33 results about "Double plating" patented technology

The invention relates to a method for preparing a diamond / copper composite material by combining an injection molding technology. The method comprises the steps of adopting a salt-bath plating technology for plating a layer of uniform Mo2C on a diamond surface so as to improve the wettability of diamond and copper, then adopting a chemical plating method for continuously plating the copper on a surface of the Mo2C layer, and controlling the thickness of a copper plating layer by controlling the Cu2+ content in a plating solution, so that double-plating Cu-Mo2C-Diamond powder with the copper-bearing volume fraction being 1 percent to 10 percents is prepared; then mixing the quantitative Cu-Mo2C-Diamond powder and a multi-polymer component paraffin base binder to form uniform feeding; afterpelletizing, achieving injection molding on an injection molding machine; and after enabling a preformed blank to pass through a solvent and to be subjected to thermal degreasing, pre-sintering at high temperature, carrying out a vacuum pressureless infiltration technology on the obtained blank, and permeating a copper liquid into a diamond framework through a capillary action of pores, so that adiamond / copper composite material part with high volume fraction is obtained. The method provided by the invention can be used for directly preparing the Diamond / Cu composite material part in a complicated shape, the diamond is high in volume fraction and uniform and compact in texture, and the diamond / copper composite material can be produced in batch and can be low in production cost.

The invention discloses a double-plating bonding copper wire of a three-layer structure. The innermost layer of the copper wire is a copper core formed due to the fact that trace metal elements are added to high-purity copper, the surface of the copper core is plated with a pure-palladium conductive layer, and the surface of the pure-palladium conductive layer is plated with a pure-gold conductive layer. The trace metal elements include tin, magnesium and aluminum.

The invention discloses a palladium-plated gold-plated double-plating bonding copper wire of a three-layer structure. The innermost layer is a copper core formed due to the fact that trace metal elements are added to high-purity copper, a pure-palladium conductive layer plates the surface of the copper core, and a pure-gold conductive layer plates the surface of the pure-palladium conductive layer. The trace metal elements include tin, magnesium and aluminum.

The invention relates to a double-plating steel belt and a plating process, which is especially suitable for plating perforated steel belts and punched steel belts for manufacturing electrodes. The invention aims to solve the technical problems of high cost and low corrosion resistance of a steel belt on which a pure nickel layer is plated. The double-plating steel belt of the invention is characterized in that a nickel iron alloy plating of 2-4mu m is plated on a substrate steel belt, and a nickel layer of 0.5-2mu m is plated on the nickel iron alloy plating. In the invention, the nickel iron alloy plating part is used for replacing the pure nickel layer, thus the cost is lower; and simultaneously, in the plating method of the invention, a mode of dropping ferrous sulfate into a plating solution is used for replenishing the Fe2<+> ions consumed in the plating process, and the area ratio of an iron plate to a nickel plate of an anode does not need to be controlled, thus the process maintenance is simple.

The invention discloses a palladium-plated gold-plated double-plating bonding copper wire of a three-layer structure. The innermost layer is a copper core formed due to the fact that trace metal elements are added to high-purity copper, a pure-palladium conductive layer plates the surface of the copper core, and a pure-gold conductive layer plates the surface of the pure-palladium conductive layer. The trace metal elements include tin, magnesium and aluminum.

The invention pertains to the field of metallic material and provides a method for sealing a sealed cover when SiCp / Al composite material is used as an encapsulation encloser and a cover plate. The method is applicable to the encapsulation enclosers of micro-electronics appliances such as a hybrid integrated circuit, a millimeter wave / micron wave integrated circuit and a multichip module in micro-electronics encapsulation. Double-layer plating is carried out on the surface of the SiCp / Al composite material; the SiCp / Al composite material encloser with a surface coating and the cover plate arewelded together by Sn based solder. The method not only reduces production cost greatly, but also solves the problem of difficulty in sealing and connection of the SiCp / Al composite material, thus paving the way for widely using the SiCp / Al composite material as the material of enclosers and cover plates by related metal encloser factories.

