Manufacturing process of high-conductivity and high-voltage solar photovoltaic glass panels

A manufacturing process and glass plate technology, which is applied in sustainable manufacturing/processing, conductive layers on insulating carriers, circuits, etc., can solve the problem of limited conduction rate of solar photoelectric glass plates, expensive butt welding machines, and bottom plate conduction rate Limited and other problems, to achieve the effect of high light transmittance, light weight, and dense molecular arrangement

Active Publication Date: 2017-05-10
WUHAN HSURICH TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Due to the large current and strong voltage that solar photovoltaic glass needs to withstand, it needs to have a very strong electrical conductivity. However, the solar photovoltaic glass produced by this traditional process has limited conduction rate due to the bottom plate with electronic circuits. The conductivity of the glass plate is very limited
At the same time, the butt welding process makes the interconnection between the circuits very strong. Only one side is covered with glass, and the solar chip assembly is under pressure on the glass. It is easy to cause short circuit, there is a great safety hazard, it is difficult to pass the 3C safety certification, and the butt welding machine is expensive and inefficient
In addition, traditional solar photovoltaic glass panels are opaque, and their application is very limited

Method used

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Embodiment Construction

[0031] The present invention will be further described below in conjunction with embodiment.

[0032] The invention provides a high conduction and high voltage solar photoelectric glass plate manufacturing process, comprising the following steps:

[0033] (1) Fabricate a high-conductivity transparent glass-based circuit board through the following process:

[0034] (a) Print the conductive paste on the air surface of the glass plate; the conductive paste is composed of conductive powder, low-temperature glass powder, B Base cellulose, terpineol and dibutyl maleate, wherein the conductive powder is a mixture of graphene powder or metal powder and graphene powder; if the conductive powder is a mixture of metal powder and graphene powder, graphite The mass percentage of olefin powder in the conductive paste is 2‰~5%;

[0035] (b) baking the glass plate covered with the conductive paste at a temperature of 120-150° C. for 100-200 seconds;

[0036] (c) Place the glass plate in a t...

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PUM

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Abstract

The invention provides a manufacturing technology of a high-conductivity and high-voltage solar photoelectric glass board. The technology comprises the following steps: firstly, printing conductive paste; forming a glass board with a circuit layer through sintering, fusing and secondary covering to prepare a high-conductivity transparent glass-based circuit board; and finally welding a solar wafer by a reflow soldering technology. The high-conductivity transparent glass-based circuit board prepared by the middle step is high in light transmittance and high in conductivity; a complete circuit comprising the solar wafer and a conducting circuit can efficiently run; the solar wafer is not easily peeled off after being welded; and the finally prepared high-conductivity and high-voltage solar photoelectric glass board also has high light transmittance and can be applied to the scenes, such as an agricultural greenhouse ceiling, of requiring large-area light transmission.

Description

technical field [0001] The invention relates to a high-conduction high-voltage solar photoelectric glass plate manufacturing process, which belongs to the field of electronic device manufacturing. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For its basic industry—the printed circuit board industry, it has proposed high-density, small-volume, Higher requirements such as high conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The process and quality of printed circuit boards have put forward many specific and clear technical specifications. [0003] Traditional solar photo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/18H01B5/14
CPCH01B5/14H01L31/18Y02P70/50
Inventor 尤晓江
Owner WUHAN HSURICH TECH CO LTD
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