Filtering connector for mixed loading of high-speed and low-speed signals
By using an insulating sleeve and spring structure in the filter connector to reduce parasitic capacitance, the normal transmission and electromagnetic compatibility of the filter connector with mixed high and low speed signals in small-sized devices are achieved, solving the electromagnetic compatibility and signal transmission problems in the existing technology when the degree of equipment integration is high.
Patent Information
- Application Number
- CN202510600805.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2025-09-19
AI Technical Summary
It is difficult with existing technology to realize a mixed filter connector for high- and low-speed signals in highly integrated devices, which not only meets the requirements of lightweight and small size of the equipment, but also ensures the normal transmission of high-speed signals and electromagnetic compatibility.
A plate capacitor is installed in the shell, some capacitor holes are passed through by high-speed contacts with insulating sleeves, and other capacitor holes are passed through by low-speed contacts with springs. The design of insulating sleeves and springs reduces parasitic capacitance, and combined with the grounding spring, the signal is filtered and conducted.
It effectively reduces the parasitic capacitance of high-speed signals, ensuring the normal transmission of high-speed signals, while achieving filtering of low-speed signals to meet electromagnetic compatibility requirements. The connector is compact in size and suitable for mixed installation of high- and low-speed signals.
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Figure CN120674874A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a filtering connector, in particular to a filtering connector for mixed high-speed and low-speed signals. Background Art
[0002] Filter connectors are specialized connectors built with capacitors and other components inside conventional electrical connectors. They can transmit signals and power like traditional connectors and offer excellent resistance to electromagnetic interference. In the military, using filter connectors is an effective way to address electromagnetic compatibility (EMC) issues.
[0003] Figure 1 This is a product structure diagram of a common filter connector. The filter socket is mainly composed of a shell, an insulator, a plate capacitor, a contact, a spring, a rubber ring, and a conductive rubber pad. The plate capacitor and the contact are flexibly contacted through the spring, and the plate capacitor and the shell are in contact through a grounding spring.
[0004] With the increasing integration of products, a single connector often needs to transmit high-voltage power, low-voltage power, high-speed signals, and low-speed signals simultaneously. Traditionally, high-speed signal transmission has often involved using coaxial or differential contacts or split-cavity solutions. This approach results in large product sizes. Coaxial or differential contacts are standard, large in diameter, typically exceeding φ8. Conventional contacts have a diameter of approximately φ1. With the increasing integration of devices, coaxial or differential contacts cannot meet the requirements for lightweight, compact, and high-density equipment. Therefore, when users choose to use low-frequency contacts to transmit high-speed signals to meet these requirements, filtering is necessary to ensure compliance with GJB151B-2013, "Electromagnetic Emission and Sensitivity Requirements and Measurements for Military Equipment and Subsystems." Considering the sensitivity of high-speed signals such as 100M and 1G Ethernet, and video signals, it is important to consider how to reduce the parasitic capacitance of the high-speed signal holes in mixed high- and low-speed connectors to ensure electromagnetic compatibility (EMC) without compromising high-speed signal transmission.
[0005] Filter connectors utilize the low-impedance characteristics of capacitors at high frequencies to bypass interference signals to the connector housing (ground) for absorption, separating noise from the operating signal, reducing cable radiation emissions, and providing electromagnetic protection for equipment. When signals are transmitted through the pins, interference noise in the signal is directed to the connector housing through the spring-capacitor-ground spring structure, thus providing electromagnetic protection.
[0006] At present, high-reliability filter connectors basically use plate array plate filtering (plate capacitors). Plate array capacitors are based on the pin layout of the connector and use mature MLCC (chip capacitor) technology to achieve a structural layout of capacitor integration and hole array distribution on a ceramic board. The capacitance of each hole position can be customized according to requirements. The plate capacitor structure is as follows: Figure 7 As shown in the figure, a high-density node connector often carries power, low-frequency signals, and high-frequency signals. Filter connectors are low-pass filters. When power and low-frequency signals are properly filtered, the signals are not easily distorted, and normal signal transmission is not affected. However, when high-frequency signals are filtered by plate capacitors, the larger the capacitance, the more likely the signal is to be distorted, leading to abnormal signal transmission. To ensure normal transmission of high-frequency signals, the parasitic capacitance of the hole should be minimized; the smaller the capacitance, the better.