The invention discloses an iron-plated and platinum-plated double-plating-layer bonding copper wire, and relates to the technical field of bonding wires. The iron-plated and platinum-plated double-plating-layer bonding copper wire comprises a copper core material, and the iron plating layer is plated on the surface of the copper core material; and the platinum plating layer is plated on the surface of the iron plating layer. The surface of the copper core material is plated with an iron plating layer after being smelted and roughly stretched; a platinum plating layer is plated on the surface of the iron plating layer after medium stretching; and superfine stretching is performed to obtain the iron-plated and platinum-plated double-plating-layer bonding copper wire. Layer-by-layer stretching and layer-by-layer plating are adopted, the good final plastic deformation capacity is achieved, the iron-platinum double plating is consistent in deformation, uniform in surface, compact and complete in the pressure machining process, particularly, sufficient deformation during welding bonding is facilitated, and the breaking force and reliability are improved. Moreover, the ferromagnetic iron-platinum alloy layer at the joint of the double plating layers can play a role in shielding, so that the noise in the bonding wire is reduced. And meanwhile, the iron-plated platinum alloy layer protects the single crystal copper bonding wire and prevents the single crystal copper bonding wire from oxidation.

A method for preparing a diamond / copper composite material combined with 3D printing technology belongs to the field of diamond composite materials. The present invention adopts the salt bath coating technology to coat a layer of uniform Cr on the diamond surface. 7 C 3 Used to improve the wettability of diamond and copper, and then use the electroless plating method to continue on the Cr 7 C 3 Copper plating on the surface of the layer, by controlling the Cu in the plating solution 2+ content to control the thickness of the copper plating layer, thereby preparing a double-coated Cu-Cr 7 C 3 ‑Diamond powder. 3D printing technology is used to laser clad the double-coated diamond powder, and the copper-coated layer on the surface of the diamond particles is melted and bonded to each other to form a porous preform skeleton with a specific shape, and then put into the open-flap graphite mold to infiltrate copper through pressureless Liquid preparation of diamond / copper composite parts with complex shapes. This process can prepare composite materials with uniform structure and high density, and can also directly prepare diamond / copper composite parts with complex shapes, which solves the difficulty that diamond / copper composite materials are difficult to machine, and can be customized according to demand. .

The invention discloses a double-plating bonding copper wire of a three-layer structure. The innermost layer of the copper wire is a copper core formed due to the fact that trace metal elements are added to high-purity copper, the surface of the copper core is plated with a pure-palladium conductive layer, and the surface of the pure-palladium conductive layer is plated with a pure-gold conductive layer. The trace metal elements include tin, magnesium and aluminum.

The invention relates to FeCo alloy / CuO double-plating magnetic carbon fiber and a preparation method and application. FeCo alloy and Cu plating are successively electroplated on the surface of the pretreated continuous carbon fiber by use of the traditional electroplating means, CuO plating is formed after thermal oxidation, and columnar CuO with diameter of about 100 nm is formed on the surface. The electromagnetic parameters of the carbon fiber are improved through the alloy / oxide double-plating; the modified magnetic carbon fiber has high-frequency and high-strength microwave absorption performance, and has microwave loss of less than -10 dB at the frequency band from 2-18 GHz; and when the frequency is 9.6 GHz, the composite material with thickness of only 1.6 mm shows the maximum microwave absorption valve of -47.56 dB. The magnetic carbon fiber provided by the invention has uniform and dense magnetic double-plating, is simple in preparation process, high in production efficiency and excellent in microwave absorption performance, and can be used as a novel low-density microwave absorption material.

The invention provides a short-range zinc liquid electroplating line, the structure of which includes a fault alarm light, a flip side repair plate, a galvanized cover buckle, a short-range zinc liquid electroplating device, a support frame, an external power supply bar, and a row of transmission racks. The fault alarm light passes through It is installed on the upper left end of the top surface of the galvanized cover buckle in an embedded way, and the back of the short-range zinc bath electroplating device is welded to the support frame. The invention can directly carry out the electroplating process on the steel plate through the assembly line, and load the steel plate through the short-range double-plating mechanism for the steel plate , and use the weight of the steel plate itself to press down the plating solution guide mechanism with the assistance of the steel plate short-range double-plating mechanism, so that the plating solution guide mechanism that was originally in a closed state opens the outer delivery port and forms a zinc sheath on the surface of the steel plate , can directly replace the transfer operation of the mechanical arm, and use the original weight of the steel plate as the power element in the electroplating process, which can shorten the time required for the electroplating process.

Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (-SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one -S-, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.

