The present invention is a compound for forming a
metal-containing film, containing: at least one kind of
metal atom (a) selected from the group consisting of Ti, Zr, and Hf; and a polydentate ligand coordinated to the
metal atom (a), where the polydentate ligand is derived from a compound (b) having 1 to 50 carbon atoms, being substituted with a
fluorine atom, and containing one or more crosslinkable groups selected from a vinyl group, an allyl group, an allyloxy group, an ethynyl group, a
propargyl group, a propargyloxy group, an
epoxy group, an oxetanyl group, a
nitrile group, and a
vinylidene group. This can provide: a compound for forming a metal-containing film to be used for forming a metal-containing film that can contribute to the improvement of sensitivity while maintaining the LWR of the upper layer
resist; a composition for forming a metal-containing film, containing the compound; and a patterning process using the composition.