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A circuit board glass substrate made by using alkali-free glass fiber waste and its preparation method

A technology of alkali-free glass fiber and glass substrate, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., and can solve the problems of inability to place components on substrates, high wiring density of glass substrates, and high production costs

Active Publication Date: 2020-06-19
江苏顺德缘文化科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in the process of producing PCB boards with glass fiber substrates and substrates in the prior art, when the epoxy glass fiber board and the substrate are pressed together, components cannot be placed on the substrate, and all components can only be placed on the glass substrate. Lead to high wiring density of the glass substrate and high production cost

Method used

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  • A circuit board glass substrate made by using alkali-free glass fiber waste and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Using non-alkali glass fiber waste silk as raw material, the percentage of chemical composition is as follows, SiO 2 :60%;TiO 2 :3%;Al 2 o 3 : 15%; Fe 2 o 3 : 0.35%; CaO: 18%; LiO 2 : 1.0%; MgO: 2.5%; Na 2 O: 0.25%; K 2 O: 0.25%; CeO 2 :0.5%, GeO 2 :0.5%.

[0025] The chemical composition weight percent of described non-alkali glass fiber waste silk is SiO 2 :60%;TiO 2 :3%;Al 2 o 3 : 15%; Fe 2 o 3 : 0.35%; CaO: 18%; LiO 2 : 1.0%; MgO: 2.5%; Na 2 O: 0.25%; K 2 O: 0.25%; CeO 2 :0.5%, GeO 2 :0.5%.

[0026] The preparation method of the circuit board glass substrate made of alkali-free glass fiber waste silk as described in this embodiment is as follows:

[0027] 1) Weigh the glass chemical composition raw materials except alkali-free glass fiber waste silk according to the above ratio requirements, and after preliminary mixing, use ND7-2L planetary ball mill for wet ball milling (60-100 rpm, 3h) to make the raw materials Mix evenly; after drying, put ...

Embodiment 2

[0031] Using non-alkali glass fiber waste silk as raw material, the percentage of chemical composition is as follows, SiO 2 : 57%; TiO 2 : 1.5%; Al 2 o 3 : 8%; Fe 2 o 3 : 0.3%; CaO: 15%; LiO 2 : 1.5%; MgO: 2.5%; Na2 O: 0.3%; K 2 O: 0.5%; CeO 2 :0.2%, GeO 2 :0.2%.

[0032] The processing method is the same as in Example 1, and the obtained circuit board glass substrate sample made of alkali-free glass fiber waste is marked as sample B.

Embodiment 3

[0034] Using non-alkali glass fiber waste silk as raw material, the percentage of chemical composition is as follows, SiO 2 : 65%; TiO2: 3.5%; Al 2 o 3 : 17%; Fe 2 o 3 : 0.4%; CaO: 25%; LiO 2 : 2.5%; MgO: 3%; Na 2 O: 1.5%; K 2 O: 1.5%; CeO 2 : 0.5%, GeO 2 : 0.5%.

[0035] The processing method is the same as in Example 1, and the obtained circuit board glass substrate sample made of alkali-free glass fiber waste is marked as sample C.

[0036] The following table shows the test comparison of various performances of the glass substrate circuit board in the experiment

[0037]

[0038] It can be seen from the table that the electrical conductivity and other indicators of the circuit boards made of glass fibers in these three cases are better than ordinary glass-based circuit boards.

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Abstract

The invention discloses a circuit board glass substrate manufactured from alkali-free glass fiber waste silk and a preparation method thereof, and belongs to the technical field of circuit board materials. According to the circuit board glass substrate manufactured from alkali-free glass fiber waste silk, the alkali-free glass fiber waste silk is adopted as a raw material for manufacturing the circuit board glass substrate, the obtained glass substrate and a conducting circuit are in the fusion relation, the relation is compact, the super-conductivity is achieved, and the conductive resistance is lower than 5*10<-8> omega; the glass substrate and the conductive circuit are in dielectric-free combination, the circuit layer has the good heat conductivity during high-power application, the circuit layer and the glass substrate are in molecular tight fusion, and peeling is likely to be achieved; high light transmittance can be ensured, and the light transmittance exceeds 95%; the surface of the glass substrate is flushed with the upper surface of the conducting circuit, the surface of the while glass substrate circuit board is smooth, and the conducting circuit is not likely to be damaged.

Description

technical field [0001] The invention belongs to the technical field of circuit board materials, and in particular relates to a circuit board glass substrate made from alkali-free glass fiber waste and a preparation method thereof. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For the printed circuit board industry, which is the basic industry, high density, small volume, and high density are proposed. Higher requirements such as conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The quality of printed circuit boards puts forward many specific and clear technical requirement...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C3/095C03C10/00C03C13/00C03C14/00C03C17/00H05K1/03
CPCC03C3/095C03C10/0036C03C13/00C03C14/002C03C17/002C03C17/009C03C2217/445C03C2217/475C03C2217/479H05K1/0306
Inventor 宋福贵李淑萍
Owner 江苏顺德缘文化科技股份有限公司
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