Circuit board glass substrate manufactured from alkali-free glass fiber waste silk and preparation method thereof

A technology of alkali-free glass fiber and glass substrate, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., and can solve the problems of inability to place components on substrates, high wiring density of glass substrates, and high production costs

Active Publication Date: 2017-09-22
江苏顺德缘文化科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in the process of producing PCB boards with glass fiber substrates and substrates in the prior art, when the epoxy glass fiber board and the substrate are pressed togeth

Method used

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  • Circuit board glass substrate manufactured from alkali-free glass fiber waste silk and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] Example 1:

[0024] Using alkali-free glass fiber waste as raw material, the chemical composition percentage is as follows, SiO 2 : 60%; TiO 2 : 3%; Al 2 O 3 : 15%; Fe 2 O 3 : 0.35%; CaO: 18%; LiO 2 : 1.0%; MgO: 2.5%; Na 2 O: 0.25%; K 2 O: 0.25%; CeO 2 : 0.5%, GeO 2 : 0.5%.

[0025] The chemical composition weight percent of the alkali-free glass fiber waste is SiO 2 : 60%; TiO 2 : 3%; Al 2 O 3 : 15%; Fe 2 O 3 : 0.35%; CaO: 18%; LiO 2 : 1.0%; MgO: 2.5%; Na 2 O: 0.25%; K 2 O: 0.25%; CeO 2 : 0.5%, GeO 2 : 0.5%.

[0026] The preparation method of the circuit board glass substrate made of the alkali-free glass fiber waste described in this embodiment is as follows:

[0027] 1) According to the above proportioning requirements, weigh the chemical components of the glass raw materials except alkali-free glass fiber waste filaments. After preliminary mixing, use the ND7-2L planetary ball mill to wet ball mill (60 ~ 100 rpm, 3h) to make the raw materials. ...

Example Embodiment

[0030] Example 2:

[0031] Using alkali-free glass fiber waste as raw material, the chemical composition percentage is as follows, SiO 2 : 57%; TiO 2 : 1.5%; Al 2 O 3 : 8%; Fe 2 O 3 : 0.3%; CaO: 15%; LiO 2 : 1.5%; MgO: 2.5%; Na2 O: 0.3%; K 2 O: 0.5%; CeO 2 : 0.2%, GeO 2 : 0.2%.

[0032] The processing method is the same as that of Example 1, and the obtained circuit board glass substrate sample made of alkali-free glass fiber waste wire is marked as sample B.

Example Embodiment

[0033] Example 3:

[0034] Using alkali-free glass fiber waste as raw material, the chemical composition percentage is as follows, SiO 2 : 65%; TiO2: 3.5%; Al 2 O 3 : 17%; Fe 2 O 3 : 0.4%; CaO: 25%; LiO 2 : 2.5%; MgO: 3%; Na 2 O: 1.5%; K 2 O: 1.5%; CeO 2 : 0.5%, GeO 2 : 0.5%.

[0035] The processing method is the same as that of Example 1, and the obtained circuit board glass substrate sample made of alkali-free glass fiber waste wire is marked as sample C.

[0036] The following table shows the test comparison of the performance of the experimental test glass substrate circuit board

[0037]

[0038] It can be seen from the table that these three cases of circuit boards made of glass fiber are better than ordinary glass-based circuit boards in terms of conductivity and other indicators.

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Abstract

The invention discloses a circuit board glass substrate manufactured from alkali-free glass fiber waste silk and a preparation method thereof, and belongs to the technical field of circuit board materials. According to the circuit board glass substrate manufactured from alkali-free glass fiber waste silk, the alkali-free glass fiber waste silk is adopted as a raw material for manufacturing the circuit board glass substrate, the obtained glass substrate and a conducting circuit are in the fusion relation, the relation is compact, the super-conductivity is achieved, and the conductive resistance is lower than 5*10<-8> omega; the glass substrate and the conductive circuit are in dielectric-free combination, the circuit layer has the good heat conductivity during high-power application, the circuit layer and the glass substrate are in molecular tight fusion, and peeling is likely to be achieved; high light transmittance can be ensured, and the light transmittance exceeds 95%; the surface of the glass substrate is flushed with the upper surface of the conducting circuit, the surface of the while glass substrate circuit board is smooth, and the conducting circuit is not likely to be damaged.

Description

technical field [0001] The invention belongs to the technical field of circuit board materials, and in particular relates to a circuit board glass substrate made from alkali-free glass fiber waste and a preparation method thereof. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For the printed circuit board industry, which is the basic industry, high density, small volume, and high density are proposed. Higher requirements such as conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The quality of printed circuit boards puts forward many specific and clear technical requirement...

Claims

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Application Information

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IPC IPC(8): C03C3/095C03C10/00C03C13/00C03C14/00C03C17/00H05K1/03
CPCC03C3/095C03C10/0036C03C13/00C03C14/002C03C17/002C03C17/009C03C2217/445C03C2217/475C03C2217/479H05K1/0306
Inventor 宋福贵李淑萍
Owner 江苏顺德缘文化科技股份有限公司
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