A double-layer nickel-plating process for battery steel shells, comprising the following steps: a. pretreating the battery steel shells; b. performing primary electroplating on the surface of the pretreated battery steel shells to coat the upper half of the bright nickel coating; c. Secondary electroplating is performed on the steel case of the battery after the treatment in step b, and a bright nickel plating layer is plated, and the oxidation potential of the bright nickel plating layer is lower than that of the semi-bright nickel plating layer. The invention also discloses a battery steel case prepared by the above process. In the present invention, by plating a layer of sulfur-free semi-bright nickel coating on the current battery steel case, and then electroplating a layer of sulfur-containing bright coating. Since the potential of bright nickel containing sulfur is relatively negative, a potential difference is generated between bright nickel and semi-bright nickel to form a corroded primary battery. The bright nickel with higher sulfur content becomes the anode, the semi-bright nickel at the bottom becomes the cathode, and the bright nickel layer Corroded as a sacrificial coating, the corrosion rate of the corrosive medium to the iron substrate is delayed, and the corrosion resistance of the coating is significantly improved.

The invention provides a method for preparing diamond / copper composite material parts with high volume fraction. The method comprises the following steps: plating the surface of diamond with a uniform Mo2C layer by using a salt-bath plating technology to improve wettability of the diamond and copper; and then continuing copperizing the surface of the Mo2C layer by using a chemical plating method, and controlling the thickness of a copperizing layer by controlling the content of Cu2+ in a plating solution so as to prepare copper-containing double-plating-layer Cu-Mo2C-Diamond powder with the volume fraction of 30-50 vol.%. The Cu-Mo2C-Diamond powder is formed by an ultra-high-pressure cold pressing method, and Diamond / Cu composite material parts are prepared by a vacuum pressureless sintering method. The method has the advantages that the Diamond / Cu composite material parts with complicated shapes and high volume fractions of (50-70 vol. %) can be directly prepared, meanwhile, composite materials are uniform in structure and high in compactness, the Diamond / Cu composite material parts can be produced in batches, and the production cost is low.

A method for preparing diamond / copper composite materials combined with injection molding technology, using salt bath plating technology to coat a layer of uniform Mo on the diamond surface 2 C is used to improve the wettability of diamond and copper, and then the electroless plating method is used to continue on the Mo 2 Copper plating on the surface of layer C, by controlling Cu in the plating solution 2+ content to control the thickness of the copper plating layer, thereby preparing a double-coated Cu-Mo with a copper volume fraction of 1% to 10%. 2 C‑Diamond Powder. Quantitative Cu‑Mo 2 C‑Diamond powder is mixed with a multi-polymer component paraffin-based binder to form a uniform feed. After granulation, it is injection-molded on an injection molding machine. The resulting preform is pre-sintered at a high temperature after solvent and thermal degreasing to obtain The blank is infiltrated into the diamond skeleton through the capillary action of the copper liquid through the vacuum pressureless infiltration technology, so as to obtain a diamond / copper composite material part with a high volume fraction. The invention can directly prepare Diamond / Cu composite parts with complex shapes, has high diamond volume fraction, uniform and compact structure, can be produced in batches, and has low production cost.

The invention discloses a method for preparing a high-performance diamond / copper-based composite material. Aiming at the problems of poor wettability of copper and diamond, weak interface bonding, and easy occurrence of graphitization of diamond at high temperature, the invention adopts magnetron sputtering technology to prepare diamond The surface is uniformly plated with a layer of B or strong carbide elements Ti, Zr, Nb, Cr to improve its interface bonding strength, and then a layer of metal copper is sputtered with a thickness of 1-3 μm; Heat treatment at 500-700°C for 5-30min to make the coatings diffuse and react with each other to achieve metallurgical bonding; using selective laser melting (SLM) technology to sinter the copper alloy powder and the surface-modified diamond particles, extremely fast The cooling rate significantly refines the matrix alloy structure and improves the strength of the composite material. The surface modification of the double coating effectively avoids the graphitization of diamond under the high-energy laser beam; Spark plasma sintering (SPS) is used to further improve the density of the workpiece. ; Combined with aging heat treatment, the solid solution atoms are uniformly precipitated in the copper matrix, and the thermal conductivity and mechanical properties of the composite material are comprehensively improved.