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132results about "Caliper-like sensors" patented technology

System and method to map thickness variations of substrates in manufacturing systems

Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted through) the substrate. The detected intensity values are used to determine a profile of a thickness of the substrate.
Owner:APPLIED MATERIALS INC

Thickness-distribution measurement device and thickness-distribution measurement metho

A thickness-distribution measurement device includes a light source; a light detector; and a control device. The light source irradiates a region of an object being conveyed with light, the region extending in a width direction. The light detector detects emitted light that has transmitted through the object. The control device obtains information on a distribution of a relative thickness of the object in the width direction based on a detection result in the light detector. The light detector includes an image sensor and a lens array. The image sensor includes a plurality of pixels arranged in the width direction, and detects an intensity of the emitted light for each pixel. The lens array includes a plurality of lenses having an equal magnification and arranged along the width direction, and collects the emitted light and forms an image of the emitted light on the image sensor.
Owner:HAMAMATSU PHOTONICS KK

Detecting depression cues in EEG signals using power spectral density based features for deep learning

The present invention relates to techniques for detection of depression cues in EEG signals using power spectral density-based features for deep learning. In an embodiment, a system for detecting depression in a person may comprise an Electroencephalogram (EEG) electrode array attached to the person, the EEG electrode array comprising at least ten electrodes adapted to read EEG signals, an amplifier, a filter, and an Analog to Digital Convert to digitize the read EEG signals, and computing circuitry comprising a processor, memory accessible by the processor, and computer program instructions stored in the memory and executable by the processor to perform: processing on the digitized read EEG signals to detect signal patterns indicative of depression in the person, and outputting a prediction indicating a likelihood of depression in the person based on the deep learning processing.
Owner:GENESIS INTELLIGENCE LLC

Device and method for measuring wafers

A device (14) and a method for measuring wafers (10), comprising an optical coherence tomograph (22) configured to generate a measuring light beam (24) and direct it onto the wafer (10) via an optical system (38), a scanning device (26) configured to deflect the measuring light beam (24) in two spatial directions, a control unit (36) configured to control the scanning device (26) so that the measuring light beam (24) successively scans the surface of the wafer (10) at several measuring points, and an evaluation unit (57) configured to calculate distance values ​​and / or thickness values ​​from interference signals provided by the optical coherence tomograph (22), and a camera (80) configured to capture an image of the surface of the wafer (10), wherein the camera (80) images camera light (83).which has passed through the optical system (38) at least partially from the wafer (10).
Owner:PRECITEC OPTRONIK GMBH

System and method to map thickness variations of substrates in manufacturing systems

Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted through) the substrate. The detected intensity values are used to determine a profile of a thickness of the substrate.
Owner:APPLIED MATERIALS INC

Optical inspection apparatus

An optical inspection device 2 for inspecting flat test objects 6 comprises a holder 4 for the test object 6 and two optical sensors 8, 10 for detecting the three-dimensional surface topography of the test object 6. According to the invention, the holder 4 is designed at least partially as a test standard and is arranged relative to the sensors 8, 10 such that the sensors 8, 10 probe the test object 4 from opposite sides and, when detecting the test object 6, also detect the holder 4 as a test standard, at least partially.
Owner:JENOPTIK IND METROLOGY GERMANY

Retraction mechanism and dimension-measuring device provided with same

A pneumatic cylinder type retraction mechanism includes a cylinder and a piston movable back and forth inside the cylinder, and causes the piston to move back and forth using an air pressure. In this retraction mechanism, sealing means is provided as stationary sealing means on an inner periphery of the cylinder facing an outer periphery of the piston. The sealing means suppresses leakage of pressurized air for actuating the piston from within the cylinder. The retraction mechanism having this characteristic is capable of achieving at least one of effects including reduction in starting resistance, improvement of measurement accuracy of a measuring device or shortening of measurement time.
Owner:TOKYO SEIMITSU CO LTD

Shape measuring device and method for calibrating shape measuring device

To provide a shape measuring device capable of calibrating the quantity of light, and to provide a calibration method of the shape measuring device.SOLUTION: A shape measuring device 1000 includes: an illumination section; an imaging section; and an image processing section for obtaining a contour shape of a measurement object on the basis of a shadow image of the measurement object generated by imaging the shade of the measurement object formed by illumination light applied from the illumination section by the imaging section while the plate-shaped measurement object is disposed between the illumination section and the imaging section in the case of measurement. The shape measuring device 1000 includes: a dimming filter section 2 disposed between the illumination section and the imaging section in the case of calibration; and a calibration section 33 for calibrating the quantity of light of illumination light applied from the illumination section on the basis of the quantity of received light received from the imaging section via the dimming filter section 2.SELECTED DRAWING: Figure 1
Owner:KOBELCO RES INST INC

