Ultrahigh heat-conduction diamond/aluminum composite material and preparation method of ultrahigh heat-conduction diamond/aluminum composite material

Abstract

The invention relates to a composite material and a preparation method of the composite material, in particular to an ultrahigh heat-conduction diamond/aluminum composite material and a preparation method of the ultrahigh heat-conduction diamond/aluminum composite material. In order to solve the technical problems that a diamond/aluminum composite material prepared with the existing method is low in heat conductivity and poor in interface combination strength, the ultrahigh heat-conduction diamond/aluminum composite material is composed of a reinforcement body and matrix alloy. The preparation method includes the steps that monocrystal diamond particles are contained in a cavity of a graphite die for preheating, and melted aluminum or aluminum alloy is poured to the interior of the graphite die; pressure impregnation is carried out, cooling is carried out, die releasing is carried out, and then the ultrahigh heat-conduction diamond/aluminum composite material is obtained. The diamond/aluminum composite material is good in interface combination and has the advantages of being light, high in thermal conductivity, devisable in coefficient of thermal expansion and the like. According to the ultrahigh heat-conduction diamond/aluminum composite material prepared with the method, the size fraction of the reinforcement body can range from 55% to 70%, the heat conductivity can reach 670 W/(m K), and the thermal diffusivity can reach 3.0 cm<2>/s. The ultrahigh heat-conduction diamond/aluminum composite material and the preparation method belong to the field of composite material preparation.

Description

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AI Technical Summary

Benefits of technology

In this new type of composition that combines ceramic materials called AlN (Al2O3) with metals like copper, silver, gold, etc., it becomes easier than previous methods due to better compatibility between these two substances. Additionally, there are fewer parts needed compared to existing composites made from different types of powders used separately. Overall, this new mixture makes manufacturing lighter but more thermally conductive products possible without requiring expensive modifications such as adding extra layers on top.

Problems solved by technology

The technical problem addressed in this patents relates to developing new ways to improve thermally conductivable binary alloys containing silane or boron nitride without compromising their mechanical performance such as wear resistance. Existing solutions involve complicated procedures like liquid phase diffusion transfer technique, powder metallurgy, heat treatment under specific conditions, etc., but they may be limited in terms of reducing thermal stresses generated when making these products.

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