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33 results about "Double plating" patented technology
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Developer-carrying member, and developing device and image forming apparatus including the member
InactiveUS6201942B1High accuracy of surface roughnessHigh hardnessShaft and bearingsElectrographic process apparatusWear resistantEngineering
A developer-carrying member to be installed in an electrophotographic developing device for carrying and conveying a developer along a surface thereof, is formed of a substrate, and an intermediate electroless plating layer and an electroplating layer disposed in this order on the substrate. As a result of the electroless and electro double plating layer structure, the developer-carrying member is provided with a wear-resistant surface which has an appropriate degree of roughness suitable for conveying the developer thereon and is yet free from minute projections and cracks undesirable from the viewpoint of continuous image forming performances.
Owner:CANON KK +1
Proton exchange membrane fuel cell stainless steel bipolar plate and modification method thereof
InactiveCN101710620AImprove corrosion resistanceLow priceCell electrodesLiquid/solution decomposition chemical coatingElectrical resistance and conductanceElectroless deposition
The invention relates to an improvement on a surface property of a proton exchange membrane fuel cell metal bipolar plate, which is characterized in that: a substrate surface is plated with a nickel layer and a Ni-Cu-P double-plating layer, wherein Ni-Cu-P adopts electroless deposition. The improvement not only greatly reduces contact resistance of the bipolar plate and a gas diffusion layer, but also improves corrosion resistant. Electrical conductivity and the corrosion resistance can basically reach the level of those of the stainless steel bipolar plate plated with precious metal. The improvement is simple in modification, low in cost and superior in performance after modification.
Owner:江苏新源动力有限公司
FeCo alloy/CuO double-plating magnetic carbon fiber and preparation method and application
InactiveCN102154816AImprove electromagnetic parametersReduce reflectionOther chemical processesCarbon fibresFiberCarbon fibers
The invention relates to FeCo alloy / CuO double-plating magnetic carbon fiber and a preparation method and application. FeCo alloy and Cu plating are successively electroplated on the surface of the pretreated continuous carbon fiber by use of the traditional electroplating means, CuO plating is formed after thermal oxidation, and columnar CuO with diameter of about 100 nm is formed on the surface. The electromagnetic parameters of the carbon fiber are improved through the alloy / oxide double-plating; the modified magnetic carbon fiber has high-frequency and high-strength microwave absorption performance, and has microwave loss of less than -10 dB at the frequency band from 2-18 GHz; and when the frequency is 9.6 GHz, the composite material with thickness of only 1.6 mm shows the maximum microwave absorption valve of -47.56 dB. The magnetic carbon fiber provided by the invention has uniform and dense magnetic double-plating, is simple in preparation process, high in production efficiency and excellent in microwave absorption performance, and can be used as a novel low-density microwave absorption material.
Owner:江苏飞荣达新材料科技有限公司
Method for preparing diamond/copper composite material by combining injection molding technology
ActiveCN107855533AHigh densityVolume fraction adjustmentTransportation and packagingMetal-working apparatusChemical platingCopper plating
The invention relates to a method for preparing a diamond / copper composite material by combining an injection molding technology. The method comprises the steps of adopting a salt-bath plating technology for plating a layer of uniform Mo2C on a diamond surface so as to improve the wettability of diamond and copper, then adopting a chemical plating method for continuously plating the copper on a surface of the Mo2C layer, and controlling the thickness of a copper plating layer by controlling the Cu2+ content in a plating solution, so that double-plating Cu-Mo2C-Diamond powder with the copper-bearing volume fraction being 1 percent to 10 percents is prepared; then mixing the quantitative Cu-Mo2C-Diamond powder and a multi-polymer component paraffin base binder to form uniform feeding; afterpelletizing, achieving injection molding on an injection molding machine; and after enabling a preformed blank to pass through a solvent and to be subjected to thermal degreasing, pre-sintering at high temperature, carrying out a vacuum pressureless infiltration technology on the obtained blank, and permeating a copper liquid into a diamond framework through a capillary action of pores, so that adiamond / copper composite material part with high volume fraction is obtained. The method provided by the invention can be used for directly preparing the Diamond / Cu composite material part in a complicated shape, the diamond is high in volume fraction and uniform and compact in texture, and the diamond / copper composite material can be produced in batch and can be low in production cost.
