Lapping sheet and its manufacturing method and polishing device

Abstract

The invention relates to a grinding sheet material that contains a nonwoven fabric and an interconnected porosity macromolecule elastic body. The surface of the grinding sheet material is the fiber of nonwoven fabric and the macromolecule elastic body.

Description

technical field [0001] The present invention relates to an abrasive sheet, and more particularly relates to an abrasive sheet, the surface of which is composed of fibers and polymeric elastic body with interconnected porosity. Background technique [0002] The chemical mechanical polishing (CMP) process is a method currently implemented in the semiconductor and liquid crystal display industries to planarize the surface of a semiconductor substrate or a glass substrate. [0003] Chinese Patent Announcement No. 528646, the patent name "Chemical Mechanical Planarization Polishing Pad", discloses that a heat-cured mixed slurry is placed in a mold with grooves, and the heat-cured mixed slurry is ground after cooling Cutting into thin slices, or mechanically shaping it into thin slices, can obtain a polishing pad (that is, a polishing pad) for a chemical mechanical polishing device. However, Chinese Patent Announcement No. 528646 discloses that the thermoplastic foamed polymer is...

AI Technical Summary

Problems solved by technology

However, Chinese Patent Announcement No. 528646 discloses that the thermoplastic foamed polymer is poured into a circular mold barrel, and the abrasive pad obtained by slicing will not be uniform due to the distribution of the slurry concentration in the circular mold. The difference in temperature distribution at each position of the casting mold causes the hole size and distribution of the polishing pad to be different, and it is difficult to control. After the grinding and slicing process, the size of the holes on the slice surface of the polishing pad will be more obvious, and the holes are different from each other. There is no intercommunication, so that the fluidity of the polishing liquid is poor during the polishing process, and the abrasive particles in the polishing liquid are not easy to effectively diffuse and distribute

Furthermore, during the polishing process, debris is likely to remain on the surface of the polishing substrate, resulting in poor chip removal, which will scratch the polishing substrate

In addition, when producing abrasive pads, the distribution of slurry concentration and molding temperature in the circular mold is not uniform, resulting in poor batches of abrasive pads, that is, each abrasive sheet has a different polishing effect, which in turn affects the polishing quality control

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