memristor are improved, and the performance of the memristor is improved. The biologic synaptic response is realized. According to the memristor structure, a bottom electrode indium tin oxide (ITO), a PEDOT: PSS organic functional layer subjected to low-temperature annealing, an inorganic resistive layer non-stoichiometric ratio AlOx or an organic resistive layer pentacene Pentacene and a top electrode metal Al are sequentially arranged from bottom to top, and the memristor device with the structure of ITO / PEDOT: PSS / AlOx / Al or the structure of ITO / PEDOT: PSS / Pentacene / Al is formed. The method is used for realizing multi-stage switching characteristics and improving switching power consumption (1.2 mu w), can be applied to synaptic plasticity function simulation, and provides possibility for low-power-consumption application scenes and neuromorphic calculation.
Owner:NANJING UNIV OF POSTS & TELECOMM
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