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264 results about "Material growth" patented technology

Three-dimensional cultivation method for interplanting medicinal materials

In order to solve the problems that in the prior art, the three-dimensional cultivation mode of interplanting plants is imperfect, the land resources are not fully utilized, and the plant space distribution is unreasonable, the invention provides a three-dimensional cultivation method for interplanting medicinal materials, which perfects the three-dimensional cultivation technology for interplanting, enables plants to fully absorb nutrients, fully utilizes sunshine and land, and ensures that the space has hierarchy. Particularly, the three-dimensional cultivation method comprises the following technical steps: according to the sunshine and density requirements and the period of the medicinal materials growth, heliophilous and sciophilous, ligneous and herbaceous, and short-term and long-term plants are subjected to field management: three-dimensional cultivation for intercropping, strong seedling planting, watering and fertilizing, weeding and loosening the soil and the like. The medicinal materials comprise phellodendron Chinense schneid, salvia miltiorrhiza, rhizoma atractylodis macrocephalae, rhizoma paridis and herba leonuri. The three-dimensional cultivation method has the advantages of perfecting the three-dimensional cultivation method, achieving the three-dimensional cultivation hierarchy, ensuring the full utilization of land, improving the medicinal materials acre yield of the land, and increasing the economic benefits.
Owner:ANSHUN CITY XIXIU DISTRICT YULIN PLANTING & BREEDING FAMER SPECIALIZED COOP

Epitaxial wafer of AlGaInP light emitting diode with sapphire underlay and preparation method thereof

InactiveCN101540359ANo light absorption problemInhibition of growth defectsSemiconductor devicesLattice mismatchLight-emitting diode
The invention provides an epitaxial wafer of an AlGaInP light emitting diode with a sapphire underlay and a preparation method thereof. An epitaxial structure of the light emitting diode sequentically comprises the sapphire underlay, a low-temperature GaP buffer layer, a high-temperature GaP buffer layer, a GaP current expansion and ohmic contact layer, an AlGaInP transition layer, a lower limiting layer, a multiple quantum well AlGaInP active area, an AlGaInP upper limiting layer and a GaP current expansion layer from bottom to top. The preparation method comprises the steps that each epitaxial layer grows on the sapphire underlay layer by layer sequentially. The epitaxial wafer uses the sapphire as the epitaxial growth underlay and uses gallium phosphide as the buffer layer. Because the sapphire and the gallium phosphide material are transparent to a wave band from yellow to red, the problem of light absorption of the underlay does not exist. The gallium phosphide buffer layer can inhibit the material growth defect caused by lattice mismatch and heat expansion coefficient mismatch between the sapphire underlay and the AlGaInP material so as to greatly improve the light output capability of the light emitting diode.
Owner:Shandong Huaguang Optoelectronics Co. Ltd.

Method for manufacturing high-resistance GaN thin film

The invention discloses a high-resistance GaN thin film and a method for manufacturing the high-resistance GaN thin film. The high-resistance GaN thin film comprises a substrate, a GaN low-temperature nucleating layer and a GaN high-resistance layer, wherein the GaN low-temperature nucleating layer is manufactured on the substrate, and the GaN high-resistance layer is manufactured on the GaN low-temperature nucleating layer. The high-resistance GaN thin film grows through MOCVD equipment, with trimethyl gallium and ammonia gas used as a gallium source and a nitrogen source, and with hydrogen used as carrier gas; the growth temperature of the GaN low-temperature nucleating layer is 550 DEG C, the pressure of a reaction chamber for the GaN low-temperature nucleating layer is 200 Torr, and the thickness of the GaN low-temperature nucleating layer ranges from 0.2 micrometer to 0.3 micrometer; the growth temperature of the GaN high-resistance layer is 1040 DEG C, the pressure of a reaction chamber for the GaN high-resistance layer is 50 Torr, and the thickness of the GaN high-resistance layer is 2 micrometers. According to the high-resistance GaN thin film, by controlling the pressure of the reaction chambers in the material growth process and controlling merging of carbon atoms in reaction precursors TMGa, carbon impurities are imported to acquire acceptor levels under the condition that a carbon source is not independently added, and background carrier concentration is compensated for.
Owner:INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI

Method for preparing NaYF4:Yb,ER up-conversion fluorescent material by adopting electro-deposition

