41results about How to "Improve conduction rate" patented technology

The invention discloses a manufacturing method of a high-density interconnected printed circuit board, which mainly comprises the following steps that: the high-density interconnected printed circuit board is divided into a core layered structure, an outer layered structure and a plurality of middle layered structures which are respectively manufactured and finally pressed in; and the method for manufacturing the core layered structure, the outer layered structure and each middle layered structure is to press protective films onto copper foil base plates with made lines, drill through holes, fully fill conductive paste into the through holes and remove the protective films, so that the conductive paste is protruded out of the surfaces of the copper foil base plates. According to the method, the processing procedures are simple, the repeat of electroplating and hot pressing is reduced, the energy is saved, the environment is protected, and the production efficiency and the yield are high.

The embodiment of the invention provides a display assembly and an organic light emitting diode display. The display assembly comprises a first connecting piece and a second connecting piece, and is characterized in that the first connecting piece is provided with a plurality of first connecting terminals which are arranged along a first direction at intervals, the first connecting terminals extend along a second direction, the second connecting piece is provided with a plurality of second connecting terminals which are arranged at intervals, an included angle between an extending direction of at least one of the second connecting terminals and the second direction is an acute angle, and the first connecting terminal are connected with the second connecting terminals in a one-to-one correspondence manner. In the invention, excellent connection between the first connecting terminals and the first connecting terminals can be ensured even if the second connecting terminals are deformed in the process of connecting the second connecting terminals and the first connecting terminals, so that the conduction rate and the connection stability of the display assembly are improved.

The invention provides a manufacturing method for a high-conduction transparent glass-based circuit board. The manufacturing method comprises the steps of printing conductive paste; then performing sintering, fusing and secondary coating to form a glass plate with a circuit layer; and finally welding elements through a reflow welding technology. According to the manufacturing method for the high-conduction transparent glass-based circuit board provided by the invention, the manufacturing of the high-conduction transparent glass-based circuit board can be realized; the light transmittance of the manufactured high-conduction transparent glass-based circuit board is greater than 90%; meanwhile, the manufactured high-conduction transparent glass-based circuit board has the superconducting capability, and the conducting impedance is lower than 5*10<-8>omega; the manufactured high-conduction transparent glass-based circuit has no medium bonding, so that the circuit layer has high heat conducting capability in high-power applications; and in addition, the circuit layer and the glass plate molecules are tightly fused, so that electronic element patching through an SMD can be realized, and the elements do not fall off easily.

The present invention discloses a plugging protection ammeter and an application method thereof. The ammeter comprises an ammeter body, an ammeter connection piece, an ammeter plug, wiring piles, connection outer pipes, a metal insertion pipe, a protruding groove, connection inner pipes, grooves and a metal casing pipe. The inner walls of the connection outer pipes on the ammeter connection piece are provided with the metal insertion pipe for installation and insertion to firmly connect the metal insertion pipe with the metal casing pipe, the ammeter plug employs grooves at the outer side to perform concave and convex occlusion connection with the grooves on the ammeter connection piece so as to avoid dropping off and facilitate the mounting and dismounting of the ammeter and the ammeter connection piece, the wiring piles are connected with different lines and are communicated with the ammeter body through the connection of the metal insertion pipe and the metal casing pipe so as to reduce the probability of workers' wiring error, the connection inner pipes are installed and inserted into the connection outer pipes to connect the metal insertion pipe with the metal casing so as to ensure the contact area of a conductor and a wiring hole and facilitate flexible mounting and dismounting.

The invention provides a composite electrode material and a preparation method and application thereof.The composite electrode material comprises a pole piece base body and an artificial solid electrolyte layer wrapping the surface of the pole piece base body, the artificial solid electrolyte layer is composed of a first polymer, and the structure of the first polymer is shown in the formula I; wherein n is equal to 10 to 1000; the pole piece substrate is at least one of lithium metal or a composite material containing metal lithium. According to the invention, the ether-containing side group copolymer is used as the artificial solid electrolyte layer to coat the surface of the electrode substrate to protect the electrode substrate, the solid electrolyte layer interface has high ion conduction rate and strong lithium affinity, the electrolyte is prevented from reacting with the electrode substrate while inducing uniform deposition of lithium ions, the interface of the electrode substrate is stabilized, and the service life of the electrode substrate is prolonged. And therefore, the consumption of the electrolyte is reduced.

The invention discloses a photo-electrochemical cell with a needle electrode and a manufacturing method thereof. The cell at least comprises: a working electrode, a counter electrode, an electrolyte layer and a light-sensitive layer. The working electrode is a needle electrode which is formed by a semiconductor film and possesses a needle structure. The needle electrode is prepared through a sol-gel method at a low temperature so that a specific surface area of the needle electrode can be increased. More dyes can be adsorbed. An electronic conductivity rate can be raised so as to improve a photoelectric current and a photoelectric conversion efficiency.

The invention discloses a RGO/TiO2/Ag aerogel-type photocatalyst and a preparation method and application thereof. The preparation method comprises the steps: using graphene oxide, butyl titanate andsilver nitrate as raw materials, and adopting a thermal reduction method, an ultraviolet light illumination reduction method and a freeze drying sequentially. The catalyst has an aerogel structure, alarge specific surface area, high adsorption capacity, a high constitutive property and easy recovery.

