The invention relates to a
laser manufacturing method, which comprises the following steps of S1, adopting an aluminum-containing
semiconductor material as a butt-joint growth
mask, and performing butt-joint growth; s2, after butt-joint growth is completed, removing the butt-joint growth
mask containing aluminum in the
reaction chamber; s3, after the butt-joint growth
mask is removed, epitaxial growth continues to be carried out in the
reaction chamber; and S4, after the epitaxial growth is finished, carrying out subsequent manufacturing to obtain the
laser. The invention also provides a
laser which is manufactured by the laser manufacturing method. According to the method, the aluminum-containing
semiconductor material is used as the butt-joint growth mask, the performance and yield of the laser are improved, after butt-joint growth is completed, the aluminum-containing butt-joint growth mask is removed through in-situ
corrosion in the
reaction chamber, subsequent epitaxial growth is directly carried out, the
wafer can be prevented from being exposed to the external environment in the transfer process by adopting the mode, and the yield of the laser is improved. Meanwhile, the method can be seamlessly connected with a
material growth step, so that the process steps are reduced, and the
process time is shortened.