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67results about How to "Reduce conductive resistance" patented technology

Conducting ring, power supply device based on conducting ring and electroplating jig based on power supply device

The invention discloses a conducting ring, a power supply device based on the conducting ring and an electroplating jig based on the power supply device. The conducting ring comprises a conducting ring body. The conducting ring body is distributed in a sectional type structure and is composed of a plurality of conducting sections. Every two adjacent conducting sections are isolated after a brokenopening between the two adjacent conducting sections is filled with insulation paste. The surface of the conducting ring body is wrapped with an insulation paste layer. The conducting ring body is provided with at least one electrode and at least one supporting leg. The conducting ring is evenly divided into the multiple sections, each section can independently carry out current control, so that the consistence and the uniformity of current distribution density of a wafer or a whole printed circuit board are ensured, and the quality of a surface electroplating layer of the conducting ring is guaranteed; and a traditional conducting ring body is additionally provided with a nickel-plated layer and a silver-plated layer, the conducing impedance is reduced, the stability of transmitting currents of conducting ring is enhanced, the frequency of repairing and changing the conducting ring body is reduced, and the repairing cost is reduced.
Owner:SHENZHEN CHENGGONG CHEM

Back passivation matrix dot type laser grooving conductive structure

The invention discloses a back passivation matrix dot type laser grooving conductive structure. The structure comprises a silicon wafer substrate, wherein the back face of the silicon wafer substrateis provided with lamination back passivation film, and back electrode main gate regions are arranged at intervals on the lamination back passivation film; laser grooving is carried out on non-back electrode main gate regions on the lamination back passivation film through a lamination back passivation film in a wave band of 500-1200 nanometers to from a repeating dot group structure unit, whereinthe repeating point group structure unit is composed of 2-18 circular-aperture-shaped laser spots overlapping 3%-17% of a circular area region, and the intervals of center points of the repeating point group structure unit are 0.2-1.0 millimeters. The laser grooving conductive structure has the advantage that a back conduction plane can be divided into smaller conductive structure units, so that the photo-generated current conduction path is shortened, the transmission collecting capacity of current carriers is improved, lattice damage and composite damage of the battery silicon wafer substrate caused by the laser grooving can be reduced, and the photovoltaic conversion efficiency and assembly reliability of single polycrystalline silicon back passivation local back contact solar cell areimproved.
Owner:TONGWEI SOLAR (ANHUI) CO LTD

Method for preparing transparent glass-based double-layer circuit board

The invention provides a method for preparing a transparent glass-based double-layer circuit board. The method comprises the following steps: trepanning on a glass substrate, mounting a hollow copper tube, printing and curing conductive paste on the glass substrate in sequence, finally maintaining the glass substrate in a high temperature environment for a period of time, and then cooling the glass substrate to the normal temperature to fuse the conductive paste and the glass substrate to integrally form conductive circuits, wherein the conductive circuits are distributed on the surface of the glass substrate and become a part of the glass substrate, and the two conductive circuits are conducted by the hollow copper tube to obtain the transparent glass-based double-layer circuit board. According to the method provided by the invention, common glass is used as an insulating board, compared with the existing double-sided wiring printed circuit board, the prepared transparent glass-based double-layer circuit board can guarantee high transparency, the transparency exceeds 90%, the cost is low, the conductive paste printed on the glass substrate is prepared in such a manner that single surfaces are cured in sequence and then are simultaneously fused, so that the double layers of conductive circuits are formed in on piece, the quality of the double layers of conductive circuits is consistent, and thus the product quality is guaranteed.
Owner:WUHAN HSURICH TECH CO LTD

Manufacturing method for high-conduction transparent glass-based circuit board

The invention provides a manufacturing method for a high-conduction transparent glass-based circuit board. The manufacturing method comprises the steps of printing conductive paste; then performing sintering, fusing and secondary coating to form a glass plate with a circuit layer; and finally welding elements through a reflow welding technology. According to the manufacturing method for the high-conduction transparent glass-based circuit board provided by the invention, the manufacturing of the high-conduction transparent glass-based circuit board can be realized; the light transmittance of the manufactured high-conduction transparent glass-based circuit board is greater than 90%; meanwhile, the manufactured high-conduction transparent glass-based circuit board has the superconducting capability, and the conducting impedance is lower than 5*10<-8>omega; the manufactured high-conduction transparent glass-based circuit has no medium bonding, so that the circuit layer has high heat conducting capability in high-power applications; and in addition, the circuit layer and the glass plate molecules are tightly fused, so that electronic element patching through an SMD can be realized, and the elements do not fall off easily.
Owner:WUHAN HSURICH TECH CO LTD

