Wire saw for cutting hard and fragile materials and manufacturing method thereof

Abstract

The invention relates to a wire saw for cutting hard and fragile materials and a manufacturing method thereof. The wire saw is fixed with an grinding material on a core wire through a bonding agent and is characterized in that the bonding agent consists of an inner layer UV resin bonding agent and an outer layer heat reactive resin bonding agent; and the grinding material is evenly and continuously distributed in a monolayer mode around the core wire, partial grinding material is embedded in the UV resin bonding agent, other partial grinding material is exposed outside the heat reactive resin bonding agent to form an exit lip, and the rest part is enwrapped by the outer layer heat reactive resin. The grinding material adopts a diamond or CBN adopting surface metal plating; and the core wire adopts a copperized music wire. The manufacturing method is performed continuously and quickly according to the following steps: under the traction of a driving device, setting out the core wire continuously through a wire plate, surface preparation, cleaning, drying, coating with the inner layer UV resin bonding agent, grinding material cementation, UV curing, coating with the outer layer heat reactive resin bonding agent, thermocuring and drawing in a cable to form a plate. The wire saw and the method solve the problem of driving aspects before cured resin is completely cured, and can effectively solve the problem that the grinding material in the prior art is easy to agglomerate.

Description

technical field [0001] The invention relates to a cutting tool, in particular to a new type of wire saw for cutting hard and brittle materials such as silicon and quartz crystals in industries such as semiconductors and solar energy, and a manufacturing method thereof. Background technique [0002] Foreign countries proposed the process of cutting brittle semiconductor materials with a wire saw in the 1970s, and a wire saw that can be used for silicon wafer cutting appeared in the 1980s. In the 1990s, especially in recent years, wire saws have developed rapidly, and their research has become more in-depth. Due to the high cost of fixed abrasive cutting wire saws, the wire saws used in wire cutting mainly use suspended abrasives for cutting, no matter at home or abroad. However, fixed abrasive cutting has gradually replaced suspended abrasive cutting due to its advantages of low energy consumption, no pollution to the use environment, high cutting efficiency, and high machin...

AI Technical Summary

Problems solved by technology

However, this process is likely to cause abrasives to agglomerate in the mold hole of the coating device and affect the distribution of abrasives in the wire saw. Generally, it is difficult to bring out abrasives when the length of the wire saw exceeds 1 kilometer.

At the same time, the strength of high-shrinkage UV-cured resin and the holding force between resin and abrasive grains are low, and low-shrinkage resin cannot form a good edge of the abrasive. Therefore, the current UV resin curing method has not been able to form practical production applications and is still in the research stage.

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