[0007] like Figure 7 As shown, the plate capacitor is a whole. In order to achieve integration and miniaturization, a connector often needs to transmit high-frequency signals and low-frequency signals. Currently, due to the material characteristics and process reasons of ceramic capacitors, if special treatment is not performed, the capacitance of the connector hole after assembly into a finished product will often reach about 40pF, which will affect the normal transmission of 100M, 1G, and video high-speed signals.
[0008] To address these issues, the previous approach often involved using coaxial or differential contacts for high-speed signal transmission, or employing split-cavity processing. This resulted in larger product sizes. However, with the increasing integration of equipment, this approach is no longer able to meet the requirements for lightweight and compact size. Alternatively, all high-speed, low-speed signal, and power supply ports are not filtered, and conventional connectors are used, which in turn fails to meet the equipment's electromagnetic compatibility requirements. Therefore, once users have chosen to use low-frequency contacts for high-speed signal transmission, to ensure proper transmission, it is necessary to consider how to reduce the parasitic capacitance of the high-speed signal ports within the mixed high- and low-speed signal connector. This approach allows for filtering of the low-speed signal without affecting the normal transmission of the high-speed signal, effectively improving the equipment's electromagnetic compatibility. Summary of the Invention
[0009] In order to solve the above technical problems, the present invention provides a filter connector for mixed high-speed and low-speed signals.
[0010] The purpose of the present invention is to achieve the following technical solution: A high-speed and low-speed mixed signal filter connector proposed in the present invention includes a housing, a plate capacitor is provided in the housing, and a plurality of capacitor holes are distributed on the plate capacitor; an insulating sleeve is passed through a portion of the capacitor holes, and a high-speed contact is passed through the insulating sleeve; another portion of the capacitor holes is passed through a spring, and a low-speed contact is passed through the spring, and a grounding spring is provided between the plate capacitor and the inner wall of the housing to achieve filtering and conduction of the low-speed contact, the plate capacitor, and the housing; and an insulating structure is provided in the housing cavity on both sides of the plate capacitor.
[0011] Compared with the prior art, the present invention is beneficial in that:
[0012] For connectors that transmit signals including high-speed, low-speed, and power signals, and have a large number of connectors, filtering is performed on the low-speed and power signals, and parasitic capacitance reduction is performed on the high-speed signals. This allows the device using the connector to pass electromagnetic compatibility tests and ensure normal high-speed signal transmission. Furthermore, the insulating sleeve is securely mounted within the capacitor hole, and the high-speed contact is securely mounted within the insulating sleeve.
[0013] Compared with the prior art, the present invention is beneficial in that:
[0014] The high-speed contact is initially fixed in the plate capacitor to achieve normal transmission of high-speed signals.
[0015] Furthermore, the high-speed contact comprises a strong guide structure with a diameter gradually decreasing in the insertion direction to facilitate the insertion of the high-speed contact into the insulating sleeve.
[0016] Compared with the prior art, the present invention is beneficial in that:
[0017] The high-speed contact is easily inserted into the insulating sleeve by the strong guide structure, avoiding damage to the insulating sleeve or the high-speed contact by excessive force.
[0018] Furthermore, the spring sheet is forcibly installed in the capacitor hole, and a number of inwardly contracted elastic cantilevers are distributed on the spring sheet to ensure reliable contact between the spring sheet and the low-speed contact piece.
[0019] The low-speed contact is installed in the spring sheet, which saves effort during insertion and can stably fix the low-speed contact in the spring sheet.
[0020] Furthermore, the insulating structure includes an insulator on the front side of the plate capacitor and a potting body on both sides of the plate capacitor. The insulator is a hollow structure, and a glue filling hole is provided at the front end of the insulator and a glue through hole is provided at the rear end. Glue is poured into the insulator through the glue filling hole and glue is poured into the rear inner cavity of the shell to form a potting body in contact with the plate capacitor.
[0021] Compared with the prior art, the present invention is beneficial in that:
[0022] The insulator limits the glue pouring range to prevent glue from flowing into other areas during glue pouring on the front side, thus achieving good insulation through glue pouring.
[0023] Furthermore, both the high-speed contact piece and the low-speed contact piece are provided with a limiting ring platform located in the potting body, and the limiting ring platform is provided with a flattening.