High-conductivity and high-voltage solar photoelectric glass plate

The invention provides a high-conductivity and high-voltage solar photoelectric glass plate. The high-conductivity and high-voltage solar photoelectric glass plate comprises two glass substrates; a conductive circuit that conductive slurry printed on the air surface of the glass substrate is fused with the surface of the glass substrate after being baked, heated and cooled is arranged on the surface of each glass substrate; a solar wafer, the electrodes of which are positioned on the two surfaces, is clamped between the two glass substrates; the two electrodes of the solar wafer are connected with bonding pads of the conductive circuits of the two glass substrates through a tin layer respectively; the edges of the two glass substrates are each provided with sealant; the glass substrates are tempered glass substrates; and a PCB organic solder mask covers the surface of the conductive circuit, except the part of the bonding pad for welding the solar wafer. The high-conductivity and high-voltage solar photoelectric glass plate disclosed by the invention has the characteristics of being high in conductivity and light transmittance; the high-conductivity and high-voltage solar photoelectric glass plate has good heat conductive capability while being applied with high power; and thus, the high-conductivity and high-voltage solar photoelectric glass plate can be used in scenes in need of large-area light transmission, such as agricultural greenhouse ceilings.
Owner:WUHAN HSURICH TECH CO LTD

TFT array substrate structure and manufacturing method

The invention discloses a TFT array substrate structure and a manufacturing method. The method comprises the steps: depositing a shading layer on a substrate, and manufacturing a buffering layer; manufacturing a first active layer and a second active layer; patterning the first active layer and the second active layer; manufacturing a gate insulating layer on the first active layer, and manufacturing a metal gate layer on the gate insulating layer; manufacturing a passivation layer, a first through hole, a second through hole and a third through hole, wherein the second through hole and the third through hole are formed in the two sides of the metal gate layer respectively; manufacturing a metal source electrode and a metal drain electrode, wherein the metal source electrode is connected with the shading layer through the first through hole, the metal source electrode is connected with the first active layer through the second through hole, and the metal drain electrode is connected with the first active layer through the third through hole; manufacturing a flat layer, and manufacturing a fourth through hole; and manufacturing an electrode layer, and connecting the electrode layerwith the metal drain. By means of the process, damage to the first active layer in the preparation process of the TFT array substrate is reduced, so that the effect of protecting the first active layer thin film is achieved, meanwhile, electrical drifting of a device is reduced, and the performance of the thin film transistor is improved.
Owner:FUJIAN HUAJIACAI CO LTD

Circuit board glass substrate manufactured from alkali-free glass fiber waste silk and preparation method thereof

The invention discloses a circuit board glass substrate manufactured from alkali-free glass fiber waste silk and a preparation method thereof, and belongs to the technical field of circuit board materials. According to the circuit board glass substrate manufactured from alkali-free glass fiber waste silk, the alkali-free glass fiber waste silk is adopted as a raw material for manufacturing the circuit board glass substrate, the obtained glass substrate and a conducting circuit are in the fusion relation, the relation is compact, the super-conductivity is achieved, and the conductive resistance is lower than 5*10<-8> omega; the glass substrate and the conductive circuit are in dielectric-free combination, the circuit layer has the good heat conductivity during high-power application, the circuit layer and the glass substrate are in molecular tight fusion, and peeling is likely to be achieved; high light transmittance can be ensured, and the light transmittance exceeds 95%; the surface of the glass substrate is flushed with the upper surface of the conducting circuit, the surface of the while glass substrate circuit board is smooth, and the conducting circuit is not likely to be damaged.
Owner:江苏顺德缘文化科技股份有限公司

Conductive connection structure for cylindrical power battery modules

PendingCN106654135AReduce the amount of assemblyAssembly is simple and easyCell component detailsElectrical batteryNickel
The invention discloses a conductive connection structure for cylindrical power battery modules. The conductive connection structure comprises nickel sheets, holders, cells, battery modules and an elastic sheet type convergence plate. The conductive connection structure is characterized by that the conductive connection structure of front holders and front nickel sheets, and the elastic sheet type convergence plate, rear nickel sheets and rear holders is employed between adjacent battery modules. Compressing structures are employed among front nickel sheets, the elastic sheet type convergence plate and the rear nickel sheets. The adjacent battery modules are in compressing connection through locking elements. According to the conductive connection structure, a traditional convergence plate structure is changed; moreover, a conductive connection mode between the cell modules is improved, the conductive distance is optimized; through compressing connection of the battery modules and the elastic sheet type convergence plate, potential safety hazards resulting from screw fall-off are reduced; compared with the screw fastening convergence plate, the elastic sheet type convergence plate has the advantage that the weight is reduced; most importantly, through adoption of the elastic sheet type convergence plate, the current transmission distance between the two battery modules is the shortest; the resistance is reduced; and direct connection between an anode and a cathode is achieved.
Owner:JIANGXI DIBIKE

