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Wireless IC device

a wireless ic device and wireless technology, applied in the direction of protective material radiating elements, near-field systems using receivers, instruments, etc., can solve the problems of increasing the cost of the tag, increasing the design complexity of the tag, increasing the number of design parameters, etc., to facilitate the design the effect of reducing the size and cost of the wireless ic devi

Inactive Publication Date: 2009-10-22
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]To overcome the problems described above, preferred embodiments of the present invention reduce the size and cost of a wireless IC device and facilitate the design of the wireless IC device.

Problems solved by technology

However, the wireless IC tag disclosed in Japanese Unexamined Patent Application Publication No. 2005-244778 has the following problems.
Since matching design is performed at portions other than the matching portions, the number of design parameters is increased and the design complexity of the tag is increased.
Since the mounting position adjustment requires a long period of time and the manufacturing time for the tag therefore is increased, the cost of the tag is increased.

Method used

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first preferred embodiment

[0064]A wireless IC device according to the first preferred embodiment of the present invention will be described with reference to FIGS. 2A to 5. FIG. 2A is a cross-sectional view of a main portion of a wireless IC device according to the first preferred embodiment. FIG. 2B is a plan view of the main portion of the wireless IC device.

[0065]As illustrated in FIG. 2A, a wireless IC device 300 includes a wireless IC chip 1, a functional substrate 20, and a radiation plate 30. The wireless IC chip 1 is preferably a semiconductor chip including a signal processing circuit functioning as an RFID tag, for example.

[0066]The radiation plate 30 includes radiation electrodes 32a and 32b provided on the upper surface of a base material 31, such as a PET film, for example.

[0067]The functional substrate 20 includes a multilayer substrate 21. On the upper surface of the multilayer substrate 21, mounting electrodes 22a and 22b arranged to mount the wireless IC chip 1 are disposed. In the multilaye...

second preferred embodiment

[0081]FIG. 6 is a plan view illustrating an electrode pattern of a main portion on the upper surface of a radiation plate in a wireless IC device according to the second preferred embodiment of the present invention. On the upper surface of the radiation plate, the long radiation electrodes 32a and 32b and a matching electrode 34 are provided. The matching electrode 34 connects a portion of the radiation electrode 32a apart from the internal end of the radiation electrode 32a by a predetermined distance to a portion of the radiation electrode 32b apart from the internal end of the radiation electrode 32b by the predetermined distance.

[0082]As in the case illustrated in FIG. 2B, near the internal ends of the radiation electrodes 32a and 32, the functional substrate 20 is arranged so that the capacitive coupling electrodes 24a and 24b included in the functional substrate 20 face the internal ends of the radiation electrodes 32a and 32b, respectively. The illustration of the wireless I...

third preferred embodiment

[0084]FIG. 7 is a plan view illustrating an electrode pattern of a main portion on an upper surface of a radiation plate in a wireless IC device according to the third preferred embodiment of the preferred embodiment. On the upper surface of the radiation plate, a loop-shaped radiation electrode 36 is provided. The loop-shaped radiation electrode 36 is preferably arranged so that both ends thereof face each other and it surrounds a predetermined area. The functional substrate 20 is mounted on the radiation plate so that one end of the loop-shaped radiation electrode 36 faces the capacitive coupling electrode 24a included in the functional substrate 20 and the other end of the loop-shaped radiation electrode 36 faces the capacitive coupling electrode 24b included in the functional substrate 20.

[0085]As in the first and second preferred embodiments, a module is obtained by mounting the wireless IC chip on the functional substrate 20. The configuration of the functional substrate 20 ac...

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Abstract

An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a wireless IC device used for an RFID (Radio Frequency Identification) system for performing wireless data communication using electromagnetic waves.[0003]2. Description of the Related Art[0004]Recently, as a product management system, an RFID system has been used in which a reader / writer arranged to generate an induction field communicates with a wireless IC device attached to a product in a wireless manner so as to obtain predetermined information stored in the wireless IC device.[0005]FIG. 1 is a diagram illustrating an example of a wireless IC tag (RFID tag) disclosed in Japanese Unexamined Patent Application Publication No. 2005-244778 in which an IC tag label is attached to an IC tag antenna.[0006]In a wireless IC tag TO, a pair of main antenna elements 81, an auxiliary antenna element 82, and a pair of matching portions 83 are provided on the surface of a dielectric substrate 84.[...

Claims

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Application Information

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IPC IPC(8): H01Q1/50
CPCG06K19/07749H01Q1/2225H01Q1/40H01Q7/00G06K19/073H01Q9/20H04B5/0012G06K19/0723H01Q9/16H01L2224/16225H01L2224/73204H01L2224/32225H01L2924/19105H04B5/22H01L2924/00G06K19/07H04B5/48G06K19/07756
Inventor IKEMOTO, NOBUODOKAI, YUYAKATO, NOBORU
Owner MURATA MFG CO LTD
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