Copper plating solution and method for copper plating

A copper plating and copper plating technology, which is applied in liquid chemical plating, coating, permanent magnet manufacturing, etc., can solve problems such as adverse effects of workpieces, and achieve excellent bonding performance

Inactive Publication Date: 2004-07-21
HITACHI METALS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, for workpieces to be coated that are subject to hydrogen embrittlement, such as rare earth metal-based permanent magnets, gaseous hydrogen has an adverse effect on the workpiece itself

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The alloy powder is prepared by the rapid solidification method. The powder is composed of particles with an average particle diameter of 150 microns and contains 12% (atom) of Nd, 77% (atom) of Fe, 6% (atom) of B and 5% (Atomic) Co. The alloy powder is kneaded with an epoxy resin added at a concentration of 2% by weight. At 7 tons / cm 2 The obtained mixture was compression-molded under a pressure of 150°C, and cured at 170°C for 1 hour to obtain a ring-shaped Nd-Fe-B-based bonded magnet with an outer diameter of 31.0 mm, an inner diameter of 28.5 mm, and a height of 4.0 mm (hereinafter referred to as magnet Sample A"). The magnet sample A was barrel polished to remove the surface contamination layer, and a 0.1 mol / liter sodium hydroxide aqueous solution was used for degreasing treatment, and then the following test was performed.

[0045] By changing the addition amount of sodium sulfite in a solution containing 0.1 mol / L copper sulfate, 0.15 mol / L ethylenediaminetetraaceti...

Embodiment 2

[0051] The alloy powder is prepared by the rapid solidification method. The powder is composed of particles with an average particle diameter of 150 microns and contains 12% (atom) of Nd, 77% (atom) of Fe, 6% (atom) of B and 5% (Atomic) Co. The alloy powder is kneaded with an epoxy resin added at a concentration of 2% by weight. At 7 tons / cm 2 The obtained mixture was compression-molded under a pressure of 150°C, and cured at 170°C for 1 hour to obtain a ring-shaped Nd-Fe-B based bonded magnet with an outer diameter of 30.2 mm, an inner diameter of 28.0 mm, and a height of 4.0 mm (hereinafter referred to as " Magnet sample B"). The magnet sample B was barrel polished in order to remove the surface contamination layer, and a 0.1 mol / liter sodium hydroxide aqueous solution was used for degreasing treatment, and then the following test was performed.

[0052] It is prepared by adding a certain amount of sodium sulfite to a solution containing 0.1 mol / L copper sulfate, 0.15 mol / L ethy...

Embodiment 3

[0055] Except changing the addition amount of sodium sulfite to change the concentration of sodium sulfite from 0.12 mol / L to 0.04 mol / L, the same copper plating solution as in Example 2 was used and the electroless plating method was implemented under the same conditions as in Example 2. , A copper plating film is formed on the surface of the magnet sample B.

[0056] The thickness of the copper plating film formed on the surface of the magnet sample B was 1.2 microns, showing a clear pink color. Moreover, when a knife was used for cross cutting, the copper plating film did not peel off, showing a gap between the copper plating film and the surface of the magnet sample B Has excellent bonding properties.

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PUM

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Abstract

A copper plating solution which comprises 0.03 mol / L to 0.5 mol / L of copper sulfate, 0.05 mol / L to 0.7 mol / L of ethylenetetraacetic acid and 0.02 mol / L to 0.3 mol / L of a sulfite salt, and has a pH adjusted to 5.0 to 8.5; and a method for copper plating which comprises using the copper plating solution. The method for copper plating allows a copper plating film being uniform and excellent in adhesion to be formed with stability on the surface of an article to be plated.

Description

Technical field [0001] The invention relates to a copper plating solution and a copper plating method. The copper plating solution and the copper plating method can stably form a uniform copper plating film with excellent bonding performance on the surface of a workpiece to be plated, such as a rare earth metal-based permanent magnet. Background technique [0002] Rare-earth metal-based permanent magnets, such as R-Fe-B-based permanent magnets represented by Nd-Fe-B-based permanent magnets, have high magnetic properties and are now used in various fields. In particular, a bonded magnet using magnet powder and a resin binder as main components has excellent dimensional accuracy, and can be easily processed into a required shape or made into an integrally molded part. Therefore, bonded magnets of various shapes such as ring magnets have been widely used in household appliances and the like. [0003] However, rare earth metal-based permanent magnets contain metal components (especia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16C23C18/38C25D3/38C25D5/34H01F41/02
CPCC25D5/34C25D3/38C23C18/38H01F41/026
Inventor 菊川文秋小岛薰大冈赖义吉村公志
Owner HITACHI METALS LTD
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