High-conductivity transparent glass-based circuit board

Abstract

The invention provides a high-conductivity transparent glass-based circuit board. The high-conductivity transparent glass-based circuit board comprises a glass substrate, wherein the glass substrate is a tempered glass substrate, a conductive paste printed on an air surface of the tempered glass substrate is arranged on the surface of the tempered glass substrate and melted with a conductive circuit on the surface of the tempered glass substrate after roasting, heating and cooling, the surface of the tempered glass substrate is flush with the upper surface of the conductive circuit, and a part, except a bonding pad of a component to be welded, on the surface of the conductive circuit is coated with printed circuit board (PCB) organic soldering resistance paint. In the high-conductivity transparent glass-based circuit board, a melting relation is generated between the glass substrate and the conductive circuit, the glass substrate and the conductive circuit are in close link, the surface of the glass substrate is flush with the upper surface of the conductive circuit, the whole high-conductivity transparent glass-based circuit board is smooth in surface, the conductive circuit is difficult to damage, and the conduction capability is high.

Description

technical field [0001] The invention relates to a high-conductivity transparent glass-based circuit board, which belongs to the field of electronic device production. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For its basic industry—the printed circuit board industry, it has proposed high-density, small-volume, Higher requirements such as high conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The process and quality of printed circuit boards have put forward many specific and clear technical specifications. [0003] Traditional glass-based circuit boards are manufactur...

AI Technical Summary

Problems solved by technology

The coating etching process is to coat a layer of conductive paste on the surface of the glass plate, and use the etching method to make the circuit. The electronic circuit of this glass-based circuit board is combined with the glass plate through an adhesive. Since the glass molecules are compatible with any element except fluorine No chemical reaction can occur, so this coating process is basically a spraying process, which is a bonding process of organic materials mixed with conductive metal particles. The adhesive reduces the purity of the conductive paste and makes the conductivity very poor. The best material Also only 1×10 -4 Ω, it is difficult to solder electronic components, and it is also difficult to realize functional circuits

The low-temperature silver paste process is to screen-print low-temperature silver paste circuits on the surface of the glass plate, which is realized by baking and curing within 200°C. This method cannot achieve high conductivity because the silver paste also contains a large amount of organic bonding materials. Conductivity can only reach 3×10 -5 Ω, electronic components are still difficult to solder, poor adhesion

Due to the technical limitations of the above-mentioned traditional glass-based circuit board, in the glass-based circuit board produced, the connection between the glass plate and the conductive circuit is not close, the conductive circuit floats on the surface of the glass plate, and the surface of the entire glass-based circuit board is not smooth. Conductive lines are easily damaged and fall off, which eventually leads to poor conduction ability

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