This invention relates to the field of
chip design technology, and in particular to a dedicated interconnect device integrated within a
graphics processor. The device includes a dedicated
transmission channel comprising a dedicated
data format conversion module, a
verification and packaging module, and an alignment and allocation module cascaded in sequence, forming a unified transmission and reception path. In the transmission path, data flows sequentially through the dedicated
data format conversion module, the
verification and packaging module, and the alignment and allocation module. In the reception path, data flows sequentially through the alignment and allocation module, the
verification and packaging module, and the dedicated
data format conversion module. This dedicated interconnect device can be used for
chip-to-
chip communication outside of a
package, as well as for direct die-to-die connections within an advanced
package. It possesses good
scalability and versatility, achieving low-latency, high-bandwidth communication.