Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof

A thermal conductive adhesive film and a manufacturing method are applied in the directions of adhesives, epoxy resin adhesives, polymer adhesive additives, etc., to achieve the effects of improving heat dissipation and high reliability

Active Publication Date: 2012-09-12
ZHEJIANG WAZAM NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductive adhesive film is flexible and high-density, which not only meets the environmental requirements of low-carbon environmental protection, but also solves the brittleness problem of traditional aluminum substrates

Method used

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  • Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. First, 14 parts by weight of curing agent (dicyandiamide: diaminodiphenyl sulfone is 1:10) and 0.06 parts of accelerator (dimethylimidazole) are dissolved in 100 parts by weight of solvent (dimethylformamide (DMF) and butanone (MEK) mixed solvent (1:1)), stir well until the curing agent is completely dissolved.

[0027] 2. Add 30 parts by weight of a toughening agent (1:0.35:0.65 for phenolic resin: polyvinyl butyral: nitrile rubber) to the above solution, and stir until it is completely dissolved.

[0028] 3. Then add the halogen-free epoxy resin (resin A: resin B is 1:0.4), silane coupling agent and ceramic powder in a solid weight ratio of 100 parts: 4 parts: 400 parts, and stir for more than 5 hours until Mix well and evenly to form a halogen-free high heat-resistant and thermally conductive glue system with a solid content of about 80%.

[0029] 4. The above-mentioned glue solution system is coated on the surface-treated PET release film through a coating machi...

Embodiment 2

[0031] Except for changing the ratio of the surface treatment agent and the thermally conductive filler used in Embodiment 1, the same method as in Embodiment 1 was used in this embodiment to manufacture the thermally conductive adhesive film.

[0032] 1. First, 14 parts by weight of curing agent (dicyandiamide: diaminodiphenyl sulfone is 1:10) and 0.06 parts of accelerator (dimethylimidazole) are dissolved in 120 parts by weight of solvent (dimethylformphthalein Amine (DMF) and methyl ethyl ketone (MEK) mixed solvent (1:1)), stir well until the curing agent is completely dissolved.

[0033] 2. Add 30 parts by weight of a toughening agent (phenolic resin: polyvinyl butyral: nitrile rubber: 1:0.35:0.65) to the above solution, and stir until it is completely dissolved.

[0034] 3. Then add the halogen-free epoxy resin (resin A: resin B is 1:0.4), silane coupling agent and ceramic powder in a solid weight ratio of 100 parts: 5 parts: 500 parts, and stir for more than 5 hours unti...

Embodiment 3

[0037] Except for changing the proportions of curing agent, toughening agent and curing accelerator used in Embodiment 1, the same method as in Embodiment 1 was used in this embodiment to manufacture a thermally conductive adhesive film.

[0038] 1. First, 5 parts of dicyandiamide and 0.05 part of promotor (2-MI) are dissolved in 100 parts of solvent by weight (dimethylformamide (DMF) and butanone (MEK) mixed solvent (1: 1)), stir well until the curing agent is completely dissolved.

[0039] 2. Add 30 parts by weight of a toughening agent (phenolic resin: polyvinyl butyral: nitrile rubber: 1:0.65:0.35) to the above solution, and stir until it is completely dissolved.

[0040] 3. Add the halogen-free epoxy resin (resin A: resin B is 1:0.4), silane coupling agent and ceramic powder in order of 100 parts; 5 parts: 500 parts by solid weight ratio, and stir for more than 5 hours until Mix well and evenly to form a halogen-free high heat-resistant and heat-conducting glue system wi...

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Abstract

The invention discloses a halogen-free high heat-resistant and heat-conducting resin film and a manufacturing method thereof. The halogen-free high heat-resistant and heat-conducting resin film is prepared by semi-curing of a heat-conducting resin liquid, wherein the heat-conducting resin liquid is prepared from 70 to 100 parts of a halogen-free epoxy resin, 0 to 30 parts of one or more flexibilizers, 80 to 120 parts of one or more solvents, 1 to 20 parts of one or more curing agents, 0.01 to 1 part of one or more promoters, 0.5 to 5.0 parts of a coupling agent and 80 to 600 parts of one or more high heat-conducting filling materials. The halogen-free high heat-resistant and heat-conducting resin film has a thermal conductivity great than or equal to 2.5W / m.K and heat resistance (at a temperature of 300 DEG C) great than or equal to 300s. The halogen-free high heat-resistant and heat-conducting resin film has flexibility so that the problem of brittleness of the traditional heat-conducting materials is solved. An aluminum substrate prepared from the halogen-free high heat-resistant and heat-conducting resin film is suitable for electronic products such as LED, vehicle systems and variable-frequency power sources needing good heat conductivity, can greatly improve the thermal diffusivity of the electronic products, and has high reliability and energy-saving and environmental-protection effects.

Description

technical field [0001] The invention belongs to the technical field of manufacturing high thermal conductivity adhesive film materials, and in particular relates to a halogen-free thermal conductive adhesive film material with high heat resistance and a manufacturing method thereof. Background technique [0002] With the rapid development of electronics and electrical technology, people's demand for electronic products is increasing, and the requirements for electronic products are also getting higher and higher, especially as LEDs enter people's lives as lighting devices. The heat dissipation performance requirements of circuit boards are also getting higher and higher. Therefore, some aluminum-based circuit boards with high heat dissipation performance are welcomed by the market. The structure of the aluminum base plate currently on the market is basically formed by laying a layer of heat-conducting insulating sheet on the aluminum plate, which can play the role of heat c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/08C09J7/02
Inventor 沈宗华董辉蒋伟应雄峰
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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