Owner:UNIV OF SCI & TECH BEIJING
Method for preparing diamond/copper composite material by combining 3D printing technology
ActiveCN107900327AImprove wettabilityNot easy to overcomeAdditive manufacturing apparatusTransportation and packagingChemical platingCopper plating
The invention provides a method for preparing a diamond / copper composite material by combining a 3D printing technology and belongs to the field of diamond composite materials. Through a salt bath plating technology, a layer of even Cr7C3 is plated on the surface of diamond so as to improve the wettability of diamond and copper, then copper plating continues to be conducted on the surface of the Cr7C3 layer through a chemical plating mode, the thickness of a copper plating layer is controlled by controlling the content of Cu<2+> in a plating solution, and thus double-plating-layer Cu-Cr7C3-Diamond powder is prepared. Through the 3D printing technology, the double-plating-layer diamond powder is subjected to laser cladding, the copper-plated layer on the surfaces of diamond particles is melted to be mutually stuck to form a porous prefabricated blank skeleton with a specific shape, and then the porous prefabricated blank skeleton is placed into a split graphite mold to be prepared intoa diamond / copper composite material part with a complex shape through pressureless infiltration of a copper solution. According to the method for preparing the diamond / copper composite material by combining the 3D printing technology, the composite material with the even structure and high compactness can be prepared, the diamond / copper composite material part with the complex shape can further bedirectly prepared, the difficulty that a diamond / copper composite material is hard to machine is overcome, and customized production can be conducted according to the requirement.
Owner:UNIV OF SCI & TECH BEIJING
Double-plating steel belt and plating process
The invention relates to a double-plating steel belt and a plating process, which is especially suitable for plating perforated steel belts and punched steel belts for manufacturing electrodes. The invention aims to solve the technical problems of high cost and low corrosion resistance of a steel belt on which a pure nickel layer is plated. The double-plating steel belt of the invention is characterized in that a nickel iron alloy plating of 2-4mu m is plated on a substrate steel belt, and a nickel layer of 0.5-2mu m is plated on the nickel iron alloy plating. In the invention, the nickel iron alloy plating part is used for replacing the pure nickel layer, thus the cost is lower; and simultaneously, in the plating method of the invention, a mode of dropping ferrous sulfate into a plating solution is used for replenishing the Fe2<+> ions consumed in the plating process, and the area ratio of an iron plate to a nickel plate of an anode does not need to be controlled, thus the process maintenance is simple.
Owner:SICHUAN CHANGHONG ELECTRIC CO LTD
Method of laser cladding copper-based diamond particle reinforced composite coating on copper alloy surface
InactiveCN111424270AInhibit the degree of graphitizationQuality improvementLiquid/solution decomposition chemical coatingAlloy substrateMetallic materials
The invention belongs to the field of metal material surface modification, and discloses a method of preparing a copper-based diamond particle reinforced composite coating using a laser cladding technology on copper and copper alloy surfaces. The method comprises the following steps of sequentially plating metal chromium and silver on the surface of a diamond particle to form a chromium / silver double-coated diamond particle; mixing the chromium / silver double-coated diamond particle and red copper powder to prepare diamond / red copper mixed powder; laying the diamond / red copper mixed powder on acopper alloy substrate, then laying the red copper powder, and carrying out sintering and curing molding; and then using a laser cladding method to melt the pre-placed diamond / red copper mixed powder, and forming the copper-based diamond particle reinforced composite coating after solidification. According to the method of preparing the copper-based diamond particle reinforced composite coating using the laser cladding technology on the copper and copper alloy surfaces provided by the invention, the diamond particles are pretreated by the double plating layer, the structural damage of the diamond particles in machining is effectively avoided, and meanwhile, the bonding problem of the diamond and a copper matrix is solved.
