87results about How to "Lower programming voltage" patented technology

A floating gate memory array includes row control circuits that provide a programming voltage to a selected word line and provide a stair-like pattern of boosting voltages to unselected word lines. Boosting voltages descend with increased distance from the selected word line. Boosting voltages are increased in small increments up to their final values.

An apparatus includes a storage transistor. The storage transistor includes a floating gate configured to store electrical charge and a control gate. The floating gate is coupled to the control gate via capacitive coupling. The floating gate and the control gate are metal. The apparatus also includes an access transistor coupled to the storage transistor. A gate of the access transistor is coupled to a word line. The storage transistor and the access transistor are serially coupled between a bit line and a source line.

A nonvolatile semiconductor memory device includes: a memory element, the memory element including: a semiconductor substrate; a first insulating film formed on a region in the semiconductor substrate located between a source region and a drain region, and having a stack structure formed with a first insulating layer, a second insulating layer, and a third insulating layer in this order, the first insulating layer including an electron trapping site, the second insulating layer not including the electron trapping site, and the third insulating layer including the electron trapping site, and the electron trapping site being located in a position lower than conduction band minimum of the first through third insulating layers while being located in a position higher than conduction band minimum of a material forming the semiconductor substrate; a charge storage film formed on the first insulating film; a second insulating film formed on the charge storage film; and a control gate electrode formed on the second insulating film.

The invention provides an efficiently erasable and writable split-gate flash memory. The split-gate flash memory comprises a semiconductor substrate which has a source electrode area and two drain electrode areas which are positioned at the two sides of the source electrode area and separated by a channel area; source electrode wires which are positioned above the source electrode area and interconnected; two floating gates which are arranged at two sides of the source electrode wires as memory cells, are in L-shaped symmetrical distribution, are separated by an insulating dielectric layer, and side edges of which are respectively adjacent to the source electrode wires, part of the source electrode area and part of the channel area; two control gates which are respectively adjacent to thetwo L-shaped floating gates and separated by the insulating dielectric layer; and two word lines which are respectively adjacent to the two control gates, the side edges of the two L-shaped floating gates, part of the channel area and part of the two drain electrode areas, and are separated from each other by the insulating dielectric layer. In the efficiently erasable and writable split-gate flash memory, the programming voltage thereof can be further reduced, thus improving the device density.

This variable resistance element is provided with a variable resistance film, a first electrode, which is disposed in contact with one surface of the variable resistance film, and a second electrode, which is disposed in contact with the other surface of the variable resistance film. The first and the second electrodes have corner portions, respectively, and the distance between the corner portions of the first and the second electrodes is set equal to the shortest distance between the first and the second electrodes. Furthermore, the variable resistance element has a third electrode, which is disposed on the one surface of the variable resistance film.

Provided are a non-volatile memory device and a method of fabricating the same. The non-volatile memory device comprises: a control gate region formed by doping a semiconductor substrate with second impurities; an electron injection region formed by doping the semiconductor substrate with first impurities, where a top surface of the electron injection region includes a tip portion at an edge; a floating gate electrode covering at least a portion of the control gate region and the tip portion of the electron injection region; a first tunnel oxide layer interposed between the floating gate electrode and the control gate region; a second tunnel oxide layer interposed between the floating gate electrode and the electron injection region; a trench surrounding the electron injection region in the semiconductor substrate; and a device isolation layer pattern filled in the trench.