[0024] Compared with the prior art, the present invention is beneficial in that:
[0025] The contact is prevented from rotating in the potting body by means of a limiting ring and flattening, thereby preventing the contact from rotating and causing damage to the device and unstable signal transmission.
[0026] Furthermore, both end surfaces of the plate capacitor are coated with silicone rubber to protect the plate capacitor.
[0027] Compared with the prior art, the present invention is beneficial in that:
[0028] Avoid damaging the board capacitors during glue filling.
[0029] Furthermore, the front end surface of the insulating structure is provided with an interface sealing body for sealing the front side colloid.
[0030] Compared with the prior art, the present invention is beneficial in that:
[0031] The interface sealant is used to protect the colloid filling to ensure good insulation effect.
[0032] Furthermore, a rubber ring for sealing the plug-in interface is provided on the bottom edge of the plug-in cavity of the housing.
[0033] Compared with the prior art, the present invention is beneficial in that:
[0034] When the connector is plugged into the mating connector, the plugging surface is sealed.
[0035] Furthermore, an outer wall of the shell is provided with a mounting boss, and a surface where the mounting boss cooperates with the device where the filter connector is located is provided with a conductive rubber pad.
[0036] Compared with the prior art, the present invention is beneficial in that:
[0037] The housing is in contact with the conductive rubber pad, thereby achieving contact with the device and ultimately grounding the housing.
[0038] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, which can be implemented in accordance with the contents of the specification, and to make the objects, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] Figure 1 It is a schematic diagram of a half-section structure of a filter connector in the prior art;
[0040] Figure 2 This is a half-section structural diagram of an embodiment of a high- and low-speed mixed signal filtering connector of the present invention;
[0041] Figure 3 for Figure 2 Schematic diagram of the structure of the capacitor component;
[0042] Figure 4a for Figure 2 A three-dimensional schematic diagram of the middle shell;
[0043] Figure 4b for Figure 2 A three-dimensional schematic diagram of the middle shell from another perspective;
[0044] Figure 5a for Figure 2 Schematic diagram of the insulator in the middle;
[0045] Figure 5b for Figure 2 A three-dimensional diagram of the insulator from another perspective;
[0046] Figure 6 for Figure 2 Schematic diagram of the grounding spring after it is deployed;
[0047] Figure 7 for Figure 2 Schematic diagram of a mid-plate capacitor;
[0048] Figure 8 for Figure 2 A cross-sectional view of the middle insulating sleeve;
[0049] Figure 9 for Figure 2 Schematic diagram of shrapnel;
[0050] Figure 10 for Figure 2 Schematic diagram of the contacts.
[0051] Reference numerals:
[0052] 1- Shell,
[0053] 101-insertion cavity,
[0054] 102-installation boss,
[0055] 103-ring groove,
[0056] 2- insulator,
[0057] 201-glue filling hole,
[0058] 202-Glue hole,
[0059] 3- Ground spring,
[0060] 301- convex piece,
[0061] 4- Plate capacitors,
[0062] 401-capacitor hole,
[0063] 5-Insulation sleeve,
[0064] 501-stop ring,
[0065] 6- shrapnel,
[0066] 601-stop boss,
[0067] 602-elastic cantilever,
[0068] 603-shrapnel body,
[0069] 7-Contact piece,
[0070] 71-High-speed contact,
[0071] 72- low speed contact,
[0072] 701-Strong guide structure,
[0073] 702-Limiting ring platform,
[0074] 703-cut flat,
[0075] 8- potting body,
[0076] 9-Interface sealing body,
[0077] 10- rubber ring,
[0078] 11-Conductive rubber pad. DETAILED DESCRIPTION
[0079] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0080] An embodiment of a high-speed and low-speed mixed signal filter connector of the present invention is as follows: Figures 2 to 10 The filter connector includes a housing 1, an insulator 2, a grounding spring 3, a plate capacitor 4, an insulating sleeve 5, a spring 6, a contact 7, a potting body 8, an interface sealing body 9, a rubber ring 10, and a conductive rubber pad 11.
