Graphene enhanced aluminium-based silicon carbide composite, preparation method and application thereof

A technology of aluminum-based silicon carbide and composite materials, which is applied in the direction of electrical components, circuits, and electrical solid devices, can solve the problems of uneven mixing, large surface, and uneven distribution of reinforcement phases, and achieve good thermal conductivity and reduce packaging quality. , the effect of improving reliability

Active Publication Date: 2017-04-26
BEIJING BAOHANG ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the advantages of simple forming and no need for subsequent complicated mechanical processing, but there are problems such as uneven distribution of reinforcement phases and pore defects, which lead to anisotropy of material properties, large surface, uncontrollable volume addition of silicon carbide and other enhancements. Defects such as phase (e.g. graphene) content
Moreover, the method prepares graph

Method used

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  • Graphene enhanced aluminium-based silicon carbide composite, preparation method and application thereof
  • Graphene enhanced aluminium-based silicon carbide composite, preparation method and application thereof
  • Graphene enhanced aluminium-based silicon carbide composite, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Example 1 Preparation of Graphene Reinforced AlSiC Composites for Electronic Packaging

[0071] The composition of the graphene-enhanced aluminum silicon carbide electronic packaging composite material is:

[0072]

[0073]

[0074] The preparation method of graphene reinforced phase aluminum silicon carbide electronic packaging composite material comprises the following steps:

[0075] 1. Uniformly disperse 1000g graphene into 1000ml absolute ethanol solution by ultrasonic (ultrasonic frequency 50Hz, ultrasonic 40min) to prepare graphene ethanol dispersion;

[0076] 2. Weigh 1.4kg of aluminum alloy powder and 1.3kg of silicon carbide, put them into the mixer in turn, mix at 500rpm for 30min; mix at 850rpm for 1h, and obtain a homogeneously mixed aluminum-silicon carbide powder;

[0077]3. Under the condition of 900rpm, atomize and spray 30ml of graphene ethanol dispersion into the prepared aluminum silicon carbide uniform mixed powder, and then mix at 900rpm f...

Embodiment 2

[0082] Example 2 Preparation of Graphene Reinforced AlSiC Composites for Electronic Packaging

[0083] The composition of the graphene-enhanced aluminum silicon carbide electronic packaging composite material is:

[0084]

[0085]

[0086] The preparation method of graphene reinforced phase aluminum silicon carbide electronic packaging composite material comprises the following steps:

[0087] 1. Uniformly disperse 1000g graphene into 1000ml absolute ethanol solution by ultrasonic (ultrasonic frequency 70Hz, ultrasonic 35min) to prepare graphene ethanol dispersion;

[0088] 2. Weigh 1.3kg of aluminum alloy powder and 1.65kg of silicon carbide, put them into the mixer in turn, mix at 600rpm for 1h; after mixing at 950rpm for 2h, a uniform aluminum-silicon carbide mixed powder is obtained;

[0089] 3. Under the condition of 950rpm, atomize and spray 45ml of graphene ethanol dispersion into the prepared aluminum silicon carbide uniform mixed powder, and then mix for 2 h...

Embodiment 3

[0093] Example 3 Preparation of Graphene Reinforced AlSiC Composites for Electronic Packaging

[0094] The composition of the graphene-enhanced aluminum silicon carbide electronic packaging composite material is:

[0095]

[0096] The preparation method of graphene reinforced phase aluminum silicon carbide electronic packaging composite material comprises the following steps:

[0097] 1. Uniformly disperse 1000g graphene into 1000ml absolute ethanol solution by ultrasonic (ultrasonic frequency 80Hz, ultrasonic 35min) to prepare graphene ethanol dispersion;

[0098] 2. Weigh 1kg of aluminum alloy powder and 1.95kg of silicon carbide, put them into the mixer in turn, mix at 600rpm for 1h; after mixing at 1000rpm for 2h, a homogeneously mixed aluminum-silicon carbide powder is obtained;

[0099] 3. Under the condition of 1000rpm, atomize and spray 30ml of graphene ethanol dispersion into the prepared aluminum silicon carbide uniform mixed powder, and then mix at 1000rpm fo...

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Abstract

The invention relates to a graphene enhanced aluminium-based silicon carbide composite and a preparation method thereof. The composite comprises the following substances by volume percent: 40% to 70% of silicon carbide and 0.5% to 5% of graphene, and the balance being aluminium alloy. The composite is prepared through the powder metallurgy method and is obtained through the steps of blending, powder mixing, bagging, vacuum degassing and hot iso-hydrostatic forming treatment. The composite has the advantages of high thermal conductivity, high strength, high plasticity, light weight, good thermal diffusivity, isotropy, and the like, and becomes a second-generation electronic packaging material with wide application.

Description

technical field [0001] The invention relates to a graphene-reinforced aluminum-based silicon carbide composite material, a preparation method and an application thereof. Background technique [0002] The first generation of electronic packaging materials includes Cu, Al, Kovar alloy, Invar alloy, W, Mo alloy, etc. These materials usually have outstanding performance in some aspects, but there are many defects in their comprehensive performance. Kovar alloy has a low coefficient of thermal expansion and good processability, but its thermal conductivity is poor. The thermal expansion coefficient and thermal conductivity of Cu / Mo alloy and Cu / W alloy are relatively ideal, but their density is relatively high, and their machinability is not good. [0003] The thermal expansion coefficient of aluminum silicon carbide composite material (Al / SiC composite material) is 8~12×10 -6 K -1 , the thermal conductivity is as high as 170W / (m·K), which has a very high market potential val...

Claims

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Application Information

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IPC IPC(8): C22C29/06C22C21/18C22C30/00C22C32/00B22F9/06H01L23/14H01L23/373
CPCC22C29/065B22F9/06C22C21/14C22C21/16C22C21/18C22C30/00C22C32/0047C22C32/0084H01L23/14H01L23/3736
Inventor 李振民刘干孟庆宇
Owner BEIJING BAOHANG ADVANCED MATERIALS CO LTD
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