This application provides an LCP thin film
assembly, its preparation method, and its application. The preparation method includes:
surface modification of the LCP thin film to obtain an activated surface rich in carboxyl and hydroxyl groups, followed by
hot pressing of the LCP thin film with the activated surface; the LCP thin film
assembly includes a multilayer LCP thin film bonded by
hot pressing, wherein no
adhesive is contained between any two adjacent LCP thin films, and the interface region between any two adjacent LCP thin films forms a homogenized molecular-level bonding layer through melt recrystallization; the preparation method of this application introduces active functional groups through
surface modification methods such as
alkaline hydrolysis and
acid activation, achieving interlayer chemical bonding during
hot pressing, significantly improving interlayer
bonding strength, avoiding the risks of bubbling and
delamination, and retaining the inherent excellent high-frequency performance and
dielectric properties of the LCP thin film; this preparation method, when applied to the preparation of LCP thin film probe cards, can produce thin film probe cards with excellent interlayer
bonding strength and high-frequency performance.