[0081] Multiple contacts 7 are disposed within the housing 1. In this embodiment, the contacts 7 are in the form of pins. Different contacts are positioned in different hole positions and can be used to transmit different signals or power sources, including high-speed signals, low-speed signals, high-voltage power sources, and low-voltage power sources. High-speed contacts 71 are used to transmit high-speed signals, while low-speed contacts 72 are used to transmit low-speed signals and power sources. High-speed contacts 71 and low-speed contacts 72 have identical dimensions and structures, facilitating mass production.
[0082] The front end of the housing 1 forms an insertion cavity 101. The mating end of the contact 7 is located within the insertion cavity 101, and the rear end of the contact 7 extends beyond the rear end of the housing 1. Within the housing 1, from front to back, are arranged an interface seal 9, an insulation structure, a plate capacitor 4, and an insulation structure. The insulation structure comprises an insulator 2 located in front of the plate capacitor 4 and a potting body 8 encapsulated in the front and rear sides of the plate capacitor 4. The contact 7 passes through the interface seal 9, the insulation structure, the plate capacitor 4, and the insulation structure in this order.
[0083] A rubber ring 10 is provided at the bottom edge of the plug-in cavity 101 to seal the plug-in interface when the filter connector and the adapter connector are plugged in.
[0084] A conductive rubber pad 11 is provided on the surface where the mounting boss 102 on the outer wall of the housing 1 contacts the corresponding device. The conductive rubber pad 11 ensures full contact between the housing 1 and the device, thereby achieving a better filtering effect.
[0085] Plate capacitor 4 as Figure 7 As shown, a plurality of capacitor holes 401 for inserting contact members 7 are distributed thereon.
[0086] In the capacitor hole 401 of the low-speed signal, it is necessary to filter the low-speed signal. The low-speed contact 72 and the plate capacitor 4 are connected by a welding-free structure, specifically through the spring 6, to achieve flexible contact between the low-speed contact 72 and the plate capacitor 4, avoiding the capacitor from being affected by welding stress, with high reliability. Figure 9The spring clip 6 is integrally bent to form an annular structure, and a plurality of stop bosses 601 are circumferentially distributed at the tail end. After the spring clip 6 is installed in the capacitor hole 401 corresponding to the plate capacitor 4, the stop boss 601 stops at the rear end face of the plate capacitor 4, thereby achieving positioning and contact with the plate capacitor 4. The head of the spring clip 6 is provided with an elastic cantilever 602 extending toward the front end. The elastic cantilever 602 contracts inward, and the low-speed contact member 72 passes through the spring clip 6. The elastic cantilever 602 is squeezed on the low-speed contact member 72, thereby achieving elastic contact between the low-speed contact member 72 and the spring clip 6. In this embodiment, the spring clip 6 is provided with three circumferentially distributed elastic cantilevers 602 to form a three-petal spring clip. By using this spring clip 6, the low-speed contact piece 72 in the capacitor hole 401 is in elastic contact with the three-petal spring clip, which can avoid the plate capacitor 4 from being subjected to welding stress. The low-speed contact piece 72 and the spring clip 6 are inserted and removed gently, which can not only ensure that the plate capacitor 4 is not damaged during the process of the low-speed contact piece 72 being installed into the spring clip 6, but also ensure that the low-speed contact piece 72 and the spring clip 6 are in reliable contact; when the spring clip 6 is inserted into the corresponding capacitor hole 401, the insertion of the spring clip 6 is guided by the inward-retracted elastic cantilever 602. The spring clip body 603 of the spring clip 6 is a circular ring with a notch, and its front end is provided with an elastic cantilever 602 and the rear end is provided with a stopping boss 601. When the spring clip body 603 is inserted into the capacitor hole 401, the spring clip body 603 is compressed and contracted, and under the action of its own elastic restoring force, it is pressed against the inner wall of the capacitor hole 401, thereby achieving reliable contact between the spring clip 6 and the plate capacitor 4. The spring clip 6 is in reliable contact with the low-speed contact member 72 and the plate capacitor 4 at the same time, allowing the conduction of high-frequency noise signals, achieving filtering, and greatly improving product reliability. When the spring clip 6 is forcibly installed in the capacitor hole 401, the spring clip 6 can be guided into insertion by the elastic cantilever 602.
