Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

A composition, electroless nickel technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of economic efficiency and productivity deterioration of flexible printed circuit boards

Inactive Publication Date: 2010-06-30
SAMSUNG ELECTRO MECHANICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, since different surface treatments, that is, a double plating process of electroless nickel plating and direct gold plating should be performed on pad units and external connection units, there have been problems such as economy due to the complicated manufacturing process of flexible printed circuit boards. Problems of Efficiency and Productivity Deterioration

Method used

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  • Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
  • Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
  • Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof

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Embodiment Construction

[0060] Reference will now be made in detail to the embodiments of the present general inventive concept, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. The embodiments are described below in order to explain the present general inventive concept by referring to the figures.

[0061] Hereinafter, the electroless nickel plating solution composition according to the first embodiment of the present invention will be described in detail, but the present invention is not limited thereto.

[0062] The electroless nickel plating solution composition according to the first embodiment of the present invention may include a water-soluble nickel compound, a reducing agent, a complexing agent, and a vertical growth inducing agent.

[0063] Here, the water-soluble nickel compound is the main material to be plated on the substrate by precipitation (deposition). The water-soluble nickel compound may include a...

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Abstract

The present invention relates to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof, and more particularly, to an electroless nickel plating solution composition, a flexible printed circuit board and a manufacturing method thereof capable of simultaneously satisfying plating characteristics respectively required for a pad unit and external connection units of the flexible printed circuit board by forming a nickel plating layer having a vertical growth structure with the electroless nickel plating solution composition including a water-soluble nickel compound, a reducing agent, a complexing agent and a vertical growth inducer.

Description

[0001] References to related applications [0002] This application claims the benefit of Korean Patent Application No. 10-2008-0132036 filed in the Korean Intellectual Property Office on December 23, 2008, the disclosure of which is incorporated herein by reference. technical field [0003] The present invention relates to a kind of electroless nickel electroplating solution composition (electroless nickel plating solution composition, electroless nickel plating solution composition, electroless nickel plating solution composition), flexible printed circuit board and manufacturing method thereof, and more specifically relate to a A vertical growth inducer (vertical growth inducer) is used to form a nickel plating layer (nickel plating layer) with a vertical growth structure, which can simultaneously meet the respective requirements of the pad unit (pad unit) and the external connection unit of the flexible printed circuit board. Electroless nickel plating solution composition...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/34C23C18/36H05K1/11
CPCC23C18/34H05K3/244H05K1/118C23C18/32C23C18/16C23C18/54
Inventor 李哲敏全星郁杨德桭许卿进李永浩安东基
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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