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Miniaturization micromechanical filter

A filter and micro-mechanical technology, which is applied in waveguide devices, chemical instruments and methods, instruments, etc., can solve the problems of large device volume, lower substrate dielectric constant, etc., and achieve reduced filter volume and good consistency , the effect of reducing the volume

Active Publication Date: 2012-11-21
CHINA ELECTRONICS TECH GRP NO 26 RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the filter uses a micron-scale dielectric film as a support layer, which reduces the dielectric constant of the substrate and makes the device larger

Method used

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  • Miniaturization micromechanical filter
  • Miniaturization micromechanical filter
  • Miniaturization micromechanical filter

Examples

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Embodiment Construction

[0029] Below, with reference to the accompanying drawings, a preferred embodiment according to the present invention is provided to further describe the miniaturized micromechanical filter:

[0030] figure 1 It is a layered three-dimensional schematic diagram of a miniaturized micro-mechanical filter. The up-and-down direction referred to in the present invention is based on the direction in which the upper dielectric layer and the lower dielectric layer overlap in the vertical direction shown in the accompanying drawing, wherein f1 is the upper dielectric layer The metal layer on the upper surface of the layer, f2 is the upper dielectric layer, f3 is the metal electrode layer on the lower surface of the upper dielectric layer, f4 is the metal electrode layer on the upper surface of the lower dielectric layer, f5 is the lower dielectric layer, f6 is the metal layer on the lower surface of the lower dielectric layer, 1 and 8 are input and output signal lines, 2 and 9 are the th...

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Abstract

The invention discloses a miniaturization micromechanical filter. The filter is manufactured based on micromechanical process and formed by overlying upper and lower layers of medium materials, an interdigitated metal electrode layer is arranged on the lower surface of the upper medium layer, ground connection bonding welding rings are arranged on the upper surface of the lower medium layer, cavities prepared by etching process are formed among the welding rings, through holes are arranged on the upper and lower medium layers, metal layers are arranged on the inner walls of the through holes, surface electrode layers are arranged on the surfaces of the upper and lower medium layers, and input and output lead wires are arranged on the surface of the upper medium layer. The filter can meet index requirements of high operating frequency, large bandwidth, small loss and the like of a microwave filter and has the advantages of being small in size, fully sealed and high in reliability.

Description

technical field [0001] The invention relates to a micro-mechanical filter, in particular to a miniaturized micro-mechanical filter based on a micro-mechanical manufacturing process. Background technique [0002] With the expansion of the amount of communication information and the complexity of the whole system, the requirements for the small size of the microwave filter are becoming more and more urgent for the whole system. Traditional cavity filters, dielectric filters and other filters are too large to meet the volume requirements of the system. Due to the low temperature co-fired ceramic (LTCC) filter adopts the ceramic sintering process, the process consistency is difficult to guarantee. [0003] Micromechanical filter is a new type of filter that was born in recent years. It uses silicon substrate or quartz substrate as the base material, and successfully combines micromechanical technology and microwave filter design technology. In addition to the high precision of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P1/203B81B1/00
Inventor 杜波马晋毅江洪敏曹家强杨靖蒋欣
Owner CHINA ELECTRONICS TECH GRP NO 26 RES INST
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