Treatment process for chemical nickel plating waste liquid in circuit board industry

A treatment process, chemical nickel technology, applied in the field of chemical nickel waste liquid treatment in the circuit board industry, can solve water eutrophication pollution, environmental pollution and other problems, achieve the effects of reducing pollution, considerable economic benefits, and reducing treatment costs

Inactive Publication Date: 2014-12-03
江西红板科技股份有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

Phosphorus is one of the main pollution factors that cause water eutrophication. If the phosphorus in the waste liquid is discharged without treatment, it will inevitably cause serious pollution to the environment and aggravate the occurrence of eutrophication pollution in the water body.

Method used

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  • Treatment process for chemical nickel plating waste liquid in circuit board industry

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Embodiment 1

[0038] Use waste liquid delivery pump 2 to extract 3000L containing Nickel waste liquid In the reaction tank 3, add sulfuric acid through the dispensing tank and the dosing metering pump 8 to adjust the pH to 3~4, then add ferrous sulfate 15KG, slowly add 27.5% hydrogen peroxide 100L at a speed of 2~3L / min to carry out the Fenton reaction to break the complex and Oxidize hypophosphite, after reacting for 2Hr, add 25KG ferrous sulfate solid to reduce excess hydrogen peroxide and increase flocculation effect. Add sodium hydroxide to adjust the pH to 9~10, add 3KG Na 2 Continue to adjust the pH to 11 after the S reaction for 30 min. After stirring and reacting for 20 minutes, add 250~300L of 0.2% PAM to precipitate and form obvious alum flocs. Close the agitator of the reaction tank 3, open the plate and frame filter press 5 and the pneumatic diaphragm pump 4 for solid-liquid separation, the filtrate flows into the pH callback intermediate tank 6, and then add sulfuric acid to...

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Abstract

The invention provides a treatment process for a chemical nickel plating waste liquid in the circuit board industry. The treatment process comprises the following steps: pumping the chemical nickel plating waste liquid in the circuit board industry into a reaction tank; sequentially adding sulfuric acid for acidifying; adding ferrous sulfate and hydrogen peroxide for Fenton oxidation complexation; adjusting the pH by sodium hydroxide; adding sodium sulfide for a coagu-flocculation reaction; finally, adding PAM until suspended solids are just flocculently separated; after acidification, advanced oxidation complexation, and flocculation, filter-pressing all the waste liquid by a plate-frame; collecting the filtrate and regulating the pH; and sequentially carrying out sand filtering and resin adsorption and discharging after reaching standard level. The treatment process provided by the invention can be used for effectively treating the chemical nickel plating waste liquid in the circuit board industry, so that the treatment cost and the standard-reaching difficulty of the waste liquid in an enterprise are reduced.

Description

technical field [0001] The invention relates to a treatment process of chemical nickel waste liquid in the circuit board industry, and is particularly suitable for the treatment process of chemical nickel waste liquid in the circuit board industry. Background technique [0002] Immersion nickel gold is a surface treatment process widely used in the circuit board industry. In this process, a layer of nickel is chemically plated on the copper surface of the circuit board, and then a layer of gold is deposited on the nickel. There are a large amount of organic matter such as nickel ions, sodium phosphite, sodium hypophosphite, pH buffers and stabilizers in the electroless nickel plating waste solution. When the electroless nickel plating solution ages and becomes waste electroless nickel plating solution, the waste solution still contains up to 2000~5000mg / L of nickel and 80000~200000mg / L of phosphorus. It has been confirmed that the heavy metal nickel has carcinogenic and sen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/04C02F11/12
Inventor 查红平何立发张昭君文伟峰刘长松
Owner 江西红板科技股份有限公司
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