The invention relates to the technical field of
integrated circuit manufacturing, and discloses a low-
dielectric film based on a layered compound and a preparation method and application thereof. The invention provides a layered compound: [Mx (OH) y] z + [(An-) z / n]. MH2O or [M1x1M2x2 (OH) y] z + [(An-) z / n]. MH2O, where [Mx (OH) y] z + or [M1x1M2x2 (OH) y] z + constitutes a positively charged laminate, an anion An-can be inserted by the expanded interlayer spacing; the invention further discloses a preparation method of the low-
dielectric film based on the layered compound. The film has excellent
dielectric properties (klt; 1.9), a low
dielectric loss (lt; 0.02), the insulation property is good, and meanwhile, the excellent Young's modulus (YMgt; 20 GPa), the
mechanical strength meets the requirements of a rear-end
interconnection medium, and the material has a wide practical application prospect in the
chip rear-end
interconnection industry; meanwhile, the material can be used as a
transistor insulating layer material, interface traps of a
thin film transistor insulating layer and an
active layer are reduced, and the carrier mobility and on-off ratio of a
transistor are improved.