The invention provides a current collecting structure of a battery, the battery comprises a battery cell, the current collecting structure comprises a current collecting disc and a current collecting column, one end face of the current collecting disc is welded with one electrode end face of the battery cell, and the other end face of the current collecting disc is welded with the current collecting column; and the current collecting column comprises a welding disc and an annular boss formed on the welding disc, a through hole matched with the annular boss is formed in the current collecting disc, the protruding height of the annular boss is the same as the depth of the through hole, and the annular boss is welded and fixed to the current collecting disc at the position of the through hole. According to the current collecting structure, the contact area between the current collecting disc and the current collecting column is increased, and the girth welding is carried out in a seam welding manner, so that large current can pass through the current collecting structure, the rate capability of the battery is improved, the space is saved, more electric quantity can be stored in the same space, and the energy density is relatively high. When a large current passes through the current collecting structure provided by the invention, the conduction rate of the current is high, the resistance is low, and the heating rate is small.

The invention provides wire test equipment, which comprises a conduction column, a contact block fastener and a wire pressing head, wherein a groove is arranged in the contact block fastener; a through hole is formed in the bottom of the groove; a wire contact block with a groove structure is arranged in the groove; the conduction column passes through the through hole and is fixedly connected with the bottom of the groove of the wire contact block; a convex pressing head matched with the groove structure of the wire contact block is arranged on the wire pressing head; the convex pressing headis used for pressing a to-be-tested wire when the to-be-tested wire is put into the groove structure of the wire contact block, wherein the wire contact block and the conduction column are conductors; and the contact block fastener and the wire pressing head are insulators. The wire test equipment provided by the invention is used for overcoming the defect of poor contact between the wire and a test instrument when testing the wire, and improving the accuracy rate of a wire test.

The invention provides a manufacturing method of an implantable medical device. The manufacturing method comprises the following steps: providing an implantable electrode, wherein the electrode comprises a stimulation end and a connecting end, and the connecting end is provided with N connecting end bonding pads; providing a chip, wherein N chip bonding pads are arranged on the first surface of the chip at intervals; arranging an anisotropic conductive material on the chip bonding pads, and attaching the electrode to the chip bonding pads, so that the connecting end bonding pads and the chip bonding pads are aligned one by one; and carrying out hot pressing on the electrode and the chip which are attached, applying pressure to the second surface of the chip and the surface, facing away from the chip, of the connecting end, connecting the chip bonding pads with the connecting end bonding pads through the anisotropic conductive material, and conducting the chip bonding pads and the connecting end bonding pads only in the direction perpendicular to the first surface in a power-on state. According to the manufacturing method, an integrated circuit board is not needed for switching, theconnection efficiency, the connection strength and the conduction rate of the chip and the electrode are high, and the method is particularly suitable for connection of the high-density implantable electrode and the chip. The invention further provides an implantable medical device. The medical device is not provided with an integrated circuit board, and is simple in structure.

The invention provides a high-conductivity discharge electrode, which is used for in vitro impact wave stone crushers, and is used as a generating device of an impact wave source. A high-price electrolyte solution is used as a conductive medium instead of water so as to improve the discharge ability of an electrode; silica gel, latex or other materials capable of transmitting impact waves are selected, a support jacket is additionally arranged on an original electrode, and the high-price electrolyte solution dissolved in water is poured and filled through the top of the support jacket. The high-conductivity discharge electrode is high in high conductivity, is stable in discharge channel, is low in treatment voltage, and is long in service life.

The invention relates to the technical field of electric equipment, in particular to a VFTO suppression device and a GIS device using the VFTO suppression device. The VFTO suppression device comprisesa conductive rod, wherein a magnetic ring string group is arranged on the outer peripheral surface of the conductive rod in a sleeved mode; the outer peripheral surface of the magnetic ring string group is sleeved with a resistance cylinder, and two ends of the resistance cylinder are provided with extending parts which exceed the magnetic ring string group in the length direction of the conductive rod respectively; an annular cavity is formed between the extending parts and the conductive rod; a jackscrew for fixing the resistance cylinder on the conducive rod is arranged on the extending parts in a penetrating mode; and the jackscrew penetrates through the annular cavity to be in contact with the conductive rod to realize conduction of the resistance cylinder and the conductive rod, andthe jackscrew is made of a conductive material. According to the VFTO suppression device, the problem that in the prior art, the processing and assembling of the conductive rod and the resistor is complex can be solved.

The invention relates to high-voltage coils, in particular to a high-voltage framework for a cation and anion generator and belongs to the technical field of high-voltage coils. The high-voltage framework comprises an insulating framework body. The side wall, facing a second secondary winding plate, of a first secondary winding plate is provided with a concave-convex structure. The concave-convex structure extends all the way to the end face of a primary winding slot from the upper end of the side wall of the second secondary winding plate. The upper end of the first secondary winding plate is connected with a first secondary long soldering pin and a first secondary short soldering pin. The upper end of the second secondary winding plate is provided with a secondary soldering pin base protruding outwards. The upper end of the secondary soldering pin base protruding outwards is connected with a second secondary long soldering pin and a second secondary short soldering pin. The high-voltage framework is simple, compact and reasonable in structure. The concave-convex structure enables epoxy resin to form an insulation structure on the side face of a primary winding, so that reliability of the product during long-term work is guaranteed, and the high-voltage framework is not prone to breakdown.

The invention relates to a 270-678MHz frequency hopping filter, a cathode of a PIN diode is welded to a mounting station, and the cathode of the PIN diode directly dissipates heat at the mounting station of a metal structure, so that the heat dissipation capability of the PIN diode can be remarkably improved, and the power capacity of the frequency hopping filter is improved; a negative high-voltage cut-off mode is provided, so that a technician can quickly and accurately realize connection between the PIN diode and a driving circuit of the PIN diode during welding, the conduction rate of thePIN diode is improved, and the damage rate of the PIN diode is reduced; and a low-pass filter is arranged to filter second, third and fourth harmonics of a pass band of 270-678MHz, so that the harmonic suppression capability of the frequency hopping filter reaches -65dB.