63 results about "Superconducting integrated circuits" patented technology

Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and / or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes. These preferred and other methods may be applied to digital circuits based on Rapid Single Flux Quantum logic, and to quantum computing using Josephson junction qubits.

Routing and distribution of radio-frequency (RF) signals is commonly achieved in the analog domain. However, improved performance and simplified circuit architectures may be obtained by first digitizing the RF signal, and then carrying out all routing in the digital domain. A new generation of scalable digital switches has been developed, which routes both the data and clock signals together, this being necessary to maintain the integrity of the digitized RF signal. Given the extremely high switching speeds necessary for these applications (tens of GHz), this is implemented using Rapid-Single-Flux-Quantum (RSFQ) logic with superconducting integrated circuits. Such a digital switch matrix may be applied to either the receiver or transmitter components of an advanced multi-band, multi-channel digital transceiver system, and is compatible with routing of signals with different clock frequencies simultaneously within the same switch matrix.

A high-speed lookup table is designed using Rapid Single Flux Quantum (RSFQ) logic elements and fabricated using superconducting integrated circuits. The lookup table is composed of an address decoder and a programmable read-only memory array (PROM). The memory array has rapid parallel pipelined readout and slower serial reprogramming of memory contents. The memory cells are constructed using standard non-destructive reset-set flip-flops (RSN cells) and data flip-flops (DFF cells). An n-bit address decoder is implemented in the same technology and closely integrated with the memory array to achieve high-speed operation as a lookup table. The circuit architecture is scalable to large two-dimensional data arrays.

Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and / or a strap contact connector.

A new technique is presented for improving the microfabrication yield of Josephson junctions in superconducting integrated circuits. This is based on the use of a double-layer lithographic mask for partial anodization of the side-walls and base electrode of the junctions. The top layer of the mask is a resist material, and the bottom layer is a dielectric material chosen so as to a) maximize adhesion between the resist and the underlying superconducting layer, b) be etch-compatible with the underlying superconducting layer, and c) be insoluble in the resist and anodization processing chemistries. In a preferred embodiment of the invention, the superconductor is niobium, the material on top of this is silicon dioxide, and the top layer is conventional photoresist or electron-beam resist. The use of this combination results in a substantial increase in the fabrication yield of high-density superconducting integrated circuits due to increase in junction uniformity and reduction in defect density. An additional improvement over the prior art involves the replacement of a wet-etch step with a dry etch more compatible with microlithography.

Various techniques and apparatus permit fabrication of superconductive circuits. A niobium / aluminum oxide / niobium trilayer may be formed and individual Josephson Junctions (JJs) formed. A protective cap may protect a JJ during fabrication. A hybrid dielectric may be formed. A superconductive integrated circuit may be formed using a subtractive patterning and / or additive patterning. A superconducting metal layer may be deposited by electroplating and / or polished by chemical-mechanical planarization. The thickness of an inner layer dielectric may be controlled by a deposition process. A substrate may include a base of silicon and top layer including aluminum oxide. Depositing of superconducting metal layer may be stopped or paused to allow cooling before completion. Multiple layers may be aligned by patterning an alignment marker in a superconducting metal layer.

A superconducting integrated circuit, comprising a plurality of superconducting circuit elements, each having a variation in operating voltage over time; a common power line; and a plurality of bias circuits, each connected to the common power line, and to a respective superconducting circuit element, wherein each respective bias circuit is superconducting during at least one time portion of the operation of a respective superconducting circuit element, and is configured to supply the variation in operating voltage over time to the respective superconducting circuit element.

A digital first-in first-out (FIFO) buffer (10) for use with Single Flux Quantum (SFQ) superconductive integrated circuits. The digital FIFO buffer (10) includes a clock-storage circuit (14) for receiving and storing load and read clock signals (100, 104) and a data-storage circuit (16) connected to the clock-storage circuit (14) for receiving and storing data signal pulses (102) in the order which the data signal pulses (102) are received relative to the load clock signal (100). The data-storage circuit (16) outputs the SFQ pulse signal independent of the load clock signal (100). The previously stored clock and data signal pulses (100, 102) provide physical back pressure to their subsequent signal pulses.