Systems and methods for phase-shift interferometry utilizing in-SITU cavity calibration and laser non-linearity measurement

A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive, from the image capture device, a plurality of images for a continuous scan phase shift interferometry (PSI), wherein each image of the plurality of images includes a first plurality of pixels of a first item and a second plurality of pixels of a partial cavity; b) perform intensity scans of each pixel in the second plurality of pixels; c) identify zero transitions for each of the second plurality of pixels; and d) statistically evaluate the identified zero transitions by polynomial regression analysis.
Owner:GLOBALWAFERS CO LTD

Method and apparatus for tread measurement

A method and apparatus for measuring a thickness of a tire tread is disclosed. The method comprising the steps of: providing a tire tread having a first tread layer (160) formed of an electrically conductive compound and a second tread layer (130) formed of an electrically nonconductive compound; continuously conveying the tire tread; arranging a first sensor (150) and a second sensor (155) above and below the tire tread, respectively, wherein the first and second sensors (150, 155) being configured for emitting first and second radiation beams (152, 166), respectively, into the tire tread, and wherein the first and second sensors (150, 155) are connected together at a preferably fixed sensor distance or sensor height (D); receiving from the first radiation beam a first reflected radiation beam (162) from a surface (161) of the first tread layer (160) and determining a first distance (d1); receiving from the second radiation beam (166) a second reflected radiation beam (165) from an interface (141) of the first and second tread layers (160, 130) and determining a second distance (d2); receiving from the second radiation beam (166) a third reflected radiation beam (164) from a surface of the second tread layer (130) and determining a third distance (d3), and carrying out a material thickness measurement of the first and second tread layers (120, 160) by emitting the first and second radiation beams (152, 166) by the first and second sensors (150, 155), respectively, receiving the first, second, and third reflected radiation beams (162, 165, 164), and then determining a thickness (d4) of the first tread layer (160) using said first, second and third distances (d1, d2, d3) and said sensor distance or sensor height (D).
Owner:THE GOODYEAR TIRE & RUBBER CO

Wafer thickness measurement device and method for same

A wafer thickness measurement device of the present invention obtains, based on: first and second interferometer reference measurement results obtained by measuring, with an A-surface optical interferometer and a B-surface optical interferometer, a reference measurement point on a reference piece having the reference measurement point at which the reference piece has a known thickness; first and second distance meter reference measurement results obtained by measuring the reference measurement point with an A-surface distance meter and a B-surface distance meter; first and second interferometer measurement results obtained by measuring a measurement point of the wafer with the A-surface optical interferometer and the B-surface optical interferometer; and first and second distance meter measurement results obtained by measuring the measurement point with the A-surface distance meter and the B-surface distance meter, a number of phases between a reference displacement based on the first and second interferometer reference measurement results and a displacement based on the first and second interferometer measurement results, and obtains a thickness, of the wafer, at the measurement point.
Owner:KOBELCO RES INST INC

Method and system for manufacturing battery cell

A method for manufacturing a battery cell according to an embodiment of the present invention includes: a sealing process of forming a sealing part on a battery cell, in which an electrode assembly is accommodated in a pouch; a transfer process of transferring the battery cell to locate the sealing part between a first confocal-sensor and a second confocal-sensor, which are disposed to face each other; and a measurement process of measuring a thickness of the sealing part through the first confocal-sensor and the second confocal-sensor.
Owner:LG ENERGY SOLUTION LTD

System and method for mapping thickness variations of substrates in manufacturing systems

To enable optical inspection of variations in thickness of substrates during various stages of a manufacturing process in a substrate processing system.SOLUTION: A first set of intensity values associated with a third beam of light caused by a first beam of light incident on a substrate 202 at a first angle of incidence and interacting with the substrate 202, and a second set of intensity values associated with a fourth beam of light caused by a second beam of light incident on the substrate 202 at a second angle of incidence and interacting with the substrate 202 are used to determine thickness profile data of the substrate 202.SELECTED DRAWING: Figure 2A
Owner:APPLIED MATERIALS INC

Method and device for non-contact measurement of an object

In a method for measuring an object (12; 12'), an optical coherence tomograph (22) directs a measuring light beam (24) via a scanning device (26) and an optical system (38) onto at least one point (39; 39', 39") on a surface (40; 40') of an object (12; 12'), thereby obtaining several measured values. Depending on the measured values, the angular position of a stage (16) on which the object is placed is changed such that the surface (40; 40') of the object (12; 12'), or at least a region of the surface, is oriented more perpendicular to the optical axis (OA) of the optical system (38) on average after the change in angular position than before the change in angular position.
Owner:PRECITEC OPTRONIK GMBH

