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Production method of high-power precision alloy SMD (surface mount device) resistor

A technology of precision alloys and chip resistors, which is applied in the direction of resistors, resistor manufacturing, and resistors at the lead-out end. It can solve problems such as unstable circuit performance, high cost, and overall heat accumulation, and achieve material saving and reliability. Excellent thermal stability and low thermoelectric potential

Inactive Publication Date: 2014-09-17
SHENZHEN YEZHAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the production of precision alloy chip resistors, power is always an important factor restricting this type of products. In some circuits that require higher power, due to the limitation of structure, the heat generation of existing devices is determined by power and usage. It is determined by the material. Of course, the use of good heat dissipation materials will have better heat dissipation effect and more stable performance. However, the production cost will remain high and expensive. For general resistor design ideas, the use of Ordinary heat dissipation materials, when used in high-power circuits, are prone to the problems of overall heat accumulation and unstable circuit performance due to resistance heating, so it is difficult for ordinary resistors to meet the high-power requirements

Method used

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  • Production method of high-power precision alloy SMD (surface mount device) resistor

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Embodiment Construction

[0029] Such as Figure 1~3 Shown, the manufacture method of the high-power precision alloy chip resistor of the present invention, it comprises the steps:

[0030] a. Utilize the welding process or the pressing process to combine two oxygen-free copper strips 1 with the two sides of the resistance alloy strip 2 respectively to form an integral strip-shaped resistor strip, the oxygen-free copper strip And the section of the resistance alloy strip is rectangular;

[0031] b. Wrap the resistor strip on a strip-shaped substrate 3 with high thermal conductivity, the surface of the substrate 3 is insulated;

[0032] c. Etch the basic resistance structure on the inclusion wrapped with the substrate 3 by chemical etching or laser engraving or grinding, such as Figure 4-7 shown;

[0033] d. Refer to Figure 8 , on the basic resistance structure, the resistance value is precisely adjusted 5, and the adjustment can be made by laser engraving or grinding or chemical etching;

[0034...

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Abstract

The invention provides a production method of a high-power precision alloy SMD (surface mount device) resistor. The production method comprises the steps: respectively combining two oxygen-free copper strips with two sides of a resistor alloy strip to form an integrated strip-shaped resistor strip, and wrapping a high-heat-conductivity substrate with the integrated strip-shaped resistor strip; etching a basic resistor structure on a wrapping body; precisely adjusting the resistance value of the basic resistance structure; coating, terminal electroplating and printing a resistor body to form a high-power precision alloy SMD resistor. The material with high heat radiation capability and high heat conductivity such as a metal substrate, a high-heat-conductivity ceramic substrate is used as the substrate, so that the actual load capacity of the resistor is greatly increased; the oxygen-free copper strip is partially arranged on the side surface and below the substrate and used as an electrode lead, so that the contact area is increased, and the heat conductivity of the resistor body is also increased on the other hand.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a method for manufacturing a high-power precision alloy chip resistor. Background technique [0002] Precision alloy chip resistors are widely used in various circuits as important components in circuits. They are widely used electronic components, especially suitable for various circuits produced by surface mount assembly technology. At present, in the production of precision alloy chip resistors, power is always an important factor restricting this type of products. In some circuits that require higher power, due to the limitation of structure, the heat generation of existing devices is determined by power and usage. It is determined by the material. Of course, the use of good heat dissipation materials will have better heat dissipation effect and more stable performance. However, the production cost will remain high and expensive. For general resistor design ideas, the use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/00H01C17/28
CPCH01C17/28
Inventor 李智德
Owner SHENZHEN YEZHAN ELECTRONICS
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