The invention discloses a method for preparing a NaYF4:Yb,ER up-conversion fluorescent material by adopting electro-deposition, which comprises the following steps of: 1) cleaning indium tin oxide (ITO) conductive glass for 2 to 3 times by using acetone, cleaning the ITO conductive glass in an ultrasonic cleaner for 10 to 30 minutes by using deionized water, activating the ITO conductive glass in 10 percent salpeter solution for 10 to 30 seconds; and cleaning with deionized water for later use; 2) adding sodium ascorbate into coordination compound solution consisting of 0.003-0.3mol/L ethylene diamine tetraacetic acid and yttrium ions, ytterbium ions and erbium ions in a molar ratio of (75-94):(5-20):(1-5), adding solution of sodium fluoride, and regulating the pH value to be 5-7 to obtain the electrolyte for later use; and 3) taking the ITO conductive glass as a working electrode, a platinum electrode as a counter electrode, and a saturated calomel electrode as a reference electrode for electro-deposition, and annealing the prepared film. The method has the characteristics of simple equipment, low cost, high deposition rate, low material growth temperature, and capacity of being operated at normal temperature and normal pressure, and is expectedly used for industrial production.
Owner:ZHEJIANG UNIV

Monolithic integrated non-refrigerated infrared/ultraviolet double-color detector and manufacture method thereof

The invention discloses a monolithic integrated non-refrigerated infrared/ultraviolet double-color detector and a manufacture method thereof, belonging to the field of photoelectric detectors. The detector comprises a substrate, an ultraviolet sensitive thin film structure and an infrared sensitive thin film structure thereof are integrated on the same substrate material; a cushion layer, an ultraviolet sensitive layer, an isolation layer and an infrared detecting structure are sequentially arranged on the substrate upwardly. In the invention, SiC, GaN series or AlxGa1-xN series of the broad-band gap high-temperature semiconductor ultraviolet sensitive thin film structure and ferro-electricity, vanadium oxide or amorphous silicon of the non-refrigerated infrared sensitive thin film structure grow on the same substrate, and a relative simple material growth method and processing process are adopted to realize the monolithic integration of the non-refrigerated infrared/ultraviolet double-color detector so as to develop the range of a response spectrum, and improve the detection and identification probability of a target; in the application, the invention has no requirement for low temperature, and reduces the volume of parts and the production cost.
Owner:THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP

Method for preparing raw material for vapor-method aluminum nitride crystal growth

The invention discloses a method for preparing a raw material for vapor-method aluminum nitride crystal growth. The method comprises the specific steps of soaking a tungsten crucible and a crucible cover which are required to be used in aqua regia for 30-120 minutes, taking out the tungsten crucible and the crucible cover, cleanly flushing, and drying for later use; adding aluminum nitride powder into the tungsten crucible, and carrying out multi-layer compacting treatment; covering the tungsten crucible with the crucible cover, putting in a tungsten-mesh heating furnace, vacuumizing until the pressure is 1*10<-3>Pa, inflating with high-purity nitrogen gas until the pressure is 30kPa, heating to the temperature of 300 DEG C, keeping the temperature constant for 1 hour, heating to the temperature of 800 DEG C, and keeping the temperature constant for 1 hour; inflating the tungsten-mesh heating furnace with high-purity nitrogen gas until the pressure is 50kPa, heating to the temperature of 1800 DEG C, keeping the temperature constant for 5 hours, heating to the temperature of 2,050 DEG C, and keeping the temperature constant for 8 hours; cooling to room temperature, thereby obtaining an aluminum nitride sinter cake which serves as the raw material for vapor-method aluminum nitride crystal growth. According to the method, a compact sintered body is prepared from the aluminum nitride powder, so as to control vapor-phase reaction, thus the requirements of RVT (Physical Vapor Transport)-method aluminum nitride crystal material growth for raw materials are met.
Owner:BEIJING HUAJINCHUANGWEI ELECTRONICS CO LTD

Super-radiation light emitting diode

The invention discloses a super radiation luminescent diode, having a material growth part comprising a substrate, a lower cladding, a lower separate confinement layer, an active region, an upper separate confinement layer, an upper cladding, a optical confinement layer and an ohmic contact layer in sequence; a P-typed electrode layer is formed through an insulation medium layer above the ohmic contact layer and a N-typed electrode layer formed under the substrate; the active region positioned between the lower separate confinement layer and the upper separate confinement layer adopts body material structure, and the luminescent wavelength range of the active region is from 0.85 to 1.7um. The invention achieves low polarization design by combining the material active region design and waveguide structure, having the advantages of simple technique and high reliability. The invention can be applied to the wavelength range of 0.85 to 1.7um. The invention adopts ridge-waveguide structure to reduce the series resistance, increase injection efficiency, and thus improving device characteristics. The invention adopts tilted waveguide; after the waveguide is bent, the high anti-reflective film demand can be reduced by one to two orders of magnitude, and advantageous to realize super luminescent diode with low ripple coefficient.
Owner:GUANGXUN SCI & TECH WUHAN