[0087] In the capacitor hole 401 of the high-speed signal, the high-speed contact 71 and the plate capacitor 4 are isolated by an insulating sleeve 5. In order to minimize the gap between the high-speed contact 71 and the insulating sleeve 5 and reduce the parasitic capacitance of the hole, a strong installation guide structure 701 is adopted between the high-speed contact 71 and the insulating sleeve 5 to achieve strong installation of the high-speed contact 71 and the insulating sleeve 5. At the same time, the insulating sleeve 5 is strongly installed in the hole corresponding to the plate flashlight 4. The insulating sleeve 5 is shown in FIG. Figure 8 .
[0088] A retaining ring 501 is provided on the outer wall of the rear end of the insulating sleeve 5. This retaining ring 501 is used to securely fit the insulating sleeve 5 into the high-speed signal capacitor hole 401. The retaining ring 501 is retained against the rear end of the plate capacitor 4, securing the insulating sleeve 5 in place. The insulating sleeve 5 is typically made of a material with good insulating properties, typically polytetrafluoroethylene or PEEK. Its dimensions are generally related to the diameter of the capacitor hole 401 and the outer diameter of the high-speed contact 71.
[0089] The contact 7 is provided with a forced installation guide structure 701 to facilitate forced installation with the insulating sleeve 5. The forced installation guide structure 701 of the contact 7 is in the shape of a frustum. As a part of the contact 7, the forced installation guide structure 701 connects the front and rear parts of the contact 7. In the insertion direction, the diameter of the forced installation guide structure 701 gradually decreases, and the diameter of the front part of the contact 7 is smaller than the diameter of the rear part. When inserting the high-speed contact 71 into the insulating sleeve 5, the front end of the high-speed contact 71 is first inserted into the insulating sleeve 5. The high-speed contact 71 slides through the insulating sleeve 5. When it reaches the forced installation guide structure 701, the high-speed contact 71 is forcibly pushed through the insulating sleeve 5, so that the high-speed contact 71 is forced to fit with the rear part of the forced installation guide structure 701. A flattened portion 703 is provided on the limiting ring 702 of the outer wall of the contact member. The limiting ring 702 is located in the inner cavity of the rear end of the shell. After the glue is poured, the limiting ring 702 cooperates with the potting body 8 to prevent the contact member 7 from axially jumping. The flattened portion 703 and the potting body 8 can prevent the contact member 7 from rotating. Figure 10 .
[0090] The plate capacitor 4 is in contact with the housing 1 through a grounding spring 3 for shielding. The shape of the grounding spring 3 when not subject to external force is as follows: Figure 6 As shown, the grounding spring 3 is an elastic, long, plate-like body with a plurality of protrusions 301 distributed along its length. The protrusions 301 extend in the width direction of the grounding spring 3 and tilt upward. The grounding spring 3 is bent and wrapped around the outer circumference of the plate capacitor 4, and the grounding spring 3 is nested on the inner wall of the housing 1, which can ensure 360-degree contact and conduction between the plate capacitor 4 and the housing 1, reduce contact resistance and achieve 360-degree shielding, and enhance the filtering effect. The low-speed contact 72 and the plate capacitor 4 are filtered and conducted through the spring 6 (conduction that only allows high-frequency noise to pass through), and the plate capacitor 4 and the housing 1 are conducted through the grounding spring 3, thereby achieving filtering of low-frequency signals.
[0091] The insulator 2 adopts a hollow structure, and a glue filling hole 201 is provided on the front end face of the insulator 2, so that epoxy glue can be poured into the insulator 2 to achieve the potting of the plate capacitor 4. A glue hole 202 is provided at the rear end of the insulator 2, which increases the diameter of the glue hole 202 and reduces the wall thickness at the glue hole 202, so that the cavity in the insulator 2 is exposed on one side of the plate capacitor 4. When pouring glue into the insulator 2, the epoxy glue is in full contact with the plate capacitor 4 to achieve the potting of the plate capacitor 4. At the same time, it is prevented that the glue flows into other areas when pouring glue on the front side, and the potting body on the front side is regularized to prevent the glue pouring from affecting the shape of the plug-in cavity, thereby avoiding affecting the normal plug-in. After the glue is poured at the tail end of the shell 1, both end faces of the plate capacitor 4 can be potted with glue to prevent the plate capacitor 4 from being damaged by mechanical and environmental stresses. Insulator 2 see Figure 5a 、 Figure 5bThe front end of the insulator 2 is provided with a plurality of insulating holes 203 surrounding the glue-filling hole 201. The corresponding contacts 7 are inserted into the insulating holes 203 and then into the potting body 8 formed after the glue is poured. The contacts 7 are also inserted into the glue-filling hole 201, and the potting body 8 securely fixes and insulates the contacts 7.
