The application discloses an ultrasonic probe, an
ultrasonic imaging system and a preparation method. The ultrasonic probe comprises a
transducer assembly, and the
transducer assembly comprises a matching layer, a piezoelectric layer having opposite first and second surfaces, the second surface of the piezoelectric layer being connected to the matching layer, the piezoelectric layer comprising a plurality of array elements arranged in an array, a flexible circuit board comprising an insulating substrate and a plurality of conductive parts, the insulating substrate being connected to the first surface of the piezoelectric layer, the plurality of conductive parts being arranged on the side of the insulating substrate facing the piezoelectric layer, a backing connected to the side of the insulating substrate away from the piezoelectric layer, a conductive
adhesive used for bonding the insulating substrate and the piezoelectric layer, the conductive
adhesive comprising a plurality of conductive particles, the conductive particles being used for conducting the array elements and the conductive parts, and a containing structure used for containing the conductive particles and limiting the movement of the conductive particles, the first surface of each
array element being provided with the containing structure, so that the first surface of each
array element is conducted with one conductive part, and the conduction rate of the array elements is improved.