A structure to enhance the contact strength of electronic circuit surface

Abstract

The invention discloses a structure for strengthening surface contract strength of an electronic circuit. The structure is used in communication products. The structure comprises an electronic circuit body and strengthening materials evenly coating the electronic circuit body, and the electronic circuit body is connected with a main board through the strengthening materials. The strengthening materials of the structure for strengthening the surface contract strength of the electronic circuit can be metal sheets, conductive double sticky tape and conductive glue respectively, the strengthening materials can also be in the mode of combining the metal sheets and the conductive double sticky tape, conductive glue or combining the metal sheets and the conductive glue, the metal sheets are fixedly connected with the electronic circuit body through the conductive double sticky tape or the conductive glue, and therefore the electronic circuit body is not damaged when connected with other parts, and the contact stability of the structure is greatly improved.

Description

technical field [0001] The invention relates to the communication field, in particular to a structure for strengthening the surface contact strength of an electronic circuit. Background technique [0002] With the rapid development of communication technology, the update of the antenna part is very rapid, from external to internal, among which, the preparation of metal shrapnel antenna, FPC / PCB antenna, printed antenna and LDS (Laser Direct structuring, laser direct structuring) antenna more and more. Especially with the rapid development of wireless communication in recent years, mobile terminals occupy a dominant position. In particular, mobile terminals are gradually developing toward miniaturization and intelligence, and communication antennas as mobile terminals have become extremely important. [0003] In the current mobile terminal products, especially in the production of the circuit (PPA, PadPrint Antenna) made by printing conductive ink, the material of the elect...

AI Technical Summary

Problems solved by technology

[0003] In the current mobile terminal products, especially in the production of the circuit (PPA, PadPrint Antenna) made by printing conductive ink, the material of the electronic circuit used is generally made of nano-silver. The electronic circuits produced by it are easily damaged when they come into contact with the contact points on the main board of the mobile terminal, resulting in failure of the contact between the electronic circuit and the main board

[0004] However, in conventional products of the prior art, in order to solve the problem of contact failure of the circuit (PPA) made by pad printing conductive ink, it is generally here In this contact method, a soft conductive material is used to connect the two, such as using conductive foam to connect the two. However, although this connection method can avoid damage to the electronic circuit when the two are in contact, because the conductive foam is connected, The contact resistance between each other is large, and the electrical performance is unstable, which is not conducive to the reliable transmission of communication signals

[0005] Therefore, it is necessary to propose a structure that strengthens the surface contact strength of electronic circuits to solve a series of effects caused by poor contact of electronic circuits in the prior art

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