[0092] The shell 1 uses the same type of non-filtered socket as the ordinary one and can be supplemented with machining as needed. It has a compact size, and the opening size and installation size are consistent with ordinary sockets. It can be replaced in situ with ordinary sockets. Figure 4a 、 Figure 4b This structure allows for in-situ interchange between a filter socket and a similar non-filter socket without changing the original installation dimensions or opening size. An annular groove 103 is provided on the inner wall of the rear portion of the housing 1 to enhance the bonding strength between the housing 1 and the potting body 8 after potting.
[0093] When assembling the filter connector, first assemble the contact piece 7, insulating sleeve 5, spring 6, and plate capacitor 4 into a capacitor component, and coat the two end faces of the plate capacitor 4 with silicone rubber for protection; then install the insulator 2 and grounding spring 3 into the shell 1 from the rear side of the shell 1 in sequence, and position the insulator 2 and the inner wall of the shell through a step. Then install the capacitor component into the shell and nest it in the grounding spring 3. Finally, use epoxy glue for potting and fixing. The glue can be poured from the front and back sides of the shell 1 at the same time. The potting glue on the front side is set in the insulator 2, and the potting glue on the back side is poured into the tail of the shell to form a potting body 8. Finally, install the rubber ring 10, interface sealing body 9, and numbering plate. When installing the connector on the equipment, place a conductive rubber pad 11 between the connector and the mounting plate of the equipment.
[0094] The filter parameters of the filter connector are selected based on the specific signal type used by the user's equipment. The cutoff frequency is determined based on the signal type and rate. The cutoff frequency needs to be higher than the normal operating rate (i.e., the operating frequency). The capacitance is calculated based on the cutoff frequency. The smaller the capacitance, the higher the cutoff frequency. For power signals, there is no cutoff frequency. Low-speed signals have a lower rate and a lower cutoff frequency, so filtering will not affect normal signal transmission. High-speed signals have a higher cutoff frequency, so the lower the capacitance, the better. Large capacitance and low cutoff frequency, below the normal operating frequency, will affect normal signal transmission. The specific capacitance value is determined after the filter connector and subsequent equipment undergo electromagnetic compatibility testing.
[0095] The present invention can be applied to high- and low-frequency mixed filtering connectors, and can effectively reduce the parasitic capacitance of the high-speed signal hole position, so that the high-speed signal can be transmitted normally, and low-frequency signal filtering can be achieved at the same time to meet the electromagnetic compatibility requirements. The present invention can effectively reduce the parasitic capacitance value. The parasitic capacitance of the structure can be controlled to be no more than 15pF, which is consistent with the transmission performance of ordinary low-frequency connectors and does not affect the transmission of normal high-speed signals. In the capacitor hole position 401 of the low-speed signal and power supply, the inner electrode of the plate capacitor 4 and the low-speed contact member 72 are flexibly contacted by the spring 6, and then the outer electrode of the plate capacitor 4 is connected to the shell 1 through the grounding spring 3. The characteristic of the capacitor passing high frequency and blocking low frequency is used to filter out the high-frequency noise components in the signal or power supply, solving the electromagnetic interference problems of the power supply, low-speed signal, etc.; in the high-speed signal hole position, the high-speed contact member 71 is insulated from the plate capacitor 4 by the insulating sleeve 5, and is not affected by the plate capacitor 4, thereby achieving normal transmission of high-speed signals.
[0096] The present invention can also be applied to mixed high- and low-voltage filter connectors. Currently, the high-voltage power supply transmitted by mixed high- and low-voltage filter connectors is often 270VDC or 540VDC. The use of ceramic capacitors for filtering cannot meet the requirements. For such products, filter connectors cannot be made. For high- and low-voltage mixed filter connectors with dense nodes, the present invention meets the voltage resistance requirements of the high-voltage hole position, and can simultaneously achieve filtering of the low-voltage hole position, meeting the electromagnetic compatibility requirements. For mixed high- and low-voltage connectors, the voltage resistance of the high-voltage hole position often needs to be above 1500V. The capacitors of dense node connectors cannot withstand this voltage resistance value. For such products, large-node connectors are often selected. The connector size is too large and cannot meet the installation size requirements. By adopting the present invention, the high-voltage power supply is transmitted through the high-speed contact 71 provided in the insulating sleeve 5, which can improve the voltage resistance value of the high-voltage hole position and ensure safety in use. The low-voltage power supply is transmitted through the low-speed contact 72 provided in the spring 6, which can achieve filtering of the low-voltage power supply.