Owner:SHANGHAI JIAO TONG UNIV
Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire
InactiveCN103219249ASemiconductor/solid-state device detailsSolid-state devicesMinor metalsCopper wire
The invention discloses a double-plating bonding copper wire of a three-layer structure. The innermost layer of the copper wire is a copper core formed due to the fact that trace metal elements are added to high-purity copper, the surface of the copper core is plated with a pure-palladium conductive layer, and the surface of the pure-palladium conductive layer is plated with a pure-gold conductive layer. The trace metal elements include tin, magnesium and aluminum.
Owner:溧阳市虹翔机械制造有限公司
Method for preparing diamond/copper composite material parts with high volume fraction
ActiveCN106583735AVolume fraction adjustmentHigh densityLiquid/solution decomposition chemical coatingUltra high pressureChemical plating
The invention provides a method for preparing diamond / copper composite material parts with high volume fraction. The method comprises the following steps: plating the surface of diamond with a uniform Mo2C layer by using a salt-bath plating technology to improve wettability of the diamond and copper; and then continuing copperizing the surface of the Mo2C layer by using a chemical plating method, and controlling the thickness of a copperizing layer by controlling the content of Cu2+ in a plating solution so as to prepare copper-containing double-plating-layer Cu-Mo2C-Diamond powder with the volume fraction of 30-50 vol.%. The Cu-Mo2C-Diamond powder is formed by an ultra-high-pressure cold pressing method, and Diamond / Cu composite material parts are prepared by a vacuum pressureless sintering method. The method has the advantages that the Diamond / Cu composite material parts with complicated shapes and high volume fractions of (50-70 vol. %) can be directly prepared, meanwhile, composite materials are uniform in structure and high in compactness, the Diamond / Cu composite material parts can be produced in batches, and the production cost is low.
Owner:UNIV OF SCI & TECH BEIJING
Palladium-plated gold-plated double-plating bonding copper wire
The invention discloses a palladium-plated gold-plated double-plating bonding copper wire of a three-layer structure. The innermost layer is a copper core formed due to the fact that trace metal elements are added to high-purity copper, a pure-palladium conductive layer plates the surface of the copper core, and a pure-gold conductive layer plates the surface of the pure-palladium conductive layer. The trace metal elements include tin, magnesium and aluminum.
Owner:溧阳市虹翔机械制造有限公司
Double-plating steel belt and plating process
Owner:SICHUAN CHANGHONG ELECTRIC CO LTD
Alloy plating liquid for modular printed circuit board surface treatment
InactiveCN1477922ASimple processImprove productivityLiquid/solution decomposition chemical coatingConductive pattern reinforcementOrganic acidThio-
Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (-SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one -S-, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD +1
Preparation process for double plating layers capable of inhibiting growth of lead-free solder joint interface compound, of substrate
ActiveCN106480454AEasy to operateStable electroless plating processLiquid/solution decomposition chemical coatingSuperimposed coating processChemical platingChemical compound
The invention discloses a preparation process for double plating layers capable of inhibiting the growth of a lead-free solder joint interface compound, of a substrate. The double plating layers comprise a chemical plating Ni-W-P layer and an electroplating Cu layer. The chemical plating Ni-W-P layer comprises the following components in percentage by mass: 77-80% of Ni, 14-16% W and 6-7% of P, and the thickness of the plating layer is 3-10[mu]m; and the thickness of the electroplating Cu layer is 0.5-3[mu]m. The components of the Ni-W-P / Cu double plating layers prepared by the preparation process disclosed by the invention meet the use requirements of a barrier layer of a tin-based solder joint interface reaction in electronic packaging, and moreover, the plating layers are in close bonding with the substrate, smooth, uniform in thickness, and compact in structure. The preparation process disclosed by the invention has the advantages of being simple in process flow, easy to control process parameters, and the like; and the prepared Ni-W-P / Cu double plating layers have a quite effective inhibition effect on the growth of the tin-based solder joint interface compound.