Inline terahertz measurement device for dry electrode film manufacturing, and methods thereof

A system and method for processing a dry electrode film comprising a roller system, a terahertz measurement device and a dry electrode powder mixture dispenser, are disclosed. The measurement device may comprise a terahertz source and a terahertz sensor. Such terahertz source may be emitted towards an upper and lower surface of the dry electrode film and reflected back towards the terahertz sensor to measure a physical property of the dry electrode film.
Owner:TESLA INC

Step-height measurement device and method for slot die

An apparatus for measuring a step difference between a lip and a shim of a slot die includes: a laser sensor configured to measure a step difference between a lip and a shim of a slot die, the laser sensor being disposed to face the lip and the shim of the slot die, and a jig configured to come into contact with at least a part of the body where a portion of the slot die from which the ink is discharged is positioned. A method to implementing the same.
Owner:LG ENERGY SOLUTION LTD

Systems and methods for quasi-doppler shift interferometer

A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive a plurality of images for a continuous scan phase shift interferometry (PSI), wherein the plurality of images includes a first plurality of pixels of a front surface of a sample and a second plurality of pixels of a back surface of a sample; b) simultaneously perform a first plurality of intensity scans of each pixel in the first plurality of pixels and a second plurality of intensity scans of each pixel in the second plurality of pixels; c) identify zero transitions for each of the first plurality of pixels; d) identify zero transitions for each of the second plurality of pixels; and e) compare the plurality of zero transitions to determine a relative movement and deformation of the sample during the PSI scan.
Owner:GLOBALWAFERS CO LTD

Systems and methods for quasi-doppler phase shift interferometer

A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive a plurality of images for a continuous scan phase shift interferometry (PSI), wherein the plurality of images includes a first plurality of pixels of a front surface of a sample and a second plurality of pixels of a back surface of a sample; b) simultaneously perform a first plurality of intensity scans of each pixel in the first plurality of pixels and a second plurality of intensity scans of each pixel in the second plurality of pixels; c) identify zero transitions for each of the first plurality of pixels; d) identify zero transitions for each of the second plurality of pixels; and e) compare the plurality of zero transitions to determine a relative movement and deformation of the sample during the PSI scan.
Owner:GLOBALWAFERS CO LTD

Deviation detection method and deviation detection device

The present application provides a deviation detection method for detecting a position deviation of an electrode assembly during winding. The deviation detection method comprises: obtaining a first image and a second image by means of a first camera and a second camera, the first image comprising an image of a first electrode plate of the electrode assembly during winding, and the second image comprising an image of a second electrode plate of the electrode assembly during winding; determining, according to distances from a reference point in the first image and a reference point in the second image to a specific position, whether the first camera and the second camera deviate; and when it is determined that the first camera and the second camera do not deviate, determining, according to a vertical distance from the reference point in the first image to the boundary of the first electrode plate and a vertical distance from the reference point in the second image to the boundary of the second electrode plate, whether the electrode assembly deviates. Therefore, by means of the first image and the second image, whether the positions of the first camera and the second camera deviate can be determined, and the position deviation of the electrode assembly can be further determined when the cameras do not deviate.
Owner:CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITED

Measuring jig for battery module

A measuring instrument according to an embodiment is a measuring jig for a battery module, and includes: a support positioned across the battery module and having a plurality of fastening portions for fastening with the measuring instrument; and a fixing plate connected to the support and supported on the battery module.
Owner:LG ENERGY SOLUTION LTD

Measuring table for carrying out measuring tasks on a sheet printed in a printing press

The invention relates to a measuring table for carrying out measuring tasks on a printed sheet printed in a printing press, comprising a sheet support surface for placing the printed sheet, wherein at least one suction device generating a negative pressure is arranged below the sheet support surface, wherein this suction device is designed such that, in the operating state of its activation triggered by a control unit, it holds a printed sheet resting on the sheet support surface in a force-fitting manner by means of an air pressure which is reduced compared to the barometric air pressure, wherein at least a partial surface of the sheet support surface is formed from a microporous block material with a natural porosity of at least 20%,wherein the block material is an inorganic non-metallic material and is permeable to air over its entire surface due to its microporous structure, and wherein the block material has, by means of an engraving introduced into it, a position for the placement of the printed sheet to be placed on the sheet support surface or a ruler for measuring the printed sheet in question.
Owner:KOENIG & BAUER AG

System and method for reducing measurement errors in interferometric-based metrology