[0097] In other embodiments, the contact member 7 may also be in the form of a socket, and the connector structure may be adaptively changed accordingly.
[0098] In other embodiments, the insulator 2 may be omitted, and both sides of the plate capacitor 4 may be directly potted, and the plate capacitor 4 may be protected by the potting body 8 .
[0099] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and alterations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. A filter connector for mixed high-speed and low-speed signals, comprising a housing (1), characterized in that: The housing (1) is provided with a plate capacitor (4), and a plurality of capacitor holes (401) are distributed on the plate capacitor (4); an insulating sleeve (5) is inserted into a portion of the capacitor holes (401), and a high-speed contact piece (71) is inserted into the insulating sleeve (5); another portion of the capacitor holes (401) is inserted with a spring piece (6), and a low-speed contact piece (72) is inserted into the spring piece (6); a grounding spring (3) is provided between the plate capacitor (4) and the inner wall of the housing (1) to achieve filtering and conduction of the low-speed contact piece (72), the plate capacitor (4), and the housing (1); and an insulating structure is provided in the inner cavity of the housing (1) on both sides of the plate capacitor (4).
2. The high-speed and low-speed mixed signal filter connector according to claim 1, characterized in that: The insulating sleeve (5) is forcibly installed in the capacitor hole (401), and the high-speed contact piece (71) is forcibly installed in the insulating sleeve (5).
3. The high-speed and low-speed mixed signal filter connector according to claim 2, characterized in that: The high-speed contact piece (71) comprises a strong guide structure (701) with a diameter gradually decreasing in the insertion direction, so as to facilitate the insertion of the high-speed contact piece (71) into the insulating sleeve (5).
4. The high-speed and low-speed mixed signal filter connector according to claim 1, characterized in that: The spring sheet (6) is forcibly installed in the capacitor hole (401), and a plurality of inwardly contracted elastic cantilevers (602) are distributed on the spring sheet (6) to ensure reliable contact between the spring sheet (6) and the low-speed contact member (72).
5. The high-speed and low-speed mixed signal filter connector according to claim 1, characterized in that: The insulating structure comprises an insulator (2) on the front side of the plate capacitor (4) and a potting body (8) on both sides of the plate capacitor (4); the insulator (2) is a hollow structure; a glue injection hole (201) is provided at the front end of the insulator (2) and a glue through hole (202) is provided at the rear end; glue is injected into the insulator (2) through the glue injection hole (201) and into the rear end inner cavity of the housing (1), thereby forming a potting body (8) in contact with the plate capacitor (4).
6. The high-speed and low-speed mixed signal filter connector according to claim 5, characterized in that: The high-speed contact piece (71) and the low-speed contact piece (72) are both provided with a limiting ring platform (702) located in the potting body (8), and the limiting ring platform (702) is provided with a flattening (703).
7. A high-speed and low-speed mixed signal filter connector according to any one of claims 1 to 6, characterized in that: Both end surfaces of the plate capacitor (4) are coated with silicone rubber to protect the plate capacitor (4).
8. The high-speed and low-speed mixed signal filter connector according to claim 5 or 6, characterized in that: The front end surface of the insulating structure is provided with an interface sealing body (9) for sealing the front side colloid filling body.
9. A high-speed and low-speed mixed signal filter connector according to any one of claims 1 to 6, characterized in that: A rubber ring (10) for sealing the plug-in interface is provided at the bottom edge of the plug-in cavity of the housing (1).
10. A high-speed and low-speed mixed signal filter connector according to any one of claims 1 to 6, characterized in that: The outer wall of the housing (1) is provided with a mounting boss (102), and the surface of the mounting boss (102) that cooperates with the device where the filter connector is located is provided with a conductive rubber pad (11).
Citation Information
Patent Citations
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