Owner:NANCHANG UNIV
Novel short-range zinc liquid electroplating assembly line
The invention provides a novel short-range zinc liquid electroplating assembly line. The novel short-range zinc liquid electroplating assembly line structurally comprises a fault warning lamp, a turning and side trimming plate, a zinc-plated cover buckle, a short-range zinc liquid electroplating device, support frames, an external power strip and a rowed conveying frame, wherein the fault warninglamp is mounted at the upper left end of the top end surface of the zinc-plated cover buckle in an embedded mode; and the back of the short-range zinc liquid electroplating device is welded to the support frames. The assembly line is capable of directly carrying out the electroplating process of a steel plate, loading the steel plate by using a steel plate short-range double-plating mechanism, pressing a plating liquid guiding and conveying mechanism by using the self weight of the steel plate under the assistance of the steel plate short-range double-plating mechanism, enabling the plating liquid guiding and conveying mechanism which is in a sealed state originally to open an external conveying opening, and forming a zinc protection layer on the surface of the steel plate; a transferringoperation of a mechanical arm can be directly replaced; the original weight of the steel plate is used as a power element in the process of the electroplating process; and the time needed by the electroplating process can be shortened.
Owner:嘉兴市金鹰新材料股份有限公司
A palladium-plated gold-plated double-coated bonding copper wire
InactiveCN103219312BSemiconductor/solid-state device detailsSolid-state devicesCopper wireDouble bond
The invention discloses a palladium-plated gold-plated double-plating bonding copper wire of a three-layer structure. The innermost layer is a copper core formed due to the fact that trace metal elements are added to high-purity copper, a pure-palladium conductive layer plates the surface of the copper core, and a pure-gold conductive layer plates the surface of the pure-palladium conductive layer. The trace metal elements include tin, magnesium and aluminum.
Owner:溧阳市虹翔机械制造有限公司
Sealing-in method for packaging outer shell with aluminum silicon carbide
InactiveCN101293294BSimple and economical crafting systemSoldering apparatusSemiconductor/solid-state device manufacturingMetallic materialsMetal
The invention pertains to the field of metallic material and provides a method for sealing a sealed cover when SiCp / Al composite material is used as an encapsulation encloser and a cover plate. The method is applicable to the encapsulation enclosers of micro-electronics appliances such as a hybrid integrated circuit, a millimeter wave / micron wave integrated circuit and a multichip module in micro-electronics encapsulation. Double-layer plating is carried out on the surface of the SiCp / Al composite material; the SiCp / Al composite material encloser with a surface coating and the cover plate arewelded together by Sn based solder. The method not only reduces production cost greatly, but also solves the problem of difficulty in sealing and connection of the SiCp / Al composite material, thus paving the way for widely using the SiCp / Al composite material as the material of enclosers and cover plates by related metal encloser factories.
Owner:UNIV OF SCI & TECH BEIJING
Iron-plated and platinum-plated double-plating-layer bonding copper wire
InactiveCN111653541AUniform surfaceReduce noiseSemiconductor/solid-state device detailsVacuum evaporation coatingPlatinumCopper wire
The invention discloses an iron-plated and platinum-plated double-plating-layer bonding copper wire, and relates to the technical field of bonding wires. The iron-plated and platinum-plated double-plating-layer bonding copper wire comprises a copper core material, and the iron plating layer is plated on the surface of the copper core material; and the platinum plating layer is plated on the surface of the iron plating layer. The surface of the copper core material is plated with an iron plating layer after being smelted and roughly stretched; a platinum plating layer is plated on the surface of the iron plating layer after medium stretching; and superfine stretching is performed to obtain the iron-plated and platinum-plated double-plating-layer bonding copper wire. Layer-by-layer stretching and layer-by-layer plating are adopted, the good final plastic deformation capacity is achieved, the iron-platinum double plating is consistent in deformation, uniform in surface, compact and complete in the pressure machining process, particularly, sufficient deformation during welding bonding is facilitated, and the breaking force and reliability are improved. Moreover, the ferromagnetic iron-platinum alloy layer at the joint of the double plating layers can play a role in shielding, so that the noise in the bonding wire is reduced. And meanwhile, the iron-plated platinum alloy layer protects the single crystal copper bonding wire and prevents the single crystal copper bonding wire from oxidation.