Probe and connector suitable for large-current high-speed signal testing

The invention discloses a probe and a connector suitable for a large-current high-speed signal testing. The probe comprises a first contact part, a first elastic part, a connecting part, a second elastic part and a second contact part, the first elastic part comprises a first linear part, a first bent part and a second linear part; the first linear part extends in the direction perpendicular to the axial direction, and one end of the first linear part is connected with the other end of the first contact part; the second linear part extends in the direction perpendicular to the axial direction,and one end of the second linear part is connected with the connecting part; the first bending part is of a C-like structure, one end of the first bending part is connected with the first linear part, and the other end is connected with the second linear part; the distance between the first linear part and the second linear part is smaller than the maximum inner diameter of the first bent part inthe axial direction; the connecting part is used for connecting the second linear part and the second elastic part; according to the probe provided by the invention, the elastic force of the elasticpart can be reduced while the cross sectional area is increased, and the probe and a contact object thereof are prevented from being damaged due to overlarge elastic force/clamping force.
Owner:武汉精毅通电子技术有限公司 +1

Transparent glass-based double-layer circuit board

The invention provides a transparent glass-based double-layer circuit board. The circuit board includes a glass substrate which is evenly distributed thereon with electric guide holes which penetrate the glass substrate. Each electric guide hole is provided with a hollow copper tube therein with a length equal to the thickness of the glass substrate. An end surface of the hollow copper tube is level with the surface of the glass substrate. The upper surface and the lower surface of the glass substrate are both provided with a conducting circuit which is fused with the surface of the glass substrate. The two conducting circuits are electrically on through the hollow copper tubes. Each conducting circuit is made of graphene, or a conducting layer constituted by a surface layer which is graphene and a bottom layer which is a layer fused with the glass substrate, and the contact surfaces of the graphene and the metal are fused mutually. According to the invention, the circuit board adopts tempered glass as an insulation plate, by fused fixing of the conducting circuits on the upper surface and the lower surface of the glass substrate, achieves the formation of a double layer, can increase the carrying capacity of an electric element by one time than traditional glass substrate having the same area, and greatly reduces the size of a circuit board.
Owner:WUHAN HSURICH TECH CO LTD

Fuel battery shell and fuel battery device with stable output power

The invention discloses a fuel battery shell which comprises a first storage box for electrolyte heat exchange, an electrochemical reaction cavity for electrolyte reaction, a mixture accommodating cavity for accommodating reactants and electrolyte, a filtering device for filtering the reactants and a second storage box for accommodating reacted and filtered electrolyte, wherein the first storage box, the electrochemical reaction cavity, the mixture accommodating cavity, the filtering device and the second storage box are arranged in sequence from top to bottom; the first storage box is communicated with the electrochemical reaction cavity through a first communicating part; the electrochemical reaction cavity is communicated with the mixture accommodating cavity through a second communicating part; the mixture accommodating cavity is communicated with the second storage box through the filtering device. The invention further discloses a fuel battery device with stable output power, which adopts the fuel battery shell. By a simple structure, the fuel battery shell can automatically discharge the reactants, so that the phenomenon that the output power is unstable due to the continuous influence of the reactants on the electrolyte is avoided.
Owner:苏州讴德新能源发展有限公司

Novel single-layer gas diffusion layer for fuel cell and preparation method and application of novel single-layer gas diffusion layer

The invention relates to a single-layer gas diffusion layer for a fuel cell and a preparation method and application of the single-layer gas diffusion layer, the gas diffusion layer only comprises a microporous layer, the microporous layer takes a carbon material, a hydrophobic binder and a pore-forming agent as raw materials, carbon-free paper and a self-supporting microporous layer are prepared through dry-method mold pressing, and the single-layer gas diffusion layer has good hydrophobicity, gas permeability and conductivity, and the resistance of water discharge can be reduced, so that cathode flooding is relieved. The dry-method preparation avoids the defect that cracks are generated on the surface due to solvent volatilization in a wet method, so that water logging caused by water gathering at the cracks is avoided. According to the prepared carbon-free paper, the thickness and porosity of the self-supporting microporous layer are controllable, the preparation process is simple, and conditions are mild. When the carbon-free paper and the self-supporting microporous layer prepared by the method are used as gas diffusion layers of fuel cells, relatively good electrochemical performance is achieved. The novel single-layer gas diffusion layer has wide application value in the field of fuel cells.
Owner:DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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