Peeling apparatus and peeling method

A peeling device and release layer technology, applied in chemical instruments and methods, optics, lamination auxiliary operations, etc., can solve the problems of laser peeling equipment cost, high maintenance cost, time-consuming glass process, etc.
CN104347449AInactive Publication Date: 2015-02-11EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
Publication Date
2015-02-11
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

A stripping device is provided which comprises: a wire cutter comprising a moving part and a cutting part connected to the moving part in such a manner that the moving part is able to drive the cutting part linearly; and an attracting wheel comprising a body part adapted to be movably mounted on the flexible substrate so that the body part is able to roll on the flexible substrate and an adsorption part connected to the body part to generate adsorption force to securely attach a part of the flexible substrate as the result of movement of the cutting part.
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Description

technical field

[0001] The present disclosure generally relates to a peeling device and a peeling method, and in particular, to a device and a peeling method for peeling a flexible substrate from a layer bonded thereto. Background technique

[0002] Usually, the flexible substrate 1 and the glass substrate 2 are bonded together through the release layer 3, such as figure 1 As shown, in order to peel off the flexible substrate from the glass substrate, the current method is laser lift-off (Laser lift-off). figure 2 As shown, the laser L is used to scan the release layer material between the flexible substrate 1 and the glass substrate 2, and high energy is given to break the bond between the release layer 3 and the flexible substrate 1 and destroy the bond between the flexible substrate 1 and the release layer 3. bonding, so that the flexible substrate 1 is peeled off.

[0003] Since laser scanning is required, the glass process is very time-consuming. In addition, the cos...

Claims

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