Manufacturing method for high-conduction transparent glass-based circuit board

Abstract

The invention provides a manufacturing method for a high-conduction transparent glass-based circuit board. The manufacturing method comprises the steps of printing conductive paste; then performing sintering, fusing and secondary coating to form a glass plate with a circuit layer; and finally welding elements through a reflow welding technology. According to the manufacturing method for the high-conduction transparent glass-based circuit board provided by the invention, the manufacturing of the high-conduction transparent glass-based circuit board can be realized; the light transmittance of the manufactured high-conduction transparent glass-based circuit board is greater than 90%; meanwhile, the manufactured high-conduction transparent glass-based circuit board has the superconducting capability, and the conducting impedance is lower than 5*10<-8>omega; the manufactured high-conduction transparent glass-based circuit has no medium bonding, so that the circuit layer has high heat conducting capability in high-power applications; and in addition, the circuit layer and the glass plate molecules are tightly fused, so that electronic element patching through an SMD can be realized, and the elements do not fall off easily.

Description

technical field [0001] The invention relates to a high-conductivity transparent glass-based circuit board manufacturing process, which belongs to the field of electronic device manufacturing. Background technique [0002] As a national pillar industry, the electronics industry has developed rapidly in recent years, especially for terminal products that are light, thin, short, and small. For its basic industry—the printed circuit board industry, it has proposed high-density, small-volume, Higher requirements such as high conductivity. Circuit board technology has developed rapidly under this background, and industries in various weak current fields, such as computers and peripheral auxiliary systems, medical equipment, mobile phones, digital (camera) cameras, communication equipment, precision instruments, aerospace, etc. The process and quality of printed circuit boards have put forward many specific and clear technical specifications. [0003] Traditional glass-based circ...

AI Technical Summary

Problems solved by technology

The coating etching process is to coat a layer of conductive paste on the surface of the glass plate, and use the etching method to make the circuit. The electronic circuit of this glass-based circuit board is combined with the glass plate through an adhesive. Since the glass molecules are compatible with any element except fluorine No chemical reaction can occur, so this coating process is basically a spraying process, which is a bonding process of organic materials mixed with conductive metal particles. The adhesive reduces the purity of the conductive paste and makes the conductivity very poor. The best material Also only 1×10 -4 Ω, it is difficult to solder electronic components, and it is also difficult to realize functional circuits

The low-temperature silver paste process is to screen-print low-temperature silver paste circuits on the surface of the glass plate, which is realized by baking and curing within 200°C. This method cannot achieve high conductivity because the silver paste also contains a large amount of organic bonding materials. Conductivity can only reach 3×10 -5 Ω, electronic components are still difficult to solder, poor adhesion