A method for coating a component and forming at least one cooling hole in a component is provided. The method includes providing the component having a surface and including a plurality of apertures formed therein. The method includes masking at least one of the plurality of apertures with a plug comprising a removable material. The method includes applying at least one coating to the surface of the component. The method includes eliminating the plug including removable material leaving open apertures in the surface of the coated component. Also provided is a water-soluble aperture plug including water soluble high temperature resistant filler materials including aluminum oxide, zirconium oxide, magnesium oxide, silicon dioxide, zircon, graphite, tungsten carbide, silicon carbide, silicon nitride, boron nitride, aluminum nitrides and binding agents and dispersants including phosphates, silicates, sugar, salt, gum, resin, polyvinyl alcohol (PVA), polyethylene glycol, and combinations thereof.