Wire saw for cutting hard and fragile materials and manufacturing method thereof

A technology of brittle materials and wire saws, applied in the field of new wire saws and its manufacturing, can solve the problems of low strength resin and abrasive particles, failure to form practical production applications, abrasives affecting abrasive distribution, etc., to achieve fast curing speed, Strong binding force, reduce shedding effect

Inactive Publication Date: 2009-10-28
NANJING NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this process is likely to cause abrasives to agglomerate in the mold hole of the coating device and affect the distribution of abrasives in the wire saw. Generally, it is difficult to bring out abrasives when the length of the wire saw exceeds 1 kilometer.
At the same time, the strength of h

Method used

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  • Wire saw for cutting hard and fragile materials and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: Wire saw for cutting hard, brittle materials, including core wire, abrasive and bond. Such as figure 1As shown: the core wire 4 uses copper-plated piano wire; the abrasive material 1 uses diamond or CBN coated with metal on the surface; Among them, the abrasive is uniformly, continuously and single-layer distributed around the core wire, part of the abrasive is embedded in the UV resin bond, part of it is exposed outside the heat-curable resin bond to form a blade, and the rest is wrapped by the heat-curable resin.

[0031] Manufacturing process: (1) Ingredients: Weigh 10g of alumina, 10g of silicon oxide, 10g of silicon carbide, 5g of cerium oxide, 5g of chromium oxide, 120g of UV resin, mix them, and stir them evenly with a magnetic stirrer to make a UV resin binder for later use; Measure 15g of alumina, 15g of silicon carbide, 15g of cerium oxide, 15g of titanium oxide, 15g of ultrafine diamond powder, 15g of ultrafine copper powder, and 210g of thermoset...

Embodiment 2

[0034] Embodiment 2: manufacturing process: (1) batching: weigh aluminum oxide 15g, silicon oxide 15g and silicon carbide 10g, UV resin 120g, mix, stir with magnetic stirrer and make UV resin bond for subsequent use; Weigh aluminum oxide 20g , 20g of silicon carbide, 20g of cerium oxide, 20g of ultrafine diamond powder, 20g of ultrafine copper powder, and 200g of thermosetting resin, stirred evenly with a magnetic stirrer to make a thermosetting resin binder for subsequent use. Manufacturing process (2)~(7) is the same as embodiment 1.

[0035] In this embodiment, a copper-plated musical instrument wire with a diameter of 0.10 mm is used. The abrasive material is titanium-plated artificial diamond with an average particle size of 24 microns. The UV resin is an acrylic resin, and the thermosetting resin is a phenolic resin.

[0036] The technical parameters of the wire saw produced in this embodiment are shown in Table 1 below, and the cutting performance indicators are shown i...

Embodiment 3

[0037] Embodiment 3: manufacturing process: (1) batching: weigh aluminum oxide 20g, cerium oxide 15g and chromium oxide 15g, UV resin 150g, mix, stir with magnetic stirrer and make UV resin binder for subsequent use; Weigh aluminum oxide 30g , 20g of silicon carbide, 10g of titanium oxide, 25g of ultrafine diamond powder, 10g of ultrafine copper powder, 220g of thermosetting resin, stir evenly with a magnetic stirrer to make a thermosetting resin binder for future use. Manufacturing process (2)~(7) is the same as embodiment 1.

[0038] In this embodiment, a copper-plated music wire with a diameter of 0.14 mm is used. The abrasive is copper-plated artificial diamond with an average particle size of 30 microns. The UV resin is an acrylic resin, and the thermosetting resin is a polyimide resin.

[0039] The technical parameters of the wire saw produced in this embodiment are shown in Table 1 below, and the cutting performance indicators are shown in Table 2 below.

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Abstract

The invention relates to a wire saw for cutting hard and fragile materials and a manufacturing method thereof. The wire saw is fixed with an grinding material on a core wire through a bonding agent and is characterized in that the bonding agent consists of an inner layer UV resin bonding agent and an outer layer heat reactive resin bonding agent; and the grinding material is evenly and continuously distributed in a monolayer mode around the core wire, partial grinding material is embedded in the UV resin bonding agent, other partial grinding material is exposed outside the heat reactive resin bonding agent to form an exit lip, and the rest part is enwrapped by the outer layer heat reactive resin. The grinding material adopts a diamond or CBN adopting surface metal plating; and the core wire adopts a copperized music wire. The manufacturing method is performed continuously and quickly according to the following steps: under the traction of a driving device, setting out the core wire continuously through a wire plate, surface preparation, cleaning, drying, coating with the inner layer UV resin bonding agent, grinding material cementation, UV curing, coating with the outer layer heat reactive resin bonding agent, thermocuring and drawing in a cable to form a plate. The wire saw and the method solve the problem of driving aspects before cured resin is completely cured, and can effectively solve the problem that the grinding material in the prior art is easy to agglomerate.

Description

technical field [0001] The invention relates to a cutting tool, in particular to a new type of wire saw for cutting hard and brittle materials such as silicon and quartz crystals in industries such as semiconductors and solar energy, and a manufacturing method thereof. Background technique [0002] Foreign countries proposed the process of cutting brittle semiconductor materials with a wire saw in the 1970s, and a wire saw that can be used for silicon wafer cutting appeared in the 1980s. In the 1990s, especially in recent years, wire saws have developed rapidly, and their research has become more in-depth. Due to the high cost of fixed abrasive cutting wire saws, the wire saws used in wire cutting mainly use suspended abrasives for cutting, no matter at home or abroad. However, fixed abrasive cutting has gradually replaced suspended abrasive cutting due to its advantages of low energy consumption, no pollution to the use environment, high cutting efficiency, and high machin...

Claims

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Application Information

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IPC IPC(8): B24B27/06B28D5/04B24D3/32B24D3/34
Inventor 莫祥银朱汉波金小东
Owner NANJING NORMAL UNIVERSITY
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