Semiconductor device

Abstract

A semiconductor device superior in heat dissipating performance and permitting reduction of the packaging cost is provided. The semiconductor device comprises a sealing body formed of an insulating resin, a semiconductor chip positioned within the sealing body, the semiconductor chip having a gate electrode and a source electrode on a first main surface thereof and having a back electrode (drain electrode) on a second main surface thereof, a drain electrode plate projecting in a gull wing shape on one end side of the sealing body, an upper surface of a portion of the drain electrode plate which portion is positioned in the sealing body being exposed from the sealing body and a lower surface thereof being connected to the back electrode through an adhesive, a gate electrode plate projecting in a gull wing shape on an opposite end side of the sealing body and being connected to the gate electrode within the sealing body, a source electrode plate projecting in a gull wing shape on the opposite end side of the sealing body and being connected to the source electrode within the sealing body, a depression formed in the surface of the drain electrode plate within the sealing body and filled with the resin which forms the sealing body, and a projecting portion formed on the surface of the drain electrode plate within the sealing body and engaged with the sealing body. The drain electrode plate and the source electrode plate branch into plural branch pieces (leads) serving as gull wing-shaped surface mounting terminals.

Description

CROSS-REFERENCE TO RELATED APPLICATION [0001] The present application claims priority from Japanese patent application No. 2004-065413 filed on Mar. 9, 2004, the content of which is hereby incorporated by reference into this application. BACKGROUND OF THE INVENTION [0002] The present invention relates to a semiconductor device and a method of manufacturing the same. Particularly, the present invention is concerned with a technique applicable effectively to the manufacture of a semiconductor device wherein a semiconductor chip which generates a large amount of heat is sealed. [0003] As a high output semiconductor device there is known a semiconductor device wherein a semiconductor chip formed with a power transistor is incorporated within a sealing body. As examples of power transistors are mentioned power MOSFET (Metal Oxide Semiconductor Field-Effect-Transistor), IGBT (Insulated Gate Bipolar Transistor), and bipolar power transistor. [0004] A power MOSFET device is of a structure w...

AI Technical Summary

Benefits of technology

[0010] The present inventors have made studies about improving the heat dissipating performance of a high output semiconductor device having a sealing body formed of an insulating resin and also about reducing the packaging cost.

Problems solved by technology

As a result, the cost of the mounting substrate becomes high, obstructing the reduction of the packaging cost.

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