Owner:南京微米电子产业研究院有限公司 +1
A method for preparing diamond/copper composite materials combined with 3D printing technology
ActiveCN107900327BHigh dimensional accuracyImprove performanceAdditive manufacturing apparatusTransportation and packagingCopper platingHigh density
Owner:UNIV OF SCI & TECH BEIJING
A kind of manufacturing method of palladium-plated gold-plated double-coated bonding copper wire
InactiveCN103219249BSemiconductor/solid-state device detailsSolid-state devicesCopper platingCopper wire
The invention discloses a double-plating bonding copper wire of a three-layer structure. The innermost layer of the copper wire is a copper core formed due to the fact that trace metal elements are added to high-purity copper, the surface of the copper core is plated with a pure-palladium conductive layer, and the surface of the pure-palladium conductive layer is plated with a pure-gold conductive layer. The trace metal elements include tin, magnesium and aluminum.
Owner:溧阳市虹翔机械制造有限公司
FeCo alloy/CuO double-plating magnetic carbon fiber and preparation method and application
InactiveCN102154816BImprove electromagnetic parametersReduce reflectionCarbon fibresFibre chemical featuresFiberCarbon fibers
The invention relates to FeCo alloy / CuO double-plating magnetic carbon fiber and a preparation method and application. FeCo alloy and Cu plating are successively electroplated on the surface of the pretreated continuous carbon fiber by use of the traditional electroplating means, CuO plating is formed after thermal oxidation, and columnar CuO with diameter of about 100 nm is formed on the surface. The electromagnetic parameters of the carbon fiber are improved through the alloy / oxide double-plating; the modified magnetic carbon fiber has high-frequency and high-strength microwave absorption performance, and has microwave loss of less than -10 dB at the frequency band from 2-18 GHz; and when the frequency is 9.6 GHz, the composite material with thickness of only 1.6 mm shows the maximum microwave absorption valve of -47.56 dB. The magnetic carbon fiber provided by the invention has uniform and dense magnetic double-plating, is simple in preparation process, high in production efficiency and excellent in microwave absorption performance, and can be used as a novel low-density microwave absorption material.
Owner:江苏飞荣达新材料科技有限公司
Palladium-plated silver-plated double-coated copper wire
InactiveCN103219311BOvercome the defect of poor ductilityLow production costSemiconductor/solid-state device detailsSolid-state devicesCopper wireDouble bond
The invention discloses a double-plating bonding copper wire of a three-layer structure. The innermost layer of the copper wire is a copper core formed due to the fact that trace metal elements are added to high-purity copper, a pure-palladium conductive layer plates the surface of the copper core, and a pure-silver conductive layer plates the surface of the pure-palladium conductive layer. The trace metal elements include tin, magnesium and aluminum.
Owner:溧阳市虹翔机械制造有限公司
Protection method of magnesium alloy workpiece for marine environment
PendingCN114525509AImprove pass rateImprove quality consistencyAnodisationPretreated surfacesMetal coatingMicro arc oxidation
The invention discloses a protection method of a magnesium alloy workpiece for a marine environment, which adopts double-layer protection of an inner layer and an outer layer, and comprises the steps of micro-arc oxidation, conductive paint coating, baking and curing, alkaline chemical nickel plating, acidic chemical nickel plating, sealing and drying, the inner layer adopts a micro-arc oxidation film which is firmly combined with a matrix, and the outer layer adopts a micro-arc oxidation film which is firmly combined with the matrix; the outer layer adopts double-layer nickel plating of a bottom plating layer and a surface plating layer, the bottom plating layer adopts alkaline chemical nickel plating and is plated on the inner layer, the combination is firm, the surface plating layer adopts acid chemical nickel plating and is plated on the bottom plating layer, sealing treatment is performed, the porosity is reduced, the surface is compact, and the finished product is silver gray in appearance, slightly yellow, high in percent of pass, good in quality consistency and free of bubbling or layering phenomenon; through a 200 DEG C thermal shock test, the magnesium alloy micro-arc oxidation film is continuous, uniform, complete and free of pulverization, looseness and scratches, through a 672 h neutral salt spray test, the protection grade Rp is not lower than 9 grade, and the technical bottleneck that the magnesium alloy micro-arc oxidation film is difficult to be plated with a metal coating is broken through.