A system includes a laser source and a dual interferometer subsystem. A channel of the dual interferometer subsystem includes a first optical splitter element coupled to a first output beam from a laser source, the first optical splitter element configured to split the first output beam into a first transmitted beam and a first reflected beam; a first power sensor configured to measure a power of the first transmitted beam; a first detector is configured to receive a first interference signal from the dual interferometer subsystem and record a first interferogram frame. The system includes a controller coupled to the first power sensor and the first detector of a first channel of the dual interferometer subsystem, the controller configured to: receive the first interferogram frame; receiving a first laser power measurement from the first power sensor; and normalizing an intensity of the first interferogram frame based on the first laser power measurement to produce a first normalized interferogram frame.
Owner:KLA CORP

Shape measuring device and method for calibrating shape measuring device

A shape measuring device of the present invention includes an image processing unit that obtains a contour shape of a measurement target having a plate shape based on a shadow image of the measurement target disposed between an illumination unit and an imaging unit in a case of measurement, the shadow image being generated by the imaging unit imaging a shadow of the measurement target, the shadow being formed by illumination light emitted from the illumination unit. A dimming filter unit is disposed between the illumination unit and the imaging unit in a case of calibration, and an amount of illumination light emitted from the illumination unit is calibrated based on a light receiving amount of the illumination light emitted from the illumination unit and received by the imaging unit via a dimming filter unit 2.
Owner:KOBELCO RES INST INC

System and method for mapping thickness variations of a substrate in a manufacturing system

In particular, disclosed embodiments describe systems and methods for scanning a substrate with a light beam and detecting, for each of a set of substrate locations, a respective one of a set of intensity values ​​associated with the light beam reflected from (or transmitted through) the substrate, the detected intensity values ​​being used to determine a thickness profile of the substrate.
Owner:APPLIED MATERIALS INC

Inline terahertz measurement device for dry electrode film manufacturing, and methods thereof

A system and method for processing a dry electrode film comprising a roller system, a terahertz measurement device and a dry electrode powder mixture dispenser, are disclosed. The measurement device may comprise a terahertz source and a terahertz sensor. Such terahertz source may be emitted towards an upper and lower surface of the dry electrode film and reflected back towards the terahertz sensor to measure a physical property of the dry electrode film.
Owner:TESLA INC

Thz measuring device and method for measuring an object

The invention relates to a THz measuring device (2) for measuring a measurement object (12), comprising a measuring chamber (5) for receiving a measurement object (12), which is formed between a first THz transceiver (3) and an opposing second THz transceiver (4), wherein the THz transceivers (3, 4) each emit and receive THz radiation (8) into the measuring chamber (5), a synchronizing device (6) synchronizes the transmission times and / or measurement times of the two transceivers (3, 4), and a detection device (20) receives measurement signals (M1, M2) from the THz transceivers (3, 4) and determines at least one layer thickness (WD1, WD2) and / or at least one layer property (n12, v12) from at least the following measurements: - a blank measurement in which the first THz transceiver (3) emits the THz radiation (8) through the empty measuring chamber (5) outputs to the second THz transceiver (4) and the second THz transceiver measures an idle time (T_Idle), - a measurement of the total time,in which the first THz transceiver (3) outputs the THz radiation (8) through the measurement room (5) and the object under test to the second THz transceiver (4) and the second THz transceiver measures a transit time with the object under test (T_12), and - at least one wall area measurement (ST3, ST4) in which the first and / or second transceiver (3, 4) outputs THz radiation (8) and detects the THz radiation reflected at interfaces (14a, 14b) of at least one wall area (12a, 12b).
Owner:CITEX HOLDING GMBH

Thickness measurement system

The present invention relates to a thickness measuring system, and more particularly to a thickness measuring system that can significantly reduce measurement errors caused by the positional relationship between the object to be measured and the sensor when measuring the thickness of a pouch, and can significantly reduce thickness measurement errors in the pouch corners, which are formed by curved surfaces with large and diverse curvatures. The thickness measurement system according to the present invention includes a stage device including a mounting section on which an object to be measured is placed, and a moving section for moving the mounting section; a displacement sensor device including a first displacement sensor located on one side of the object and measuring the distance to the object, and a second displacement sensor located on the other side of the object and measuring the distance to the object; and a processing device that obtains the thickness value of the object based on the measurements of the first and second displacement sensors. The displacement sensor device performs measurement only when the angle of incidence, which is the angle that the light emitted from the first or second displacement sensor makes with the normal perpendicular to the surface of the object to be measured, is within a predetermined angle, and does not perform measurement if it falls outside the predetermined angle.
Owner:LG ENERGY SOLUTION LTD