The invention discloses a programmable polycrystalline silicon fuse device structure and a realizing method of the technology of the programmable polycrystalline silicon fuse device structure. The programmable polycrystalline silicon fuse device structure comprises an N type high-resistance polycrystalline silicon resistor, a P type high-resistance polycrystalline silicon resistor an NP diode, a negative electrode contact end and a positive electrode contact end. The method comprises the steps that an oxide layer field area is formed on a P type substrate, a polycrystalline silicon area is formed on the oxide layer field area, P type polycrystalline silicon is formed on one side of the polycrystalline silicon area and N type polycrystalline silicon is formed on the other side of the polycrystalline silicon area, the NP diode is formed in a junction position of the N type polycrystalline silicon and the P type polycrystalline silicon, silicon oxide or silicon nitride is produced in a P,N type high-resistance polycrystalline silicon resistor area to prevent formation of metal silicide, the metal silicide is formed in a P type low-resistance polycrystalline silicon resistor area on the polycrystalline silicon and in an type type low-resistance polycrystalline silicon resistor area on the polycrystalline silicon, a through hole is formed, metal wire connection is achieved, and the negative electrode end and the positive electrode end of a polycrystalline silicon fuse device are led out. The programmable polycrystalline silicon fuse device structure and the realizing method of the technology of the programmable polycrystalline silicon fuse device structure can be applied to various technologies, reliability is guaranteed, the yield of a device is well guaranteed.

A split gate (flash) EEPROM cell and a method for manufacturing the same is disclosed, in which a control gate and a floating gate are formed in a vertical structure, to minimize a size of the cell, to obtain a high coupling ratio, and to lower a programming voltage. The split gate EEPROM cell includes a semiconductor substrate having a trench; a tunneling oxide layer at sidewalls of the trench; a floating gate, a dielectric layer and a control gate in sequence on the tunneling oxide layer; a buffer dielectric layer at sidewalls of the floating gate and the control gate; a source junction in the semiconductor substrate at the bottom surface of the trench; a source electrode in the trench between opposing buffer dielectric layers, electrically connected to the source junction; and a drain junction on the surface of the semiconductor substrate outside the trench.

The application discloses a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a substrate including a first region and a second region; a recess disposed on a surface of the second region; a functional part disposed on the first region; and an antifuse structure disposed on the second region , wherein the antifuse structure includes a conductive component and an insulating component, and the insulating component covers the recess and part of the second region. In this semiconductor device, since the insulating member covers the recessed portion, the lower surface of the insulating member has a raised portion corresponding to the recessed portion, and when a voltage is applied to the antifuse structure, a high electric field is generated near the raised portion. The strong electric field makes the insulating part break down at a lower voltage, which reduces the programming voltage of the antifuse structure, so that the antifuse structure in the semiconductor device is easier to conduct under the working voltage.

A non-volatile memory device, including a substrate of a first conductivity type, the substrate including a plurality of wells of a second conductivity type, a plurality of memory cells in one of the plurality of wells of the second conductivity type, and a peripheral circuit including at least one first transistor of the second conductivity type on the substrate, and at least one second transistor of the first conductivity type in another one of the plurality of wells of the second conductivity type.

A 3D memory constituted by multiple layer memories. Each layer of memory includes m word lines, n bit lines and a plurality of initial switch layers, where m, n are natural numbers. The initial switch layer consists of Chalcogenide material. Two initial switches C[i, j +1] and C[i +1, j] are provided in a region surrounded by the word line i, the word line i +1 and the bit line j, the bit line j +1; and no initial switch is provided in a region surrounded by the word line i +1, the word line i +2 and the bit line j, and the bit line j +1, wherein i is odd and 1<=i<=m-1; j is a natural number and j is in a range from 1 to n-1, the initial switch layer C[i, j +1] denotes an initial switch connecting the word line i and the bit line j +1, and the initial switch layer C[i +1, j] denotes an initial switch connecting the word line i +1 and the bit line j. Each initial switch constitutes a memory core along with the connected word line and the connected bit line.

The present invention pertains to the technical field of one-time programmable memory (OTP), and in particular to a one-time programmable memory unit, OTP, and method of fabricating the same. The OTP unit comprises a lower electrode, an upper electrode and a storage medium layer placed between the upper electrode and the lower electrode, the storage medium layer comprises a first metal oxide layer and a second metal oxide layer, wherein an adjoining area for programming is formed between the first metal oxide layer and the second metal oxide layer. The OTP comprises a plurality of the above-described one-time programmable memory units arranged in rows and columns. The OTP unit and the OTP have such characteristics as low programming voltage, small unit area, being able to integrate into a back-end structure of integrated circuit, great process flexibility, and the method of fabricating the OTP unit and the OTP is relatively simple and low in cost.