Asexual propagation seedling method of hybrid paper mulberry

The invention discloses a tissue culture rapid propagation seedling method of hybrid paper mulberry, and belongs to the technical field of hybrid paper mulberry plantation. The tissue culture rapid propagation seedling method of hybrid paper mulberry comprises following steps: explant selection, induced culturing, subculturing, rooting culture, and transplanting. According to the tissue culture rapid propagation seedling method, current year stems with buds are selected as explants, the meristematic capacity is excellent, and differentiation propagation is more convenient to realize; LED illumination culture is capable of adjusting culture material growth process, increasing the environmental adaptability, realizing reasonable optimization on composition of induction medium, proliferationmedium, and rooting medium, and illumination conditions of different stages, increasing seedling tissue culture efficiency, and achieving relatively induction rate, reproduction rate, and rooting rate; the adventitious bud induction differentiation rate is 94% or higher; after subculture, average seedling height reaches 3.5cm, rooting rate reaches 100%, and transplanting survival rate reaches 68%or higher. The tissue culture rapid propagation seedling method is adopted for seedling of hybrid paper mulberry, the seedling efficiency is high, the propagation coefficient is large, seedling cost is reduced, and the obtained tissue culture seedlings are strong, and are high in quality.
Owner:天长市金农农业发展有限公司

Double-layer gas inlet shower nozzle device of MOCVD (Metal Organic Chemical Vapor Deposition) equipment

The invention discloses a double-layer gas inlet shower nozzle device of MOCVD (Metal Organic Chemical Vapor Deposition) equipment, comprising a sealed outer shell in which an upper gas inlet chamber, a lower gas inlet chamber and a water cooling chamber are arranged. The double-layer gas inlet shower nozzle device of the MOCVD equipment is characterized in that a lower gas outlet pipe for realizing communication between the lower gas inlet chamber and a reaction chamber is mounted between the lower gas inlet chamber and the reaction chamber; an upper gas outlet pipe for communicating the upper gas inlet chamber with the lower gas outlet pipe is mounted between the upper gas inlet chamber and the lower gas outlet pipe; the external diameter of the upper gas outlet pipe is less than the internal diameter of the lower gas outlet pipe; and the lower end of the upper gas outlet pipe extends into the lower gas outlet pipe but cannot retract into the lower gas inlet chamber; and a clearance is formed between the upper gas outlet pipe and the lower gas outlet pipe. Two types of reaction gases are premixed in a space between an outlet of the upper gas outlet pipe and an outlet of the lower gas outlet pipe before entering the reaction chamber. The double-layer gas inlet shower nozzle device of the MOCVD equipment disclosed by the invention has the characteristic that different reaction gases are respectively fed into the reaction chamber so that the different reaction gases are sufficiently mixed with little pre-reaction before reaching a substrate; and the crystal quality and the raw material utilization rate during material growth can be improved.
Owner:刘军林

Double-layer airflow quartz fairing reaction chamber apparatus for MOCVD system

The invention discloses a reaction chamber device with double-layer airflow and a quartz false ogive that is used for a MOCVD system, comprises a horizontal quartz tube, metallic flanges that are arranged at two ends of the quartz tube and used for sealing the two ends of the quartz tube, the rectangle quartz false ogive and a substrate that are arranged inside the quartz tube, and an inclined plane lining that is placed on the substrate and arranged inside the quartz false ogive, and the arrangement of the quartz false ogive and the inclined plane of the substrate satisfies the ideal hydrokinetic model of the chemical gas phase reaction of the MOCVD. By utilizing the characteristics of simple design, good bearing pressure ability and convenient sealing and matching of the cylindrical quartz tube as well as the rectifying action of the reaction chamber with the rectangle false ogive, and combing with other MOCVD technical equipments, the invention forms the MOCVD system with the reaction chamber with the double-layer airflow and the quartz false ogive, which has simple structure, low production cost and even material growth; the quartz false ogive that has convenient disassembly and assembly is convenient for cleaning the reaction chamber, and the crystal growth pollution is reduced, thus obtaining crystal materials with high quality; the reaction chamber device with the double-layer airflow and the quartz false ogive can further be used for the CVD and MOCVD of the growth of other semiconductor materials such as Si, GaAs, InP and GaN, etc., as well as horizontal reaction systems of HVPE, etc.
Owner:NANJING UNIV
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