Owner:CHINA ELECTRONICS TECH GRP CORP NO 14 RES INST
Drawing die for double-layer aluminum-plated plate
PendingCN114669663AGuaranteed stabilityPrecise positioningShaping toolsMetal working apparatusBi layerAlclad
Owner:滁州市康乾嘉业模具设备制造有限公司
A short-range zinc liquid electroplating line
Owner:嘉兴市金鹰新材料股份有限公司
Alloy plating liquid for modular printed circuit board surface treatment
InactiveCN1245856CSimple processImprove productivityLiquid/solution decomposition chemical coatingConductive pattern reinforcementOrganic acidThio-
Disclosed is an aqueous alloy plating solution for surface treatment of a modular PCB. The plating solution comprises 1-30 wt % of an organic acid having at least one sulfonic acid group (-SO3H), 0.1-20 wt % of a complexing agent, 0.1-15 wt % of a thio-compound having at least one -S-, 0.05-5 wt % of a water soluble gold compound, 0.001-1 wt % of a water soluble silver compound and 0.1-10 wt % of a sequestering agent, based upon the weight of the plating solution. According to this invention, all plating properties required for the modular PCB are obtained through a single plating process, instead of the conventional double plating process.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD +1
A double-layer nickel plating process for a battery steel shell and a battery steel shell obtained by the process
ActiveCN105506689BImprove corrosion resistanceSpeed up corrosionJackets/cases materialsMetallurgyElectrical battery
Owner:FUJIAN JINYANG TECH CO LTD
A method of preparing diamond/copper composite parts with high volume fraction
ActiveCN106583735BVolume fraction adjustmentHigh densityLiquid/solution decomposition chemical coatingUltra high pressureChemical plating
The invention provides a method for preparing diamond / copper composite material parts with high volume fraction. The method comprises the following steps: plating the surface of diamond with a uniform Mo2C layer by using a salt-bath plating technology to improve wettability of the diamond and copper; and then continuing copperizing the surface of the Mo2C layer by using a chemical plating method, and controlling the thickness of a copperizing layer by controlling the content of Cu2+ in a plating solution so as to prepare copper-containing double-plating-layer Cu-Mo2C-Diamond powder with the volume fraction of 30-50 vol.%. The Cu-Mo2C-Diamond powder is formed by an ultra-high-pressure cold pressing method, and Diamond / Cu composite material parts are prepared by a vacuum pressureless sintering method. The method has the advantages that the Diamond / Cu composite material parts with complicated shapes and high volume fractions of (50-70 vol. %) can be directly prepared, meanwhile, composite materials are uniform in structure and high in compactness, the Diamond / Cu composite material parts can be produced in batches, and the production cost is low.
Owner:UNIV OF SCI & TECH BEIJING
Automatic electroplating device with adjustable single and double plating layers
The invention relates to the related field of industrial electroplating, and discloses an automatic electroplating device with adjustable single and double plating layers. The automatic electroplating device comprises a main box body, a transposition cavity is arranged in the main box body, the left side of the transposition cavity communicates with a transposition transmission cavity, and the left side of the transposition transmission cavity communicates with a transposition gear cavity; plate cavities in left-right symmetry are formed in the left side of the transposition gear cavity and the right side of the transposition cavity in a communicating mode, a motor transmission cavity is formed in the lower side of the transposition cavity, the position of a main contact block is changed through a timing knob to adjust the time needed by electroplating coating metal, a workpiece can be accurately taken out within the specified time, the situation that the coating of the workpiece is too little or too much is avoided, meanwhile, the electroplated workpiece is automatically placed and taken through a hanging rod on a telescopic rod, the electric shock risk caused by manual operation is avoided, on the other hand, the device can be directly switched between single-layer electroplating and double-layer electroplating by twisting a double-layer knob, and the tedious process of manual operation is avoided.
Owner:成都九叶草科技有限公司
A method for preparing diamond/copper composite material combined with injection molding technology
ActiveCN107855533BHigh densityVolume fraction adjustmentTransportation and packagingMetal-working apparatusCopper platingChemical plating
Owner:UNIV OF SCI & TECH BEIJING
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